TWI462412B - 使用等向傳導彈性物體互連介質的可分離電連接器 - Google Patents

使用等向傳導彈性物體互連介質的可分離電連接器 Download PDF

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TWI462412B
TWI462412B TW097149346A TW97149346A TWI462412B TW I462412 B TWI462412 B TW I462412B TW 097149346 A TW097149346 A TW 097149346A TW 97149346 A TW97149346 A TW 97149346A TW I462412 B TWI462412 B TW I462412B
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circuit board
plate
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TW200934018A (en
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James V Russell
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R & D Circuits
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

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  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

使用等向傳導彈性物體互連介質的可分離電連接器
本發明是關於一種電連接器。此等連接器係將一配接板電氣連接至一主電路板(主板)，其中有必要透過使用一介置板以將其一者之粗寬點板排置轉換於另一者的細密點板排置。尤其，本發明是關於一種電連接器，此者在一經修改印刷電路(PC)板的兩側上利用等向傳導彈性物體以確保良好電氣接觸，而同時令該PC板能夠具備將跡線配佈於該PC板之介面側上的能力。
Weiss等人的美國專利第6,702,587號(該’587號專利)是關於一種利用一非等向傳導彈性物體(ACE)的電連接器。該ACE係按一薄片形式所設置，並且在該傳導範圍的整個表面上依一致間距而於z軸上進行電氣傳導。然如此會造成該’587專利中的裝置無法具備在該配接板及該主板之介面側上配佈傳導跡線的能力。
本發明提供一種利用一等向傳導彈性物體作為互連介質的電連接器。該等向材料最好是經設置在一經修改PC板之兩側上的傳導連接盤(conductive land)上，以供在該配接板及主板之介面側上配佈傳導跡線。
現參照圖1-3，圖1說明本發明之電連接器，其中該連接器具有一機械壓縮結構5、一具有連接盤或點板7之配接板6，以及一經修改PC板8，而在此PC板8之兩側的連接盤上經構成有等向彈性物體材料；以及一具有連接盤11的主電路板10。在該機械壓縮結構5內的一插座5a係經調以承載一像是積體電路(IC)晶片的測試電路。腳針5b係經供置以令經承載於該插座5a之內的IC晶片電氣連接於該配接板6的點板7。該配接板6的連接盤或點板以及該主電路板10的連接盤11係經放置而在當該配接板6及該PC板8及該主電路板被該機械壓縮結構壓縮合一時會接觸於位在該經修改PC板8之連接盤或點板9a上的等向彈性物體材料9。因此，該PC板8的連接點板可藉由經設置於其上之等向彈性物體材料9而作為一經等向點板定義的連接器8。
藉由壓縮該等機板合一，可提供一於該配接板與該主電路板10之間的電氣連接，並且藉由利用該中介連接器以將在各機板表面上的點板自粗寬轉換為細密或反是(vice versa)-即具等向彈性物體的經修改PC板。藉由利用在該PC板兩側上的連接盤，可僅藉由在點板位置處，而無須如該’587號專利般在該連接範圍的整個表面上，設置等向材料即能獲得良好連接且同時提高配佈密度並降低成本。
除藉由將細密點板連接於粗寬點板並反是以進行間距轉換之外，本發明亦可供以對從經連接於在該機械壓縮結構5插座5a內所承載之測試電路3(像是一IC晶片3)的腳針4之腳針5b1-7至該配接板6的點板7與主電路板10的點板11之電氣連接進行重新配佈。即如圖2A所示，可對該配接板6進行重新配佈，因而無須將其路徑或跡線12連接至該主電路板10上的相對應連接盤或點板11，同時亦不必進行間距轉譯。因此，可將該結構5上的腳針5b-1連接至該配接板6之一第一側6a上的一點板7-1，並且透過一跡線12而重新配佈該點板7-1以連接至該點板7-6，而非該配接板6之一第二側6b上的第一連接盤7-5。然後，該點板7-2連接至該主電路板10之相反表面10a上的點板11-2。可按此方式進行任何可能的重新配佈。如此，本發明可供視需要進行電路的重新配佈。此外，可視需要改變該配接板6及該主電路板10的點板數量，並且對於不同具體實施例而言可與圖1具體實施例有所差異。此外，在圖2A具體實施例中並不需要如圖1所示的經修改PC板8，且圖5具體實施例的情況亦同。
圖2B說明本發明之一經強化跡線配佈12的一種可能範例。由於在該經修改PC板8之各側上設置該等向連接盤9的結果，該跡線配佈12可於其內或附近連接位於該經修改PC板8與該配接板6間以及該經修改PC板8與該主電路板10間之介面層上的連接盤陣列。如此即可在本發明之經修改PC板8兩側上的電路中提供配佈密度。此外，這可提供相較於前述先前技藝提議更具成本效益的解決方案。圖2A中並未顯示出該經修改PC板。然應瞭解此一重新配佈該配接板6的特性可運用於圖1、4及5具體實施例。
圖3說明該經修改PC板8。該PC板8係如圖示般藉由在該PC板8之兩側上設置具等向材料的連接盤而修改。圖3雖顯示一表面，然應瞭解另一表面亦為按類似方式排置。該等向材料可為等向膏劑而經鍍佈於該經修改PC板8兩側的點板上。
圖4說明一第二具體實施例，其中在該配接板與該主電路板之間並不需要經修改PC板。作為替換地，在該配接板上相對地朝向該主電路板連接盤之表面上的連接盤上以一等向彈性物體材料鍍佈，像是等向彈性物體膏劑。從而，不如本揭示圖1所示情況鍍佈一經修改PC板8的點板，而是對該配接板6上朝向於該主電路板10之連接盤的連接盤上以該等向彈性物體膏劑鍍佈。
圖5說明一第三具體實施例，其中在該配接板6與該主電路板10之間並不需要經修改PC板8。作為替換地，在該主電路板10上相對地朝向該配接板6之表面上的連接盤以一等向彈性物體材料鍍佈，像是等向彈性物體膏劑。從而，不以如本揭示圖1所示情況鍍佈一經修改PC板8的點板，而是對該主電路板10上朝向於該配接板6之連接盤的連接盤以該等向彈性物體膏劑鍍佈。
圖2B說明本發明圖4及5具體實施例之一經強化跡線配佈12的一種可能範例，即如即已對於圖1具體實施例所述者。點板可為7或11，此係根據須將該等向膏劑設置於何處而定。因而，若將像是等向膏劑的等向材料設置在該配接板6的點板7上，則必須在該主電路板10上進行跡線重新配佈，即如先前針對於該配接板6所述者。同樣地，若將像是等向膏劑的等向材料設置在該主電路板10的點板11上，則必須在該配接板6上進行跡線重新配佈。
在此雖已針對本揭示之目的說明多項較佳具體實施例，然應瞭解熟諳本項技藝之人士可在裝置部份的排置方面進行無數變化。此等變化係由隨附之申請專利範圍而定義的本發明精神所涵蓋。
3．．．測試電路
4．．．腳針
5．．．機械壓縮結構
5a．．．插座
5b(5b1-5b6)．．．腳針
6．．．配接板
6a．．．該配接板之第一側
6b．．．該配接板之第二側
7．．．連接盤/點板
8．．．經修改之印刷電路(PC)板
9．．．等向彈性物體材料
9a．．．連接盤/點板
9b．．．連接盤/點板
10．．．主電路板
10a．．．主電路板的相對表面
11．．．連接盤/點板
12．．．路徑/跡線
圖1係本發明之一第一具體實施例的分解截面視圖；
圖2A係本發明之一第二具體實施例的分解截面視圖，其中點板的數量不同於圖1、4及5所示之具體實施例；
圖2B說明跡線配佈，其中可在該配接板的介面層上進行跡線配佈，雖未顯示，但應瞭解的是，根據圖1、圖4及
圖5所示之具體實施例確可在該主電路板(而非該配接板)的介面層上按類似方式進行該跡線配佈；
圖3係一圖1具體實施例的經修改PC板；
圖4係本發明之一第三具體實施例，其中不需一經修改PC板，並且該配接板具有以等向彈性物體材料鍍佈的連接盤；以及
圖5係本發明之一第四具體實施例，其中不需一經修改PC板，並且該主電路板具有以等向彈性物體材料鍍佈的連接盤。
3．．．測試電路
4．．．腳針
5．．．機械壓縮結構
5b(5b1-5b6)．．．腳針
6．．．配接板
7．．．連接盤/點板
8．．．經修改之印刷電路(PC)板
9．．．等向彈性物體材料
9a．．．連接盤/點板
9b．．．連接盤/點板
10．．．主電路板
11．．．連接盤/點板

Claims (3)

  1. 一種用以在一配接板與一主電路板之間提供一電氣連接的電連接器，其包含：一互連介質，此者具有一等向傳導彈性物體，而可提供該配接板與該主電路板之間的電氣連接，其中該互連介質係經構成如一印刷電路板，此板係設置在該配接板與該主電路板之間，因此該印刷電路板具有連於該配接板及該主電路板的介面側，該印刷電路板係經修改藉以在該印刷電路板的兩側上具有複數個點板並且在該經修改印刷電路板的兩側上僅於該些複數個點板的位置上具有等向彈性物體以確保良好電氣接觸藉此增加佈線密度並且藉由僅放置等向彈性物體於該些點板的位置上來減少成本，並同時令該配接板及該主電路板能夠在該配接板及該主電路板的介面側上進行跡線配佈。
  2. 如申請專利範圍第1項所述之電連接器，其中該些複數個點板的每一者係被形成為高架地帶。
  3. 如申請專利範圍第1或2項所述之電連接器，進一步包含一機械壓縮結構，此者具有一槽洞而可於其中承載一測試電路，該結構具有用以連接至該配接板之點板的腳針，藉此提供自該測試電路之腳針至該配接板、自該配接板至該電連接器，以及自該電連接器至該主電路板的電氣連接。
TW097149346A 2007-12-18 2008-12-18 使用等向傳導彈性物體互連介質的可分離電連接器 TWI462412B (zh)

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US826207P 2007-12-18 2007-12-18
US927207P 2007-12-27 2007-12-27
US12/316,677 US7766667B2 (en) 2007-12-18 2008-12-16 Separable electrical connectors using isotropic conductive elastomer interconnect medium

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