JP2011507212A - 等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ - Google Patents
等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ Download PDFInfo
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- JP2011507212A JP2011507212A JP2010539485A JP2010539485A JP2011507212A JP 2011507212 A JP2011507212 A JP 2011507212A JP 2010539485 A JP2010539485 A JP 2010539485A JP 2010539485 A JP2010539485 A JP 2010539485A JP 2011507212 A JP2011507212 A JP 2011507212A
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- JP
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- Prior art keywords
- board
- electrical connector
- main circuit
- circuit board
- terminal regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Conductive Materials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
4 ピン
5 機械的圧迫構造体
5a ソケット
5b ピン
6 アダプタボード
7 端子領域
8 変形プリント回路(PC)ボード
9 等方性エラストマー材料
9a 端子領域
10 主回路ボード
11 端子領域
12 径路
Claims (9)
- アダプタボードと主回路ボードとの間を電気的に接続するための電気コネクタであって、
前記アダプタボードと前記主回路ボードとの間を電気的に接続する等方性の導電性エラストマーを有する相互接続媒体を備えていることを特徴とする電気コネクタ。 - 前記相互接続媒体が、前記アダプタボードおよび前記主回路ボードに対する接合面を有するように前記アダプタボードと前記主回路ボードとの間に配置されたプリント回路ボードとして形成され、該プリント回路ボードは、該プリント回路ボードの両面上に等方性エラストマーを有するように変形されて、前記アダプタボードおよび前記主回路ボードの接合面上に自由に径路を設定するのを許容しながら、良好な電気的接触を確保することを特徴とする請求項1記載の電気コネクタ。
- 試験回路が収容される空洞を有する機械的圧迫構造体をさらに備え、該構造体は、前記アダプタボード上の複数の端子領域に接続するための複数のピンを有して、前記試験回路のピンから前記アダプタボードへ、該アダプタボードから電気コネクタへ、および該電気コネクタから前記主回路ボードへの電気的接続を提供することを特徴とする請求項1記載の電気コネクタ。
- 前記電気コネクタが、前記主回路ボードの複数の端子領域に対向する前記アダプタボードの面上の複数の端子領域として形成され、該アダプタボードの複数の端子領域が等方性エラストマー材料で覆われていることを特徴とする請求項1記載の電気コネクタ。
- 前記等方性エラストマー材料が等方性ペーストであることを特徴とする請求項4記載の電気コネクタ。
- 前記電気コネクタが、前記アダプタボードの複数の端子領域に対向する前記主回路の面上の複数の端子領域として形成され、該主回路の面上の複数の端子領域が等方性エラストマー材料で覆われていることを特徴とする請求項1記載の電気コネクタ。
- 前記等方性エラストマー材料が等方性ペーストであることを特徴とする請求項6記載の電気コネクタ。
- 前記アダプタボード上の複数の端子領域の上面から前記アダプタボードの下面の複数の端子領域への電気的接続を径路変更することによって、試験回路の複数のピンから前記アダプタボードの複数の端子領域および前記主回路ボードの複数の端子領域への電気的接続が径路変更されることを特徴とする請求項3記載の電気コネクタ。
- 前記主回路ボード上の複数の端子領域の上面から前記主回路ボードの下面の複数の端子領域への電気的接続を径路変更することによって、試験回路の複数のピンから前記アダプタボードの複数の端子領域および前記主回路ボードの複数の端子領域への電気的接続が径路変更されることを特徴とする請求項3記載の電気コネクタ。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US826207P | 2007-12-18 | 2007-12-18 | |
US61/008,262 | 2007-12-18 | ||
US927207P | 2007-12-27 | 2007-12-27 | |
US61/009,272 | 2007-12-27 | ||
US12/316,677 | 2008-12-16 | ||
US12/316,677 US7766667B2 (en) | 2007-12-18 | 2008-12-16 | Separable electrical connectors using isotropic conductive elastomer interconnect medium |
PCT/US2008/013842 WO2009082461A2 (en) | 2007-12-18 | 2008-12-17 | Separable electrical connectors using isotropic conductive elastomer interconnect medium |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011507212A true JP2011507212A (ja) | 2011-03-03 |
JP5563477B2 JP5563477B2 (ja) | 2014-07-30 |
Family
ID=40753851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010539485A Active JP5563477B2 (ja) | 2007-12-18 | 2008-12-17 | 等方性導電性エラストマー相互接続媒体を用いた分離可能な電気コネクタ |
Country Status (7)
Country | Link |
---|---|
US (3) | US7766667B2 (ja) |
EP (1) | EP2225802A4 (ja) |
JP (1) | JP5563477B2 (ja) |
KR (1) | KR101262453B1 (ja) |
CN (1) | CN101919122B (ja) |
TW (1) | TWI462412B (ja) |
WO (1) | WO2009082461A2 (ja) |
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US20100276188A1 (en) * | 2009-05-04 | 2010-11-04 | Russell James V | Method and apparatus for improving power gain and loss for interconect configurations |
JP2013504894A (ja) | 2009-09-15 | 2013-02-07 | アール アンド ディー サーキッツ インコーポレイテッド | 相互接続構造における電力利得(電力供給)及び電力損失(電力消費)を改善するインターポーザ基板の内蔵部品 |
TW201117690A (en) * | 2009-09-22 | 2011-05-16 | Wintec Ind Inc | Method of using conductive elastomer for electrical contacts in an assembly |
US8254142B2 (en) * | 2009-09-22 | 2012-08-28 | Wintec Industries, Inc. | Method of using conductive elastomer for electrical contacts in an assembly |
US8593825B2 (en) * | 2009-10-14 | 2013-11-26 | Wintec Industries, Inc. | Apparatus and method for vertically-structured passive components |
US20110223780A1 (en) * | 2010-03-15 | 2011-09-15 | Russell James V | Electrical connector for connecting an adaptor board or electrical component to a main printed circuit board |
JP2012078222A (ja) * | 2010-10-01 | 2012-04-19 | Fujifilm Corp | 回路基板接続構造体および回路基板の接続方法 |
WO2012050739A1 (en) | 2010-10-12 | 2012-04-19 | Meadwestvaco Corporation | Reclosable one time security trap seal blister package |
JP5663379B2 (ja) * | 2011-04-11 | 2015-02-04 | 新光電気工業株式会社 | 接続端子構造及びソケット並びに電子部品パッケージ |
CN103094737A (zh) * | 2011-11-05 | 2013-05-08 | 宝宸(厦门)光学科技有限公司 | 引脚结构与引脚连接结构 |
TWI574473B (zh) * | 2012-06-07 | 2017-03-11 | 鴻海精密工業股份有限公司 | 電連接器組合 |
JP2013258044A (ja) * | 2012-06-12 | 2013-12-26 | Molex Inc | コネクタ |
US9742091B2 (en) * | 2014-04-11 | 2017-08-22 | R&D Sockets, Inc. | Method and structure for conductive elastomeric pin arrays using solder interconnects and a non-conductive medium |
JP2016170007A (ja) * | 2015-03-12 | 2016-09-23 | 株式会社東芝 | 共通テストボード、ip評価ボード、及び半導体デバイスのテスト方法 |
JP2016178068A (ja) * | 2015-03-23 | 2016-10-06 | カシオ計算機株式会社 | コネクタおよび電子機器 |
JP6507056B2 (ja) * | 2015-07-24 | 2019-04-24 | 株式会社オートネットワーク技術研究所 | 電池配線モジュール |
KR20160001719A (ko) | 2015-09-11 | 2016-01-06 | 주식회사 대한아이엠 | 연약지반 개량을 위한 수직과 수평 배수재 시공방법 및 그 수평배수재의 부직포 |
CN106018890A (zh) * | 2016-08-10 | 2016-10-12 | 昆山兢美电子科技有限公司 | 一种飞针测试头后接板块 |
WO2018044788A1 (en) * | 2016-09-02 | 2018-03-08 | R&D Circuits, Inc. | Method and structure for a 3d wire block |
KR20190091970A (ko) | 2018-01-30 | 2019-08-07 | 주식회사 엘지화학 | 커넥터 피치 변경용 어댑터 및 그 제조 방법 |
JP2022139728A (ja) * | 2021-03-12 | 2022-09-26 | パナソニックIpマネジメント株式会社 | 基板間接続構造および電力変換装置 |
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-
2008
- 2008-12-16 US US12/316,677 patent/US7766667B2/en active Active
- 2008-12-17 KR KR1020107015693A patent/KR101262453B1/ko active IP Right Grant
- 2008-12-17 WO PCT/US2008/013842 patent/WO2009082461A2/en active Application Filing
- 2008-12-17 JP JP2010539485A patent/JP5563477B2/ja active Active
- 2008-12-17 EP EP08863567A patent/EP2225802A4/en not_active Withdrawn
- 2008-12-17 CN CN200880121549.9A patent/CN101919122B/zh active Active
- 2008-12-18 TW TW097149346A patent/TWI462412B/zh active
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2010
- 2010-04-30 US US12/799,712 patent/US7931476B2/en active Active
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2011
- 2011-02-03 US US12/931,518 patent/US8066517B2/en active Active
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JPH01124976A (ja) * | 1987-11-09 | 1989-05-17 | Shin Etsu Polymer Co Ltd | 接着性熱溶融形コネクタ |
JPH05159821A (ja) * | 1991-03-27 | 1993-06-25 | Japan Synthetic Rubber Co Ltd | 回路基板検査装置 |
US5879172A (en) * | 1997-04-03 | 1999-03-09 | Emulation Technology, Inc. | Surface mounted adapter using elastomeric conductors |
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Also Published As
Publication number | Publication date |
---|---|
CN101919122A (zh) | 2010-12-15 |
US20100216320A1 (en) | 2010-08-26 |
TWI462412B (zh) | 2014-11-21 |
CN101919122B (zh) | 2015-11-25 |
EP2225802A2 (en) | 2010-09-08 |
JP5563477B2 (ja) | 2014-07-30 |
US7931476B2 (en) | 2011-04-26 |
US8066517B2 (en) | 2011-11-29 |
KR101262453B1 (ko) | 2013-06-25 |
US7766667B2 (en) | 2010-08-03 |
EP2225802A4 (en) | 2011-04-27 |
KR20100105684A (ko) | 2010-09-29 |
TW200934018A (en) | 2009-08-01 |
WO2009082461A3 (en) | 2009-08-20 |
US20090156029A1 (en) | 2009-06-18 |
US20110124207A1 (en) | 2011-05-26 |
WO2009082461A2 (en) | 2009-07-02 |
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