TWI529231B - 用於切割積層陶瓷片體之熱剝離壓感貼片及積層陶瓷片體之切割處理方法 - Google Patents

用於切割積層陶瓷片體之熱剝離壓感貼片及積層陶瓷片體之切割處理方法 Download PDF

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Publication number
TWI529231B
TWI529231B TW099106306A TW99106306A TWI529231B TW I529231 B TWI529231 B TW I529231B TW 099106306 A TW099106306 A TW 099106306A TW 99106306 A TW99106306 A TW 99106306A TW I529231 B TWI529231 B TW I529231B
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TW
Taiwan
Prior art keywords
sensitive adhesive
pressure
heat
adhesive layer
peeling
Prior art date
Application number
TW099106306A
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English (en)
Chinese (zh)
Other versions
TW201038707A (en
Inventor
副島和樹
平山高正
下川大輔
佐藤正明
有滿幸生
Original Assignee
日東電工股份有限公司
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Publication of TW201038707A publication Critical patent/TW201038707A/zh
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Publication of TWI529231B publication Critical patent/TWI529231B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW099106306A 2009-03-04 2010-03-04 用於切割積層陶瓷片體之熱剝離壓感貼片及積層陶瓷片體之切割處理方法 TWI529231B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050032 2009-03-04

Publications (2)

Publication Number Publication Date
TW201038707A TW201038707A (en) 2010-11-01
TWI529231B true TWI529231B (zh) 2016-04-11

Family

ID=42677184

Family Applications (1)

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TW099106306A TWI529231B (zh) 2009-03-04 2010-03-04 用於切割積層陶瓷片體之熱剝離壓感貼片及積層陶瓷片體之切割處理方法

Country Status (4)

Country Link
US (1) US8524361B2 (enExample)
JP (1) JP5572418B2 (enExample)
CN (1) CN101824283B (enExample)
TW (1) TWI529231B (enExample)

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JP5456431B2 (ja) * 2009-10-20 2014-03-26 日東電工株式会社 加熱剥離型粘着シート
CN102019737B (zh) * 2010-09-30 2014-02-19 南亚塑胶工业股份有限公司 一种水性热发泡粘合胶板
JP2012117041A (ja) * 2010-11-12 2012-06-21 Nitto Denko Corp 粘着剤組成物、粘着剤層、及び、粘着テープ又はシート
JP2012193317A (ja) * 2011-03-17 2012-10-11 Nitto Denko Corp 電子部品仮固定用粘着テープ
JP2013147541A (ja) * 2012-01-17 2013-08-01 Nitto Denko Corp 粘着剤用ポリマー、粘着剤組成物及び熱剥離性粘着シート
WO2013187183A1 (ja) * 2012-06-15 2013-12-19 株式会社村田製作所 導電性ペースト、ならびに積層セラミック電子部品およびその製造方法
JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
JP2015021082A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 電子部品切断用熱剥離型粘着テープおよび電子部品の切断方法
JP6418872B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 配線基板製造工程用バックアップフィルム
EP3281971B1 (en) * 2015-03-17 2019-08-14 Zeon Corporation Self-adsorbing foam sheet
JP6595216B2 (ja) * 2015-06-04 2019-10-23 ニッタ株式会社 感温性粘着テープ
CN105199659B (zh) * 2015-10-15 2018-03-20 烟台德邦科技有限公司 一种晶圆减薄临时粘接光固化胶粘剂
EP3450519A4 (en) * 2016-04-28 2020-04-22 Zeon Corporation SELF-ADHESIVE LAYER
BR112018070435A2 (pt) * 2016-04-28 2019-02-05 Zeon Corp camada autoadesiva
JP6712916B2 (ja) * 2016-07-11 2020-06-24 日東電工株式会社 粘着シート
CN109641433B (zh) * 2016-09-16 2021-05-14 日本瑞翁株式会社 层叠片及其制造方法
JP6768038B2 (ja) * 2018-07-26 2020-10-14 日東電工株式会社 粘着シート
CN109280497A (zh) * 2018-09-03 2019-01-29 嘉善欣达胶业有限公司 一种阻燃植绒胶粘剂
US12221568B2 (en) * 2019-01-22 2025-02-11 Sekisui Chemical Co., Ltd. Adhesive tape and method for producing same
CN110184006B (zh) * 2019-06-21 2021-06-15 广东硕成科技有限公司 一种热剥离胶黏剂及其制备方法
CN110713811B (zh) * 2019-10-30 2021-04-13 浙江龙游道明光学有限公司 一种反光膜用高弹性压敏胶的制造方法
WO2023083248A1 (en) * 2021-11-11 2023-05-19 Ddp Specialty Electronic Materials Us, Llc Adhesive system
TW202432773A (zh) 2022-12-29 2024-08-16 日商Ｄｉｃ股份有限公司 吸附帶、物品、吸附帶的剝離方法、及零件的製造方法

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JPS5661468A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5661469A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Hot-bonding adhesive
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JP3897236B2 (ja) * 2001-11-26 2007-03-22 ソマール株式会社 再剥離性粘着シート
JP4063614B2 (ja) * 2002-08-30 2008-03-19 日東電工株式会社 再剥離用水分散型アクリル系粘着剤組成物及び粘着シート
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Also Published As

Publication number Publication date
TW201038707A (en) 2010-11-01
CN101824283A (zh) 2010-09-08
US20100224316A1 (en) 2010-09-09
JP2010229399A (ja) 2010-10-14
JP5572418B2 (ja) 2014-08-13
CN101824283B (zh) 2014-08-20
US8524361B2 (en) 2013-09-03

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