JP5563477B2 - 等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ - Google Patents
等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ Download PDFInfo
- Publication number
- JP5563477B2 JP5563477B2 JP2010539485A JP2010539485A JP5563477B2 JP 5563477 B2 JP5563477 B2 JP 5563477B2 JP 2010539485 A JP2010539485 A JP 2010539485A JP 2010539485 A JP2010539485 A JP 2010539485A JP 5563477 B2 JP5563477 B2 JP 5563477B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- adapter
- electrical connector
- main circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001971 elastomer Polymers 0.000 claims description 16
- 239000000806 elastomer Substances 0.000 claims description 16
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 description 14
- 230000008859 change Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Conductive Materials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
4 ピン
5 機械的圧迫構造体
5a ソケット
5b ピン
6 アダプタボード
7 端子領域
8 変形プリント回路(PC)ボード
9 等方性エラストマー材料
9a 端子領域
10 主回路ボード
11 端子領域
12 径路
Claims (3)
- アダプタボードと主回路ボードとの間を電気的に接続するための電気コネクタであって、
前記アダプタボードと前記主回路ボードとの間を電気的に接続する等方性の導電性エラストマーを有する相互接続媒体を備えており、
前記相互接続媒体が、前記アダプタボードおよび前記主回路ボードに対する接合面を有するように前記アダプタボードと前記主回路ボードとの間に配置されたプリント回路ボードとして形成され、該プリント回路ボードは、該プリント回路ボードの両面上にそれぞれ複数の端子領域が設けられ、前記プリント回路ボードの両面上のうち前記複数の端子領域上のみに等方性エラストマーを有するように変形されて、前記アダプタボードおよび前記主回路ボードに対する接合面上に自由に径路を設定するのを許容しながら、良好な電気的接触を確保することを特徴とする電気コネクタ。 - 前記複数の端子領域のそれぞれが、突出させられた端子領域として形成されていることを特徴とする請求項1記載の電気コネクタ。
- 試験回路が収容される空洞を有する機械的圧迫構造体をさらに備え、該構造体は、前記アダプタボード上の複数の端子領域に接続するための複数のピンを有して、前記試験回路のピンから前記アダプタボードへ、該アダプタボードから電気コネクタへ、および該電気コネクタから前記主回路ボードへの電気的接続を提供することを特徴とする請求項1または2記載の電気コネクタ。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US826207P | 2007-12-18 | 2007-12-18 | |
US61/008,262 | 2007-12-18 | ||
US927207P | 2007-12-27 | 2007-12-27 | |
US61/009,272 | 2007-12-27 | ||
US12/316,677 | 2008-12-16 | ||
US12/316,677 US7766667B2 (en) | 2007-12-18 | 2008-12-16 | Separable electrical connectors using isotropic conductive elastomer interconnect medium |
PCT/US2008/013842 WO2009082461A2 (en) | 2007-12-18 | 2008-12-17 | Separable electrical connectors using isotropic conductive elastomer interconnect medium |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011507212A JP2011507212A (ja) | 2011-03-03 |
JP5563477B2 true JP5563477B2 (ja) | 2014-07-30 |
Family
ID=40753851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010539485A Active JP5563477B2 (ja) | 2007-12-18 | 2008-12-17 | 等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ |
Country Status (7)
Country | Link |
---|---|
US (3) | US7766667B2 (ja) |
EP (1) | EP2225802A4 (ja) |
JP (1) | JP5563477B2 (ja) |
KR (1) | KR101262453B1 (ja) |
CN (1) | CN101919122B (ja) |
TW (1) | TWI462412B (ja) |
WO (1) | WO2009082461A2 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US20100276188A1 (en) * | 2009-05-04 | 2010-11-04 | Russell James V | Method and apparatus for improving power gain and loss for interconect configurations |
EP2478751A4 (en) * | 2009-09-15 | 2013-01-23 | R & D Circuits Inc | EMBEDDED COMPONENTS IN A INTERMEDIATE CARD FOR IMPROVED POWER GENERATION (DISTRIBUTION) AND REDUCED POWER LOSS (WEAKNESS) IN A NETWORK CONFIGURATION |
US8254142B2 (en) * | 2009-09-22 | 2012-08-28 | Wintec Industries, Inc. | Method of using conductive elastomer for electrical contacts in an assembly |
TW201117690A (en) * | 2009-09-22 | 2011-05-16 | Wintec Ind Inc | Method of using conductive elastomer for electrical contacts in an assembly |
US8593825B2 (en) * | 2009-10-14 | 2013-11-26 | Wintec Industries, Inc. | Apparatus and method for vertically-structured passive components |
US20110223780A1 (en) * | 2010-03-15 | 2011-09-15 | Russell James V | Electrical connector for connecting an adaptor board or electrical component to a main printed circuit board |
JP2012078222A (ja) * | 2010-10-01 | 2012-04-19 | Fujifilm Corp | 回路基板接続構造体および回路基板の接続方法 |
WO2012050739A1 (en) | 2010-10-12 | 2012-04-19 | Meadwestvaco Corporation | Reclosable one time security trap seal blister package |
JP5663379B2 (ja) * | 2011-04-11 | 2015-02-04 | 新光電気工業株式会社 | 接続端子構造及びソケット並びに電子部品パッケージ |
CN103094737A (zh) * | 2011-11-05 | 2013-05-08 | 宝宸(厦门)光学科技有限公司 | 引脚结构与引脚连接结构 |
TWI574473B (zh) * | 2012-06-07 | 2017-03-11 | 鴻海精密工業股份有限公司 | 電連接器組合 |
JP2013258044A (ja) * | 2012-06-12 | 2013-12-26 | Molex Inc | コネクタ |
US9742091B2 (en) * | 2014-04-11 | 2017-08-22 | R&D Sockets, Inc. | Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium |
JP2016170007A (ja) | 2015-03-12 | 2016-09-23 | 株式会社東芝 | 共通テストボード、ip評価ボード、及び半導体デバイスのテスト方法 |
JP2016178068A (ja) * | 2015-03-23 | 2016-10-06 | カシオ計算機株式会社 | コネクタおよび電子機器 |
JP6507056B2 (ja) * | 2015-07-24 | 2019-04-24 | 株式会社オートネットワーク技術研究所 | 電池配線モジュール |
KR20160001719A (ko) | 2015-09-11 | 2016-01-06 | 주식회사 대한아이엠 | 연약지반 개량을 위한 수직과 수평 배수재 시공방법 및 그 수평배수재의 부직포 |
CN106018890A (zh) * | 2016-08-10 | 2016-10-12 | 昆山兢美电子科技有限公司 | 一种飞针测试头后接板块 |
SG11201805911UA (en) * | 2016-09-02 | 2018-08-30 | R&D Circuits Inc | Method and structure for a 3d wire block |
KR20190091970A (ko) * | 2018-01-30 | 2019-08-07 | 주식회사 엘지화학 | 커넥터 피치 변경용 어댑터 및 그 제조 방법 |
JP2022139728A (ja) * | 2021-03-12 | 2022-09-26 | パナソニックIpマネジメント株式会社 | 基板間接続構造および電力変換装置 |
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JPS5870463A (ja) * | 1981-10-21 | 1983-04-26 | Hitachi Ltd | デイスクカセツト |
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-
2008
- 2008-12-16 US US12/316,677 patent/US7766667B2/en active Active
- 2008-12-17 CN CN200880121549.9A patent/CN101919122B/zh active Active
- 2008-12-17 WO PCT/US2008/013842 patent/WO2009082461A2/en active Application Filing
- 2008-12-17 KR KR1020107015693A patent/KR101262453B1/ko active IP Right Grant
- 2008-12-17 JP JP2010539485A patent/JP5563477B2/ja active Active
- 2008-12-17 EP EP08863567A patent/EP2225802A4/en not_active Withdrawn
- 2008-12-18 TW TW097149346A patent/TWI462412B/zh active
-
2010
- 2010-04-30 US US12/799,712 patent/US7931476B2/en active Active
-
2011
- 2011-02-03 US US12/931,518 patent/US8066517B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI462412B (zh) | 2014-11-21 |
US7931476B2 (en) | 2011-04-26 |
US8066517B2 (en) | 2011-11-29 |
TW200934018A (en) | 2009-08-01 |
CN101919122B (zh) | 2015-11-25 |
EP2225802A2 (en) | 2010-09-08 |
US20090156029A1 (en) | 2009-06-18 |
KR101262453B1 (ko) | 2013-06-25 |
US7766667B2 (en) | 2010-08-03 |
JP2011507212A (ja) | 2011-03-03 |
EP2225802A4 (en) | 2011-04-27 |
WO2009082461A3 (en) | 2009-08-20 |
US20110124207A1 (en) | 2011-05-26 |
KR20100105684A (ko) | 2010-09-29 |
CN101919122A (zh) | 2010-12-15 |
US20100216320A1 (en) | 2010-08-26 |
WO2009082461A2 (en) | 2009-07-02 |
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