200827886 ^ 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種用以將一電子裝置電子連接至 基板的可分離電子連接器。 【先前技術】 向性導電彈性體（ACE)」是―種多項導體金屬元 素而按-無性橡膠矩陣的複合物，此者通常係經建構使得 。玄者僅a -軸線導電。—般說來，這種類型的材料係經製 作以穿過其厚度進行導電。在一簡易實作裡，織是= 將磁性粒子混合於一液體樹脂，冑混合物構入於一連二薄 片内’亚且在出現一磁場時令以固化該薄片，藉此達成其 異向性導電性。這可造成粒子在穿過該薄片厚度上構成出 具有導電性的多個縱行。所獲結構具有彈性以及異向導電 性的獨特性質。這些性質可供作為一種非常有用的互連媒 體。 在另一簡化實_裡，該ACE可含有一矩陣相態之電子 絕緣橡膠薄片，該薄片具有一特定硬度；以及一散置相態 之硬數條金屬細緻接線節段’此等係經嵌入於該矩陣内。 該等複數條細緻接線節段係大致彼此平行，同時按一特定 方向且按—特定分布密度所延伸。該等接線節段的各個末 端係曝出於該橡膠矩陣薄面的表面上。 ACE必帛在頂部與底部導體之間受到壓㈣，藉以提供 互連性。這通常是藉由運用—背固平板與彈簧排置來壓制 6 200827886 該系統所達成。其一範例可如圖1所示。這需要利用多個 經设计以納入該背固平板和孔洞的機板。而這會與經架置 在該裝置下方和該機板背側上的元件產生衝突。此外，該 ACE可經接附於一框架，其中該框架水平延伸超過該配接 器機板的維度。此組態可防止該框架干擾到經施加於該 ACE的壓制力度，然而也可能使得該連接器的廓形變得較 長，因此限制對該基板的接取。不過，在一些應用裡，大 小上的限制可能會阻礙使用框架。 【發明内容】 本發明之特性為一種用以將一電子裝置電子互連至一 基板的可分離電子連接器。在一具體實施例裡，本發明包 含一配接器機，此者係電子連接於該基板，該配接器機 板在兩側上具備電子接觸點；一 ACE層，此者位在該電子 裝置與該配接器拖+日日..、一 w ^ —200827886 ^ IX. Description of the Invention: [Technical Field] The present invention relates to a separable electronic connector for electronically connecting an electronic device to a substrate. [Prior Art] A directional conductive elastomer (ACE) is a composite of a plurality of conductor metal elements and an asexual rubber matrix, which is usually constructed. The mysterious person is only a-axis conductive. In general, this type of material is made to conduct electricity through its thickness. In a simple implementation, the weave is = mixing the magnetic particles into a liquid resin, and the ruthenium mixture is incorporated into the two sheets, and the magnetic sheet is solidified to cure the sheet, thereby achieving its anisotropic conduction. Sex. This can cause the particles to form a plurality of wales having electrical conductivity across the thickness of the sheet. The resulting structure has the unique properties of elasticity and anisotropic conductivity. These properties are available as a very useful interconnect medium. In another simplified embodiment, the ACE may comprise a matrix phase of an electrically insulating rubber sheet having a specific hardness; and a plurality of hard metal strips in a dispersed phase. Within the matrix. The plurality of finely detailed segments are substantially parallel to each other and extend in a particular direction and at a particular distribution density. The respective ends of the wiring segments are exposed on the surface of the thin face of the rubber matrix. The ACE must be stressed (four) between the top and bottom conductors to provide interconnectivity. This is usually achieved by using the backing plate and the spring arrangement to press 6 200827886. An example of this can be seen in Figure 1. This requires the use of multiple panels designed to incorporate the backing plate and holes. This can be in conflict with components that are placed under the device and on the back side of the board. Additionally, the ACE can be attached to a frame wherein the frame extends horizontally beyond the dimensions of the adapter plate. This configuration prevents the frame from interfering with the pressing force applied to the ACE, but it is also possible to make the profile of the connector longer, thus limiting access to the substrate. However, in some applications, restrictions on size may hinder the use of the framework. SUMMARY OF THE INVENTION A feature of the present invention is a separable electronic connector for electronically interconnecting an electronic device to a substrate. In one embodiment, the present invention includes an adapter device that is electronically coupled to the substrate, the adapter plate having electronic contacts on both sides; an ACE layer, the device being located in the electronic device The adapter drags + day.., one w ^ —
5亥機械結構可包含一彈簧平板，此者最好是可移除以 有助於其分離性。可 施加該壓制負載。該 係經熱性連接該裝置 ϋ亥連接器可在該装置 體。 可利用一旋轉螺絲組件以自該彈簧平板 該連接器可進一步包含一散熱器，此者 ，並且透過此者以施加該壓制負載。 與該散熱器之間進一步含有一熱導媒 置，並日读说士卜.去以汰i女厭生丨丨含此 7 200827886 該連接it亦可在該裳置與該織之間進_步含有一彈 路構件。該彈性電路構件可在兩側上含有電子接觸 點，該等係透過該電路彳冑# ^ 纷偁件谷度而電子連接合一。該 :仍J在該配接器與該基板之間進-步含有一絕緣背填 機板的硬固度。該背填物可為樹脂。 该衣置可在该配接器與該裝置之間進-步包含一第二ace 層。 在另-具體實施例裡，該可分離可移除連接器含有一 轉化器機板，此者在兩側上具有電子接觸點，並且在i内 具有電子電路，藉以將該細緻間距電子裝置的廊跡擴展至 該基板的較粗糙間距。該連接器在該轉化器機板與該基板 H步含有-ACE層。該連接器可在該轉化器機板與 該裝置之間進一步含有一第二ACE層。 在一進-步具體實施例裡，該可分離可移除連接器含 有一 ACE層，此者經耦接於一框架；以及一配接器機板， 此者含有-溝道’其大小及形狀態係經設計以交接該框 架，並因此縮小該連接器的靡形。在另—具體實施例裡， 藉由-在該溝道内所含有之黏著劑，將該ace層直接地· 接於該配接器機板而無需使用該框架，藉以在其中大小限 制會阻礙使用框架的應用項目裡將該連接器的靡形縮小。 忒連接裔可經没計以透過一測試插槽而介接至該電子 裝置。在此具體實施例裡，將一半導體插入該測試插槽内， 以讓半導體能夠改變廓跡類型俾介接至該連接器。該測試 插槽含有複數個接觸平點，其中接觸平點係經放置為對齊 200827886 於來自β亥半導體的相對應導體；以及複數條相對應的内部 導線，藉以將該等複數個接觸平點連接至位於該測試插槽 之底部表面上的該等複數個導體。 θ 。亥可分離可移除連接器亦可用以作為一電子裝置與一 測4印刷電路板之間’或是—測試插槽與__測試印刷電路 板之間，的介置器，藉以提供一電子介面，而同時在測試 過程中減輕該測試印刷電路板之接觸平點上的磨損與撕裂 問題。此組態在當該印刷電路板為複雜且成本昂貴時可特 別適用，g為此一介置器的成本是遠低於該印刷電路板的 成本。從而，當藉一測試印刷電路板以測試電子裝置時， 可利用該可分離可移除連接器作為一可拋棄磨損組件。 【實施方式】 圖2中詳細地說明本發明之較佳具體實施例的多項特 點二^發明之目的在於達成電子裝置32與基板34,此者 通常是-印刷電路板間的可運作且可分離電子互連。 這種可分離電子連接器可有多項用途。其中之—是固定以 j試或燒入電腦晶片。這會要求能夠將該等晶片快速地且 間易地電子連接於—機板，錢在適當測試之後移除且替 換為另一晶片。此圖中亦顯示出(僅為示範目的)兩種不二 類里的典型電子裝置輸出互連結構-球狀栅格陣列5〇及 針31陣列52。而通常會是使用這兩種的其中之—，而絕不 會同時兩者。&兩者係經說明以顯示該裝置可容納任 類型的連接硬體。 9 200827886 …本發明考量到在該襞置32與該基板34之間放置一相 對堅硬的配接器機才反36。該㈣反36係、永久地電子且機械 連，於'亥印刷電路才反34，這通常是利用前述的球狀柵格陣 列木置或針型架置技術。然後該機板3ό在該電子裝置32 與口亥印刷電路才反34之間作為一機械支架及一電子互連兩 者0The 5H mechanical structure may comprise a spring plate which is preferably removable to facilitate its separation. This pressing load can be applied. The device is thermally connected to the device and the connector can be in the device. A rotary screw assembly can be utilized to extend the spring plate from the spring plate. The connector can further include a heat sink, and through which the press load is applied. Between the heat sink and the heat sink, a heat-conducting medium is further included, and the reading of the sun is said to go to the end of the woman's ugly 丨丨 此 7 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 The step contains a ballistic member. The elastic circuit member may have electronic contact points on both sides, and the electronic connection is integrated through the circuit 彳胄#^. The J still contains the indentation of an insulating backfill plate between the adapter and the substrate. The backfill can be a resin. The garment can include a second ace layer further between the adapter and the device. In another embodiment, the detachable removable connector includes a converter plate having electronic contacts on both sides and having electronic circuitry within i for the purpose of the fine pitch electronics The trace extends to the coarser pitch of the substrate. The connector contains an -ACE layer on the converter plate and the substrate H step. The connector further includes a second ACE layer between the converter plate and the device. In a further embodiment, the detachable removable connector includes an ACE layer coupled to a frame; and a splicer plate having a -channel size and shape The state is designed to hand over the frame and thus reduce the shape of the connector. In another embodiment, the ace layer is directly attached to the adapter plate by means of an adhesive contained in the channel without the use of the frame, whereby size limitations hinder the use of the frame In the application project, the shape of the connector is reduced. The connection can be interfaced to the electronic device through a test slot. In this embodiment, a semiconductor is inserted into the test socket to allow the semiconductor to change the profile type to interface to the connector. The test slot includes a plurality of contact flat points, wherein the contact flat points are placed to align 200827886 with corresponding conductors from the beta semiconductor; and a plurality of corresponding inner conductors are used to connect the plurality of contact flat points To the plurality of conductors on the bottom surface of the test slot. θ. The detachable removable connector can also be used as an interposer between an electronic device and a test 4 printed circuit board, or between the test socket and the __ test printed circuit board, thereby providing an electronic device. The interface, while at the same time reducing the wear and tear problems on the contact flat points of the test printed circuit board during the test. This configuration is particularly useful when the printed circuit board is complex and costly, and the cost of an interposer is much lower than the cost of the printed circuit board. Thus, the detachable removable connector can be utilized as a disposable wear component when testing a printed circuit board to test an electronic device. [Embodiment] FIG. 2 illustrates in detail a plurality of features of a preferred embodiment of the present invention. The purpose of the invention is to achieve an electronic device 32 and a substrate 34, which is typically operable and separable between printed circuit boards. Electronic interconnection. This detachable electronic connector can serve multiple purposes. Among them - is fixed to j test or burn into the computer chip. This would require the wafers to be quickly and easily electronically connected to the board, with the money removed and replaced with another wafer after proper testing. Also shown in this figure (for demonstration purposes only) are typical electronic device output interconnect structures in the two types - a ball grid array 5A and a pin array 52. And usually it's one of these two -- and never both. Both & are illustrated to show that the device can accommodate any type of connecting hardware. 9 200827886 ... The present invention contemplates placing a relatively rigid adapter machine between the device 32 and the substrate 34. The (4) anti-36 series, permanently electronically and mechanically connected, is reversed at the 'Hai printed circuit', which is usually done using the aforementioned spherical grid array wood or needle mounting technology. Then, the board 3 is used as a mechanical support and an electronic interconnection between the electronic device 32 and the digital printed circuit.
X栈板3 6之一特點在於此者可達成一接於該印刷電路 板34及一 ACE層38兩者的電子介面，同時亦可經設計以 更有效率地電子介接於該印刷電路板及該ace層兩者。換 言之，該機板36可用來重新排置在該印刷電路板34上之 電子接觸點的樣式，藉以更佳地匹配於該裝置32之上者， 並且亦可更有效率地介接於該ACE材料38。例如，該配 接时36可供以一自通常用於一印刷電路板内之bga焊庐 格式或該針型格式’機械性地轉化至最佳地用力織材: 的平坦面區格式。肖ACE材料可在當於其面部上存在有一 平坦、相當大型互連時最佳地執行…此互連可電子連 接於多條穿過該ACE的導體路徑。BGA及針型陣列具有 -相當微小的接觸區域，從而並非理想地適用在介接於 ACE材料。轉化器36彳藉由在其上部表面上具有平坦面 區以達成此項目標，在此該者介接於該ace材料Μ;並 且接著在底部表面上連於針型或BGA連接器，而在此該 者介接於該印刷電路板34之表面上的接收結構。 人 该配接器3 6之另一功能或批斗Λ 41+丨 夺 乃力此為對该組裝提供提高的硬固 精以將必要的ACE材料壓制結構獨—地，或至少主要 10 200827886 地’定位在該印刷電路板34 的上方側上。此外，該硬體 可主要地或獨一地介接於該轉 w化-3 6而非接於該印刷電 路板34，同時該硬體亦不 而要牙過该印刷電路板34。所 有這些皆有助於本發明之可分 刀離運接裔對該印刷電路板34 以及經架置於其上之元件的 〜1 要功旎產生較低干擾，而使 侍本發明成為一較佳可分離電子連接器。 可按如下方式達成這此擁 ^ ^ 一機械特性。該機板30可為由所 一適Μ硬固絕緣體所製成 展攻像疋樹脂或陶瓷。此者可含有 至屬組件或其他硬固物，傀辟 早如供額外的硬固性。可藉由含 有一框架組件 40以谁一牛描丄, ν曰加此硬固性，此者係經放置 在壞繞該配接器機板36的週 違處’並且靠在該電路板34 之上。此框架將增厚該配接 裔亚且提供額外的硬固性。 或另者’可在此整體組態内製作出該配接器。 該配接器36是用以作為μ 疋州乂 1下馮於该ACE材料38與該電子裝 置3 2間之壓制互連的平台。 一 k在圖式中顯示之具體實施 例是藉由在繞該配接器36週邊 ^ 心遭慝多個固持腳針46所達 成。這些腳針可將一上方彈菩平 — ”十扳4 4耗接於該配接器3 6， 藉以提供為將該ACE層38電子鉍技仏兮壯班 ° 电于耦接於该裝置32及該配接 器36兩者所需要的壓制力度。在所示之具體實施例裡， 散熱益42係經放置於該平板44與該裝置32之間，藉以 自該裝置沒取熱性，同時亦可機械福接來自該平板44曰的 壓制。負載。可納入熱散材料56以將熱性更佳地傳送至該 散熱器42。負載螺絲48係一可，敕< — T j凋整没定螺絲，此者可供 視所必要而調整由該彈簧平柘 ’、 汽卞枚44所提供的壓制力度，藉 200827886 以獲致一所欲壓制力度。 此排置可將該ACEa制機械構件卸離於該印刷電路板 34。從而，該ACE材料的内含可分離性可達成，而不致對 經架置在該印刷電路板34 <前側或背側表面上的其他元 件產生影響。同時，此項排置藉該印刷電路板34而對該 經焊㈣合之互連配接3 36施以微小迫力。可藉由在該 配接器36之底部與該印刷電路板34之頂部間增加或注入 一絕緣底填㈣54以裹封該焊燒接合處並將兩者機板貼 合，藉此對此等接合處提供額外硬_。此底填物可為一 樹脂材料，此者能夠繞於該等接合處流動然後硬化定位。 。即如則述，该ACE材料係經最佳地電子耦接於平坦面 區，而非一球狀柵格陣列的焊燒球體。可按如圖3所示強 化-球狀柵格陣列與ACE材料之間的介面。球狀柵格陣列 電子封裝70具有焊燒球體’像是電子介接於ace材料η 的球體7卜而該者具有穿過其厚度的導體構件8〇。由於 烊燒球體僅達成一微小面積接觸，因此有機會僅接觸到數 篁微少的ACE薄型導體構件^可藉由將於該裝置與該仰 材料之間的接觸表面面積最大化以強化電子連接。這可透 過使用-介置彈性電路構件74巾達成，此者在其底側上 具有平坦面區78以介接於該ACE材料80’同時是透過多 個孔洞76所安置，而該等孔洞係於該前側處開放，並且 經調適以收納一球體71。這些在該彈性電路之上部表面上 的大型半徑平板孔洞將會保護該焊燒球體的底部，讓其能 夠自然地座置在其正確位置内，並且提供對於接觸到該 12 200827886 ACE材料72之面區78的電子連接性。 另一替代性較佳具體實施例係如圖4所示。在此具體 貝施例裡，該配接器機板3 6並未經焊燒於該印刷電路板 34，而疋利用一弟一 ACE材料層38a以可分離地連接於該 印刷電路板。由於並無焊燒連接，因此整個組裝可簡易地 拆解。然而，因無該焊燒連接，故有可能會需要在該電路 板34之底側上放置一額外的機械組件，像是硬固平板64， 藉以耦接該彈簧平板44。如此可防止該電路板34在該彈 簧力度負載下而彎折，這在若是將該彈簧平板44耦接於 該機板3 4即可能發生。 此組態非常適用於測試產業，其中所使用的印刷電路 板為複雜且昂貴。這可供運用一通用的測試印刷電路板， 此者可利用一低成本配接器機板以調適於多項不同的晶片 叹汁，而該機板亦能達成必要的電子轉化作業。在該配接 益機板之其一或兩者表面上的ACE材料層是一種將該裝置 32經该機板36而互連至該印刷電路板34的優良方式。 在一組態裡，該可分離可移除連接器可為放置在待予 測試的電子裝置與一測試印刷電路板之間，藉以提供一在 ^電子衣置與邊測試印刷電路板之間的電子介面，而同時 減 > 在该測試印刷電路板上的磨損與撕裂問題。因此該連 接為可用來作為一用於測試處理的可拋棄磨損組件。 ^本發明亦包含一種測試電子裝置（像是一積體電路）的 袭置即如圖5所示。並未含有積體電路之封裝承體9〇 係經互連於利用一 ACE材料層94的PCB 34。該封裝承體 13 200827886 90的頂部係僅藉由在該封裳之週邊或邊緣處將其壓制至該 ACE而令為開放’即如藉由該具框架形狀之甜夹裝置刚 所述此者可在該ACE層9〇上提供必要的壓制力度，藉 、達成4封衣承體9 〇與該印刷電路板3 *之間的電子互 連。或另者，該封裝承體可例如藉一焊燒連接器而永久地 接附於該PCB。 一半導體業界既已縮減半導體裝置的大小，並且同時提 f 间在、給疋半導體晶片上之接觸‘點或導體的密度或數量， 使得料接觸點之間的可獲用距離或間距相對應地縮小。 象疋凌置92的積體電路裝置具有按一極微間距的導體— 可細達〇·2 _以下。該封裝承體9〇之一目的在於提供一 2可將該積體電路之高密度或細微間距轉化至該pcB之低 也度或相對幸父粗糖間距的裝置。在此一本發明具體實施例 裡’可對-利用ACE材料作為該探查器系統之探查器測試 系統提供—種經改良的測試功能性。可建構- ACE材料， ( f是^細微粒子之磁性對齊所產生者，以符合低成本、 面效能探查器系統所需要的細微間距要求。可在該封裝承 體9〇與該積體電路92之間利用—第二織材料層％以 獲低成本、高效能測試功能性，而於該積體電路與該 ί衣表體之間則無需一個別、複雜、昂貴的探查器裝置。 杏本1月之一進一步具體實施例可如圖6所示。在此具 體實施例裡，該可分離可移除電子連接器m可至少部分 地達成在該電子裝置16〇與該pCB 167間的電子介面。本 ^月特!生為一轉化器機板i 63，此者耦接於一 A⑶材料層 14 200827886 1 65。该轉化恭機板l 63可經設計以對該電子裝置丨7〇提 供提高的硬固性，並且可經建構以多個薄層（未以圖示）。 一第二ACE材料層（未以圖示）亦可經納入於該轉化器機板 163與該電子裝置160之間。 該轉化器機板163含有一第一組電子接觸點162。這 些電子接觸點162可為經對齊放置，並且具有與該電子裝 置1 60之電子導體1 6 1相同的間距。該等電子接觸點1 62 可經設計以容納不同的電子導體組態，包含，然不限於此， 球狀栅格陣列、面區栅袼陣列及針型栅格陣列。該轉化器 機板163進一步含有一第二組電子接觸點164。該等電子 接觸點164可為經對齊放置，並且具有與該pCB 167之電 子導體166相同的間距。該轉化器機板163介接於該ace 材料，藉以至少部分地達成一在該等電子接觸點164與該 PCB 167之電子導體166間的電子介面。 該等電子接觸點162與該轉化器機板163之電子接觸 點164間的電子介面是藉由電子電路（未以圖示）所達成。 在一組恶裡，该轉化器機板1 63的頂層含有將該等電子接 觸點各者連接至一相對應接觸點板的電路跡線。該轉化器 機板163的底層亦含有將該等電子接觸點164各者連接至 一相對應接觸點板的電路跡線。該轉化器機板163之頂層 上的接觸點板係按對齊於該轉化器機板163之底層上的^ 觸點板所放置，並且透過各層内的同心穿透孔洞，藉由電 子連接這兩組接觸點板以構成一電子電路。而亦考量到其 他組態，包含在該轉化器機板頂層及底層上之接觸點板= 15 200827886 替代性排置、電子連接這兩組接觸點板的替代裝置以及具 有兩個以上薄層的轉化器機板，並且歸屬本發明之範圍 内。 在一進一步具體實施例裡，如圖7所示，將該電子裝 置160按可移除方式架置在一插槽18〇上，其中該插槽18〇 提供一在該裝置160與該轉化器機板163之間的電子介 面。該插槽180可併入像是彈簧接觸點之接觸點，或者可 為利用ACE材料所建構。該插槽1 8〇可進一步含有業界眾 知而用以將該電子裴置丨6〇對齊於該轉化器機板i 63的裝 置。在一組態裡，該插槽18〇含有複數個接觸點板181， 其中該等接觸點板1 80係經對齊於來自該裝置丨6〇之相對 應導體1 6 1所放置；以及複數個相對應内部導線1 83，該 等疋用以將該等複數個接觸點板1 8丨連接至在該測試插槽 18〇之底部表面上的複數個導體182。可考量到其他的插 槽1 8 0組態’並且歸屬本發明之範圍内。 圖8 - 1 1顯示本發明之進一步具體實施例，其中圖8 一 1 〇况明一具體實施例，而圖丨丨說明一第二具體實施例。 在圖8裡，一 ACE材料層820係經接附於一框架8丨〇。該 框架810定義一週界及一開口。在一較佳具體實施例，該 框架810概為長方形，然在其他具體實施例裡，該框架81〇 可概為一角形、概為角肖大，或是具有大致上為任意而定義 ，週界及開口的連續形狀。該ACE層820展越於該框 架810的開口，並且在該框架81〇之開口上可受於迫力。 在一較佳具體實施例裡，該ACE層82〇係藉由一黏著劑83〇 16 200827886 而接附於該框架810，然確可考量其他業界已知的接附方 法，並且歸屬本發明之範圍内。 即如圖9所示，在一本發明之具體實施例裡，可分離 可移除電子連接器970含有一配接器機板963;以及一 ace 層820，此者係藉由一黏著劑830而經接附於一框架8丨〇。 该配接器機板963含有一第一組電子接觸點962及一第二 組電子接觸點964。該配接器機板963進一步含有一溝道 或凹陷插槽980，此者之大小及形狀係經調整以交接並至 少部分地包入該框架810，藉以縮小的連接器970的廓形。 在一較佳具體實施例裡，該溝道或凹陷插槽980的大小及 形狀係經調整以在至少三側上交接並包入該框架8丨〇。該 框架810被收納或放置在該配接器機板963之溝道980内， 使得該第二組電子接觸點964接觸於該Ace層820。在一 較佳具體實施例裡，該第二組電子接觸點964及一 aCE層 820係足夠地相接觸，藉以至少部分地達成一在該配接器 機板963與該ACE層820之間的電子連接。 即如圖10所示，該可分離可移除電子連接器87〇可至 少部分地達成在該具有一或更多電子導體961之電子裝置 96〇與具有一或更多電子導體966之pCB或基板967間的 電子介面。該電子裝置96〇的間距可為與該PCB或基板967 的間距相同，然在其他具體實施例裡，該連接器970可經 設計以將該電子裝置96〇的間距轉化為該基板967的間 距忒電子裴置960的間距可等於、大於或小於該基板967 的間距。 17 200827886 進-步參照於圖10’該配接器機板963的電子接觸點 964係電子耦接於該ACE層820，以至少部分地達成”、 該配接器機板963之電子接觸點964與該PCB 、在 Γ Ο 導體966間的電子介面。該等電子接觸點9“亦可 放置，並且具有與該PCB 967之電子導體96M目同的間距， 然亦：量到其他的電子接觸，點964及電子導體_組態， 亚且歸屬於本發明之範圍内。在—較佳具體實施例裡，咳 配接器機& 963的電子接觸點964可為透過使用對齊腳: (未以圖示）以對齊於該PCB 967的電子導體966，然可考 量業界已知的其他對齊裝置，並且歸屬於本發明之範 内。 該配接器機板963的電子接觸點964亦可對齊於1 子裝置960之電子導體961而放置’並且具有與其二的 間距，然可考量到其他的電子接觸點962及電子導體 組態，並且歸屬於本發明之範圍内。該等電子接觸點 及964可經設計以容納不同的電子導體組態，包含，然不 限於此，球狀柵格陣列、面部柵格陣列及針型柵格陣列'、。 在一替代性具體實施例裡，可於該配接器機板963與 該=子裝置960之間納入一第二ACE材料層（未以圖示）。 該第二ACE材料層彳至少部分地達成—在該配接器機板 963之電子接觸點962與該電子裝置96〇之電子導體 間的電子介面。 _ 即如圖η所示，在對於圖9 _ i"所示之一本發明 替代性具體實施例裡’該電子M 96G係經含納在一封襄 18 200827886 承體或插槽1120内。一壓制力度係經施加於該ACe層 820,以藉由使用壓制螺栓111〇而在該插槽ιΐ2〇與該基 板或ACE 820之間至少部分地建立一電子連接，然可考量 其他業界已知用以壓制該ACE層82〇的裝置，並且歸屬於 本發明之範圍内。 本發明之一進一步具體實施例可如圖12所示。在圖12 中，可分離可移除電子連接器丨2丨〇含有一配接器機板 1220，以及一 ACE層123〇。該配接器機板122〇含有一窄 型溝槽或溝道1240。該ACE層1230藉由一黏著劑以直接 地耦接於該配接器機板丨220，並且最好是矽酮樹脂。在一 較佳具體實施例裡，於該配接器機板122〇之一頂部表面 1260内建立有一或更多的孔洞125〇。然後，將該ace層 123〇機械耦接於該配接器機板1220之一底部表面1270， 並且透過該等一或更多的孔洞125〇對該溝槽125〇 (?)填入 以黏著劑（未以圖示）。接著在當該黏著劑固化之後，將該 ACE層1230直接地黏附於該配接器機板122〇的底部表面 12 70 ’而此時即可移除該機械耦接。在一進一步具體實施 例裡’可在張力下將該ACE層1230固化。 雖在部分圖式中，然非於其他圖式裡，顯示有本發明 的特定特性，然此係為簡便之目的，因為可根據本發明將 部分特性合併於任何或全部的其他特性。 热請本項技藝之人士將可知曉其他具體實施例，並且 歸屬於後載申請專利範圍内。 19 200827886 【圖式簡單說明】 自後載之較佳具體實施例詳細說明與隨附圖式，熟諳 本員技含之人士即此顯知其他目的、特性與優點，其中： 圖1係具異向性導電彈性體（ACE)之先前㈣可分離 電子互連器的側視圖； 圖2係本發明之一具體實施例的代表性側視圖； 圖3係電子叙置之顯著放大部分截面視圖，此者根據 本發明之具體實施例係經電子耦接於一 ace層； 圖4係本發明之另一具體實施例的側視圖，此者是運 用兩個ACE材料層； 圖5係本發明之替代性具體實施例的側視圖，其中利 用ACE材料層以完成複雜探查器系統的功能性； 圖6係本發明之替代性具體實施例的側視圖，其中具 、、、田、’致間距之電子裂置的廓跡被轉化成印刷電路板的較粗 糙間距； 圖7係本發明之替代性具體實施例的側視圖，其中具 一細緻間距且經含納於一測試插槽内之電子裝置的廓跡被 轉化成一印刷電路板的較粗糙間距； 圖8係ACE層之戴面視圖，此者即如運用在本發明之 具體實施例内而經輕接於—♦匡_ . 圖9係本發明之替代性具體實施例的截面視圖，其中 含有ACE層，此者經耦接於如第8圖所示之框架；以及一 配接器機板，此者含有溝道以交接該框架； 圖1 0係圖9之發明的截面視圖，而其中進一步顯示一 20 200827886 電子裝置及一印刷電路板； 圖π係本發明之替代性具體實施例的截面視圖，其中 -電子裝置係經架置於一插槽内，並且施加有一壓制力 度，藉以達成該插槽與該印刷電路板之間的電子互動；以 及 圖12係本發明之替代性具體實施例的截φ視圖，其中 含有-ACE層，此層係直接地福接於一配接器機板，而該 機板包含含有一黏著劑的溝道。 【主要元件符號說明】 32 電子裝置 34 基板 36 配接器機板 38 ACE層 38a 第二ACE材米 40 框架組件 42 散熱器 44 彈簧平板 46 固持腳針 48 負載螺絲 50 球狀柵格陣列 52 針型栅格陣列 54 絕緣底填材料 56 熱散材料 21 200827886 64 硬固平板 70 球狀栅格陣列電子封裝 71 球體 72 ACE材料 74 彈性電路構件 76 孔洞 78 平坦面區 80 導體構件 90 封裝承體 92 裝置 94 ACE材料層 96 第二ACE材料層 100 鉗夾裝置 160 電子裝置 161 電子導體 162 電子接觸點 163 轉化器機板 164 電子接觸點 165 ACE材料層 166 電子導體 167 基板 170 可分離可移除電子連接器 180 插槽 181 接觸點板 22 200827886 182 導體 183 内部導線 810 框架 820 ACE層 830 黏著劑 962 第一組電子接觸點 963 配接器機板 964 第二組電子接觸點 966 電子導體 967 基板 970 可分離可移除電子連接器 980 溝道/凹陷插槽 1110 壓制螺栓 1120 封裝承體/插槽 1220 配接器機板 1230 ACE層 1240 溝槽/溝道 1250 孔洞 1260 頂部表面 1270 底部表面 23One of the features of the X-Board 3 6 is that an electronic interface between the printed circuit board 34 and an ACE layer 38 can be achieved, and can also be designed to more efficiently electronically interface to the printed circuit board. And the ace layer. In other words, the board 36 can be used to rearrange the pattern of electronic contacts on the printed circuit board 34, thereby better matching the device 32, and can also interface with the ACE more efficiently. Material 38. For example, the mating time 36 can be used in a flat area format that is mechanically converted to the best force woven material from a bga solder 庐 format commonly used in a printed circuit board or the stylus format. The AO ACE material can be optimally implemented when there is a flat, relatively large interconnect on its face... This interconnect can be electronically connected to a plurality of conductor paths through the ACE. BGA and pin arrays have - quite small contact areas and are therefore not ideally suited for interfacing to ACE materials. The converter 36 is achieved by having a flat surface area on its upper surface, where it is interfaced with the ace material Μ; and then attached to the needle or BGA connector on the bottom surface, and The person interfaces with the receiving structure on the surface of the printed circuit board 34. Another function of the adapter 36 or the Λ 41+ 丨 乃 is to provide an improved hard setting for the assembly to press the necessary ACE material to suppress the structure alone, or at least mainly 10 200827886 ' Positioned on the upper side of the printed circuit board 34. In addition, the hardware may be primarily or exclusively interfaced to the printed circuit board 34 rather than being attached to the printed circuit board 34. All of these contribute to the low resolution of the printed circuit board 34 and the components on which the printed circuit board 34 and the frame are placed, which makes the invention invention a lesser Jiake separation electronic connector. This mechanical property can be achieved as follows. The board 30 can be made of a suitable hard-wired insulator such as tantalum resin or ceramic. This person may contain subordinate components or other hard solids as early as additional hardness. This hardness can be added by including a frame assembly 40, which is placed in the circumferential violation of the adapter plate 36 and rests on the circuit board 34. on. This frame will thicken the mating sub-Asian and provide additional hardness. Alternatively, the adapter can be made in this overall configuration. The adapter 36 is used as a platform for the piezoelectric interconnection between the ACE material 38 and the electronic device 32. A specific embodiment of a k display in the drawings is achieved by a plurality of holding pins 46 around the periphery of the adapter 36. These pins can be used to connect the ACE layer 38 electronically to the device 32. And the pressing force required by both of the adapters 36. In the particular embodiment shown, the heat sink 42 is placed between the plate 44 and the device 32 so that no heat is taken from the device, and The press can be mechanically bucked from the flat plate 44. The load can be incorporated into the heat dissipating material 56 to better transfer the heat to the heat sink 42. The load screw 48 is one, 敕 < — T j withered Screw, this can be used to adjust the pressing force provided by the spring flat 柘 ', 卞 卞 44 44, by 200827886 to obtain a desire to suppress the force. This arrangement can detach the mechanical components of the ACEa The printed circuit board 34. Thus, the inherent separability of the ACE material can be achieved without affecting other components mounted on the front or back side surface of the printed circuit board 34 <RTIgt; The row is placed on the printed circuit board 34 to interconnect the soldered (4) interconnects 3 36 is applied with a small force. The solder joint can be wrapped or bonded by adding or injecting an insulating underfill (four) 54 between the bottom of the adapter 36 and the top of the printed circuit board 34. Thereby providing additional hardness to the joints. The underfill may be a resin material which is capable of flowing around the joints and then hardening the positioning. As will be described, the ACE material is optimal. The ground is electronically coupled to the flat surface area instead of the solder ball of a spherical grid array. The interface between the spheroidal grid array and the ACE material can be strengthened as shown in Figure 3. Sphere grid array electrons The package 70 has a solder-fired sphere 'like a sphere 7 that is electronically interposed to the ace material η and the one has a conductor member 8 穿过 through its thickness. Since the smoldering sphere only achieves a small area contact, there is a chance to only contact To a small number of ACE thin conductor members can be enhanced by maximizing the contact surface area between the device and the backing material. This can be achieved by using an intervening elastic circuit member 74. Having a flat surface area 78 on its bottom side for interfacing The ACE material 80' is simultaneously disposed through a plurality of holes 76 that are open at the front side and adapted to receive a ball 71. These large radius plate holes on the upper surface of the elastic circuit The bottom of the solder ball will be protected from being naturally seated in its proper position and provide electrical connectivity to the face area 78 that contacts the 12200827886 ACE material 72. Another alternative is better The embodiment is shown in Figure 4. In this specific embodiment, the adapter plate 36 is not soldered to the printed circuit board 34, and the ACE material layer 38a is detachably Connected to the printed circuit board. Since there is no solder joint, the entire assembly can be easily disassembled. However, since there is no such solder joint, it may be necessary to place an additional mechanical component, such as a hardened flat plate 64, on the bottom side of the circuit board 34 to couple the spring plate 44. This prevents the circuit board 34 from being bent under the spring force load, which may occur if the spring plate 44 is coupled to the plate 34. This configuration is ideal for the test industry where the printed circuit boards used are complex and expensive. This allows for the use of a universal test printed circuit board that can be adapted to a number of different wafer squeegees using a low cost adapter board that also achieves the necessary electronic conversion operations. The ACE material layer on one or both of the surfaces of the mating panel is an excellent means of interconnecting the device 32 to the printed circuit board 34 via the board 36. In one configuration, the detachable removable connector can be placed between the electronic device to be tested and a test printed circuit board to provide a connection between the electronic device and the edge test printed circuit board. The electronic interface, while simultaneously reducing the wear and tear problems on the test printed circuit board. This connection is therefore available as a disposable wear component for test processing. The present invention also encompasses the detection of an electronic device (such as an integrated circuit) as shown in FIG. A package body 9 that does not contain an integrated circuit is interconnected to a PCB 34 that utilizes an ACE material layer 94. The top of the package body 13 200827886 90 is made open only by pressing it to the ACE at the periphery or edge of the closure, ie as described by the frame-shaped sweet clip device The necessary pressing force can be provided on the ACE layer 9 to achieve an electronic interconnection between the 4 capping bodies 9 and the printed circuit board 3*. Alternatively, the package carrier can be permanently attached to the PCB, for example, by a solder joint. A semiconductor industry has both reduced the size of semiconductor devices and at the same time raised the density or amount of contact 'points or conductors' on the semiconductor wafer, so that the available distance or spacing between the material contact points corresponds. Zoom out. The integrated circuit device of the 疋 置 92 has a conductor with a very fine pitch - which can be as thin as 2 2 _ or less. One purpose of the package body 9 is to provide a means for converting the high density or fine pitch of the integrated circuit to the low or relative pitch of the pcB. In this particular embodiment of the invention, an improved test functionality can be provided for use with an ACE material as a profiler test system for the profiler system. Constructable - ACE material, (f is the magnetic alignment of the fine particles to meet the fine pitch requirements required by the low cost, surface performance profiler system. The package body 9 and the integrated circuit 92 can be used. The use of the second layer of woven material to obtain low cost, high performance test functionality, without the need for a different, complicated and expensive profiler device between the integrated circuit and the plenum. A further embodiment of January may be as shown in Figure 6. In this embodiment, the detachable removable electronic connector m can at least partially achieve an electron between the electronic device 16A and the pCB 167. Interface: This is a converter board i 63, which is coupled to an A (3) material layer 14 200827886 1 65. The conversion screen board 63 can be designed to improve the electronic device 丨7〇 Hardness and can be constructed with a plurality of thin layers (not shown). A second ACE material layer (not shown) can also be incorporated between the converter board 163 and the electronic device 160. The converter plate 163 contains a first set of electronic contacts 162. The electronic contacts 162 may be aligned and have the same pitch as the electronic conductors 116 of the electronic device 160. The electronic contacts 1 62 may be designed to accommodate different electronic conductor configurations, including, Rather, the ball grid array, the area grid array, and the pin grid array. The converter board 163 further includes a second set of electronic contacts 164. The electronic contacts 164 can be aligned And having the same pitch as the electronic conductor 166 of the pCB 167. The converter board 163 is interfaced with the ace material to at least partially achieve an electrical contact between the electronic contacts 164 and the electronic conductor 166 of the PCB 167. Electronic interface The electronic interface between the electronic contacts 162 and the electronic contact 164 of the converter board 163 is achieved by an electronic circuit (not shown). In a group of evil, the converter board 1 63 The top layer contains circuit traces connecting the respective electronic contact points to a corresponding contact point board. The bottom layer of the converter board 163 also includes connecting the electronic contact points 164 to a corresponding one. The circuit traces of the contact point board. The contact point plates on the top layer of the converter board 163 are placed in accordance with the contact plates aligned on the bottom layer of the converter board 163 and through the concentric penetrating holes in the layers. The two sets of contact points are electrically connected to form an electronic circuit, and other configurations are also considered, including contact points on the top and bottom layers of the converter board = 15 200827886 Alternative arrangement, electronic connection An alternative device for group contact plates and a converter plate having more than two thin layers is within the scope of the present invention. In a further embodiment, as shown in Figure 7, the electronic device 160 is removable. The method is mounted on a slot 18, wherein the slot 18 provides an electronic interface between the device 160 and the converter board 163. The slot 180 can be incorporated into a contact point such as a spring contact or can be constructed using ACE material. The slot 18 can further include means known in the art for aligning the electronic device 6 with the converter board i 63. In one configuration, the slot 18A includes a plurality of contact pads 181, wherein the contact pads 180 are aligned with corresponding conductors 161 from the device ;6〇; and a plurality of Corresponding to internal conductors 1 83, the turns are used to connect the plurality of contact pads 18 8 to a plurality of conductors 182 on the bottom surface of the test socket 18 . Other slots 180'configurations' can be considered and are within the scope of the invention. 8-11 show a further embodiment of the present invention, wherein FIG. 8 is a specific embodiment, and a second embodiment is illustrated. In Figure 8, an ACE material layer 820 is attached to a frame 8丨〇. The frame 810 defines a perimeter and an opening. In a preferred embodiment, the frame 810 is substantially rectangular. However, in other embodiments, the frame 81 can be substantially angular, substantially angular, or substantially arbitrarily defined. The continuous shape of the boundary and opening. The ACE layer 820 extends over the opening of the frame 810 and is subject to force on the opening of the frame 81. In a preferred embodiment, the ACE layer 82 is attached to the frame 810 by an adhesive 83〇16 200827886, although other methods of attachment known in the art can be considered and belong to the present invention. Within the scope. That is, as shown in FIG. 9, in a particular embodiment of the invention, the detachable removable electronic connector 970 includes an adapter plate 963; and an ace layer 820, which is attached by an adhesive 830. Attached to a frame 8丨〇. The adapter plate 963 includes a first set of electronic contacts 962 and a second set of electronic contacts 964. The adapter plate 963 further includes a channel or recessed slot 980 that is sized and shaped to be handed over and at least partially encased in the frame 810 for a reduced profile of the connector 970. In a preferred embodiment, the channel or recessed slot 980 is sized and shaped to interface and encase the frame 8 at least three sides. The frame 810 is received or placed within the channel 980 of the adapter plate 963 such that the second set of electronic contacts 964 are in contact with the Ace layer 820. In a preferred embodiment, the second set of electronic contacts 964 and an aCE layer 820 are in sufficient contact to at least partially achieve an electron between the adapter board 963 and the ACE layer 820. connection. That is, as shown in FIG. 10, the detachable removable electrical connector 87 can at least partially achieve the pCB or the electronic device 96 having one or more electronic conductors 961 and the one or more electronic conductors 966. The electronic interface between the substrates 967. The pitch of the electronic device 96〇 may be the same as the pitch of the PCB or the substrate 967. However, in other embodiments, the connector 970 may be designed to convert the pitch of the electronic device 96〇 into the pitch of the substrate 967. The pitch of the germanium electronic device 960 can be equal to, greater than, or less than the pitch of the substrate 967. 17 200827886 further refers to the electronic contact 964 of the adapter board 963 electronically coupled to the ACE layer 820 to at least partially achieve the electronic contact point 964 of the adapter board 963 and The PCB, the electronic interface between the 导体 导体 conductors 966. The electronic contacts 9 can also be placed and have the same spacing as the electronic conductor 96M of the PCB 967, but also: to other electronic contacts, point 964 and the electronic conductor_configuration, are also within the scope of the invention. In a preferred embodiment, the electronic contact 964 of the cough adapter & 963 can be an electronic conductor 966 that is aligned with the PCB 967 by using an alignment pin: (not shown), although the industry has considered Other alignment devices are known and are within the scope of the invention. The electronic contact 964 of the adapter board 963 can also be placed in alignment with the electronic conductor 961 of the sub-device 960 and have a spacing of two, although other electronic contacts 962 and electronic conductor configurations can be considered, and It is within the scope of the invention. The electronic contacts and 964 can be designed to accommodate different electronic conductor configurations including, but not limited to, ball grid arrays, face grid arrays, and pin grid arrays. In an alternative embodiment, a second layer of ACE material (not shown) may be incorporated between the adapter plate 963 and the sub-assembly 960. The second layer of ACE material is at least partially achieved - an electronic interface between the electronic contact 962 of the adapter board 963 and the electronic conductor of the electronic device 96. That is, as shown in Figure η, in an alternative embodiment of the invention shown in Figure 9 _i", the electronic M 96G system is contained within a 襄 18 200827886 body or slot 1120. A pressing force is applied to the ACe layer 820 to at least partially establish an electrical connection between the slot ΐ2〇 and the substrate or ACE 820 by using a pressing bolt 111〇, but other industries are known. A device for pressing the ACE layer 82 is considered to be within the scope of the present invention. A further embodiment of the invention may be as shown in FIG. In Figure 12, the detachable removable electrical connector 丨 2 丨〇 includes an adapter plate 1220 and an ACE layer 123 〇. The adapter plate 122 includes a narrow groove or channel 1240. The ACE layer 1230 is directly coupled to the adapter plate 220 by an adhesive, and is preferably an anthrone resin. In a preferred embodiment, one or more holes 125 are formed in one of the top surfaces 1260 of the adapter plate 122. Then, the ace layer 123 is mechanically coupled to one of the bottom surfaces 1270 of the adapter plate 1220, and the groove 125(?) is filled with the adhesive through the one or more holes 125? (not shown). Then, after the adhesive is cured, the ACE layer 1230 is directly adhered to the bottom surface 12 70 ' of the adapter plate 122 而 and the mechanical coupling can be removed at this time. In a further embodiment, the ACE layer 1230 can be cured under tension. Although the particular features of the present invention are shown in some of the drawings, the specific features of the present invention are shown for the sake of simplicity, as some of the features may be combined with any or all of the other characteristics in accordance with the present invention. Those skilled in the art will be aware of other specific embodiments and are within the scope of the patent application. 19 200827886 [Simplified description of the drawings] The detailed description of the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Those skilled in the art will be aware of other objects, features and advantages. 2 is a side view of a prior art (4) separable electronic interconnector; FIG. 2 is a representative side view of one embodiment of the present invention; FIG. 3 is a partially enlarged partial cross-sectional view of the electronically disposed, This embodiment is electronically coupled to an ace layer in accordance with an embodiment of the present invention; FIG. 4 is a side elevational view of another embodiment of the present invention utilizing two layers of ACE material; FIG. 5 is a A side view of an alternative embodiment in which the ACE material layer is utilized to complete the functionality of the complex profiler system; Figure 6 is a side view of an alternative embodiment of the invention with a spacing of The electronically cracked profile is converted to a relatively coarse pitch of the printed circuit board; Figure 7 is a side elevational view of an alternative embodiment of the present invention having a fine pitch and included in an electronic device in a test slot Profile Figure 8 is a rougher view of a printed circuit board; Figure 8 is a wear side view of the ACE layer, which is used in a particular embodiment of the invention to be lightly coupled to - 匡 _. Figure 9 is a A cross-sectional view of an alternative embodiment, comprising an ACE layer coupled to a frame as shown in FIG. 8; and an adapter plate containing a channel for handing over the frame; Figure 9 is a cross-sectional view of the invention further showing a 20 200827886 electronic device and a printed circuit board; Figure π is a cross-sectional view of an alternative embodiment of the present invention, wherein the electronic device is placed in a slot And exerting a pressing force to achieve electronic interaction between the slot and the printed circuit board; and FIG. 12 is a cross-sectional view of an alternative embodiment of the present invention including an -ACE layer, the layer Directly attached to an adapter plate, the plate contains a channel containing an adhesive. [Main component symbol description] 32 Electronic device 34 Substrate 36 Adapter plate 38 ACE layer 38a Second ACE material 40 Frame assembly 42 Heat sink 44 Spring plate 46 Retaining pin 48 Load screw 50 Spherical grid array 52 Needle type Grid array 54 Insulating underfill material 56 Heat dissipating material 21 200827886 64 Hard solid plate 70 Ball grid array electronic package 71 Ball 72 ACE material 74 Elastic circuit member 76 Hole 78 Flat surface area 80 Conductor member 90 Package body 92 Device 94 ACE material layer 96 second ACE material layer 100 jaw device 160 electronic device 161 electronic conductor 162 electronic contact point 163 converter plate 164 electronic contact point 165 ACE material layer 166 electronic conductor 167 substrate 170 detachable removable electronic connector 180 Slot 181 Contact Point Plate 22 200827886 182 Conductor 183 Inner Conductor 810 Frame 820 ACE Layer 830 Adhesive 962 First Set of Electronic Contact Points 963 Adapter Plate 964 Second Set of Electronic Contact Points 966 Electronic Conductor 967 Substrate 970 Separable Remove the electrical connector 980 channel/recess slot 1110 Package supporting member 1120 manufactured by bolt / slot adapter board 1220 1240 1230 ACE trench layer / hole 1260 1250 channel bottom surface 23 top surface 1270