M304111 八 新型說明： 【新型所屬之技術領域】 本新型疋有關於一種封裳元件之導接模組，特別是指 一種基地格柵陣列封裝元件之導接模組。 【先前技術】 目前的中央處理器有採取所謂的LGA(Land Gdd Array) 封裝方式取代傳統針腳式的封裝，lga縣料是在元件 底部佈設高密度的金屬接點，並藉由一固定機構與主機板 ^ ，、俊點疋·可在小面積裡佈植高密度的金屬接點、 λ號傳輸路徑縮小使訊號品質更佳等。 芬閱圖1，目前的基地格栅陣列封裝元件7是藉由一固 定Τ構8(LGA SGCket)與—電路板（PCB)9電性連接，基地格 冊p列封裝7L件7底部佈設高密度的金屬接點71。 固定機構8具有一殼體81及間隔地嵌設於殼體81中 =數導接件82,殼體81内形成有一容置空間81〇可供基 地秸柵陣列封裝元件7容設於其中。 列封！定機構81是先電性連接該電路板9，而基地格柵陣 】封衣-件7置入容置空間81〇後由固定機構❹以固定 貝1由於基地格柵陣列封裝元件7的金屬接點7 固定機構81的導接件82電性連接，㈣定機構81又1,M304111 VIII New Description: [New Technical Field] This new type is related to a guiding module for sealing components, and in particular to a guiding module for a base grid array package component. [Prior Art] The current central processing unit adopts the so-called LGA (Land Gdd Array) packaging method instead of the traditional pin type package. The lga county material is arranged with high-density metal contacts on the bottom of the element, and by a fixing mechanism and The motherboard ^, , Jun point 疋 · can plant high-density metal contacts in a small area, λ number transmission path is reduced to make the signal quality better. Referring to Figure 1, the current base grid array package component 7 is electrically connected to a circuit board (PCB) 9 by a fixed structure 8 (LGA SGCket), and the bottom of the base column p column package 7L is 7 Density of metal contacts 71. The fixing mechanism 8 has a housing 81 and a plurality of spacers 82 embedded in the housing 81. An accommodating space 81 is formed in the housing 81 for the base sash array package component 7 to be received therein. Sealed! The fixing mechanism 81 is electrically connected to the circuit board 9, and the base grid array sealing member 7 is placed in the accommodating space 81, and then fixed by the fixing mechanism to fix the shell 1 due to the metal of the base grid array package component 7. The connecting member 82 of the fixing mechanism 81 of the joint 7 is electrically connected, and (4) the fixed mechanism 81 is 1 again.
路板9電性連接，也@此基地格柵陣列封以件 I 路板9電氣導通。 /、电 然而’固定機構8除了固定功能的元件，亦需要在殼 a 81間隔地嵌設複數導接件82，製作上相當費工、費時， 5 M304111 且不易置換、檢修。 【新型内容】 因此，本新型之目的，即在提供一種製作較為省工、 容易置換及檢修的基地格柵陣列封裝元件之導接模組。The circuit board 9 is electrically connected, and the base grid array is also sealed by the I board 9 electrically. However, the fixing mechanism 8 requires a plurality of the guide members 82 to be interposed at intervals in the casing a 81 in addition to the components of the fixed function, which is laborious and time consuming to manufacture, and 5 M304111 is not easily replaced and inspected. [New Content] Therefore, the purpose of the present invention is to provide a conductive module for making a base grid array package component which is relatively labor-saving, easy to replace and repair.
於疋’本新型基地格柵陣列封裝元件之導接模組係供 該基地格柵陣列封裝元件與一電路板彼此電性連接，該導 接模組包含一間隔板及複數導接件，該間隔板具有一第一 表面、一第二表面及複數個貫穿第一、第二表面之貫孔； 各該導接件具有一導線及分別位於該導線二端的一第一端 子及一第二端子，各該導線對應設置於該等貫孔中，第一 端子係朝向該第一表面，第二端子係朝向該第二表面；其 特徵在於：該第一端子及該第二端子其中任一端子是一可 導電之彈性金屬複合物。 基地格柵陣列封裝元件之導接模組可供該基地袼柵陣 列封裝元件與主機板以無銲錫的方式組立，其功效是可使 安裝時更容易置換及檢修LGA相關組件。 【實施方式】 '有關本新型之前述及其他技術内容、特點與功效，在 '下配口苓考圖式之較佳實施例的詳細說明中 的呈現。 β疋 *閱圖2，本新型基地格柵陣列封裝元件2之導接模组 1係供-基地格栅陣列封裝元件2(如：中央處理器）鱼一、電 2 3(如：主機板）彼此電性連接，電路板3上設置有固定 4 ’固定機構4係提供導接模組】及基地格柵陣列封裝 方、第表面U0、第二表面120各佈設有電路元件及線路， 且藉由貫孔10上下連結。 各導接件12具有一導線123及分別位於該導線⑵二The guiding module of the base grid array package component of the present invention is configured to electrically connect the base grid array package component and a circuit board to each other, the guiding module comprises a spacer board and a plurality of guiding members, The spacer has a first surface, a second surface, and a plurality of through holes extending through the first and second surfaces. Each of the guiding members has a wire and a first terminal and a second terminal respectively located at the two ends of the wire Each of the wires is disposed in the through holes, the first terminal is facing the first surface, and the second terminal is facing the second surface; and the first terminal and the second terminal are any one of the terminals It is an electrically conductive elastic metal composite. The conductive module of the base grid array package component can be assembled in the solderless manner of the base grid array package component and the motherboard, and the utility model can make it easier to replace and repair the LGA related components during installation. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention are presented in the detailed description of the preferred embodiment of the <RTIgt; β疋* Read Figure 2, the guiding module 1 of the novel base grid array package component 2 is provided for the base grid array package component 2 (such as: central processing unit), the fish one, the electricity 2 3 (such as: the motherboard Electrically connected to each other, the circuit board 3 is provided with a fixed 4' fixing mechanism 4 to provide a guiding module] and the base grid array package side, the first surface U0, the second surface 120 are provided with circuit components and lines, and The through holes 10 are connected up and down. Each of the connecting members 12 has a wire 123 and is respectively located on the wire (2)
M304111 兀件2疋位於電路板3上，然而由於並非本新型創作重點 且為已知技術’不再贅述其原理。 導接模組1包含一間隔板u及複數導接件12 ;間隔板 11是以可形成導電線路之多層塑料或陶瓷材料製成，且間 隔板11具有一第-表® 110、-第二表面120及複數個貫 穿第一、第二表面110、120之貫孔10;另外，導接模組i 端的一第一端子121及-第二端子122,各導線123對應設 置=該等貫孔1G中，第—端子121係朝向該第—表面HO ’第二端子122係朝向該第二表面120。 簽閱圖3A，本較佳實施例中，導接件12的第一端子 121。及第二端子122均是一可導電之彈性金屬複合物，製成 该弹性金屬複合物之成分具有樹脂及金屬材料，且該彈性 金屬複合物是在一樹脂材質之本豸131外包覆有一或多層 金屬層叫或合金導電層），且本體131之成分也可在樹脂 材料中加入金屬粉末。 如圖3B及3C所示之較佳實施例，說明只要是二組端 子的其中任-端子為可導電之彈性金屬複合物，另一端子 可有不同形態的變化，亦屬於本新型概念涵蓋的範田壽。 如圖3B所示，第一端子m是該可導電之彈性金屬複 合物，而非可導電之彈性金屬複合物之第二端+ 122，是一 表面枯著金屬層。 M304111 如圖3C所示，第一端早Ί 9，θ # 乐而千12ι疋该可導電之彈性金屬複 合物’而非可導電之彈性金屬複合物之第二料122”是一 金屬球或一合金導電球。 歸納上述，本新型基地格柵陣列封裝元件2之導接模 組！的間隔板U是以可形成導電線路之多層塑料或陶究材 料製成，配合第-端子121或第二端+ 122是可導電之彈 性金屬複合物，具有下列優點：The M304111 component 2 is located on the circuit board 3. However, since it is not the focus of the present invention and is a known technique, the principle will not be described again. The guiding module 1 comprises a partition plate u and a plurality of connecting members 12; the partitioning plate 11 is made of a plurality of layers of plastic or ceramic material capable of forming conductive lines, and the partitioning plate 11 has a first table - 110, - second a surface 120 and a plurality of through holes 10 penetrating through the first and second surfaces 110 and 120; and a first terminal 121 and a second terminal 122 at the end of the conduction module i, corresponding to each of the wires 123 = the through holes In 1G, the first terminal 121 faces the second surface 120 toward the first surface HO' second terminal 122. Referring to Figure 3A, in the preferred embodiment, the first terminal 121 of the terminal member 12 is shown. And the second terminal 122 is an electrically conductive elastic metal composite, the component of the elastic metal composite is made of a resin and a metal material, and the elastic metal composite is coated with a resin material of the top 131 Or a plurality of metal layers or alloy conductive layers, and the composition of the body 131 may also be added with a metal powder in the resin material. 3B and 3C, it is explained that as long as the two terminals of the two sets of terminals are electrically conductive elastic metal composites, the other terminal may have different form changes, which is also covered by the novel concept. Fan Tianshou. As shown in Fig. 3B, the first terminal m is the electrically conductive elastic metal composite, and the second end + 122 of the non-conductive elastic metal composite is a surface with a metal layer. M304111, as shown in FIG. 3C, the first end is early, 9, θ#, and the second conductive material 122 of the electrically conductive elastic metal composite is a metal ball or An alloy conductive ball. In summary, the partition plate U of the novel base grid array package component 2 is made of a multi-layer plastic or ceramic material capable of forming a conductive line, with the first terminal 121 or the first The two ends + 122 are electrically conductive elastomeric composites with the following advantages:
1. 間隔板η是可形成導電線路之多層塑料或陶究材料 製成’因此不易撓曲且平面度較佳。 2. 該彈性金屬複合物是在樹脂材質之本體ΐ3ι外包覆金 屬層132,固定後金屬層132受壓可使接觸面積變大。 β 3.基地格柵陣列封裝元件2之導接模組u電路板3 是分離式設計，相較於先前技術製作上更為省工，且容易 置換及檢修。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請^利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 一圖1是一剖視示意圖，說明目前的基地袼柵陣列封裝 元件是藉由一固定機構與一電路板電性連接； 圖2是一剖視示意圖，說明本新型封裝元件之導接模 組的較佳實施例； 吴 圖3Α是一示意圖，說明本新型導接件的第一端子及第 M304111 二端子均是可導電之彈性金屬複合物； 圖3B是一示意圖，說明本新型導接件的第一端子是可 導電之彈性金屬複合物，第二端子是一表面粘著金屬層； 及 圖3C是一示意圖，說明本新型導接件的第一端子是可 導電之彈性金屬複合物’第二端子是一金屬球。 M304111 t主要元件符號說明】 1 · · •導接模組 123 · 導線 10 · •貫孔 131 · 樹脂材質之本體 11 · •間隔板 132 · 金屬層 110 · • 第一表面 2· · · 基地格栅陣列封 12 · •導接件 裝元件 120 · •第二表面 3· · · 電路板 121 · •第一端子 4 · · · 固定機構 122、 122、122，， • · ·第二端子 101. The spacer η is made of a multi-layer plastic or ceramic material that can form a conductive line. Therefore, it is less flexible and has better flatness. 2. The elastic metal composite is coated with a metal layer 132 on the body of the resin material, and the metal layer 132 is pressed to increase the contact area. β 3. The base module of the base grid array package component 2 is a separate design, which is more labor-saving than the prior art, and is easy to replace and repair. However, the above is only the preferred embodiment of the present invention, and the scope of the novel implementation cannot be limited thereto, that is, the simple equivalent change and modification of the novel application scope and the novel description content. , are still within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a current base grid array package component electrically connected to a circuit board by a fixing mechanism; FIG. 2 is a cross-sectional view showing the novel package A preferred embodiment of the component guiding module; FIG. 3A is a schematic view showing that the first terminal of the novel guiding member and the M304111 two terminals are electrically conductive elastic metal composites; FIG. 3B is a schematic view. The first terminal of the novel connecting member is an electrically conductive elastic metal composite, the second terminal is a surface adhered metal layer; and FIG. 3C is a schematic view showing that the first terminal of the novel connecting member is electrically conductive The second terminal of the elastic metal composite 'is a metal ball. M304111 t Main component symbol description] 1 · · • Conductor module 123 · Conductor 10 · • Through hole 131 · Resin body 11 · • Spacer 132 · Metal layer 110 · • First surface 2 · · · Base Grid array package 12 • • Conductor mounting component 120 • • Second surface 3 • • Circuit board 121 • • First terminal 4 • · · Fixing mechanism 122, 122, 122, • • • Second terminal 10