JP5547615B2 - 配線基板、半導体装置及び配線基板の製造方法 - Google Patents

配線基板、半導体装置及び配線基板の製造方法 Download PDF

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Publication number
JP5547615B2
JP5547615B2 JP2010254494A JP2010254494A JP5547615B2 JP 5547615 B2 JP5547615 B2 JP 5547615B2 JP 2010254494 A JP2010254494 A JP 2010254494A JP 2010254494 A JP2010254494 A JP 2010254494A JP 5547615 B2 JP5547615 B2 JP 5547615B2
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Prior art keywords
layer
wiring
insulating layer
wiring layer
wiring board
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JP2010254494A
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Japanese (ja)
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JP2012104774A5 (enExample
JP2012104774A (ja
Inventor
茂次 村松
規貴 片桐
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2010254494A priority Critical patent/JP5547615B2/ja
Priority to US13/293,857 priority patent/US9741647B2/en
Publication of JP2012104774A publication Critical patent/JP2012104774A/ja
Publication of JP2012104774A5 publication Critical patent/JP2012104774A5/ja
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    • H10W70/685—
    • H10W70/635—
    • H10W74/15—
    • H10W90/724—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2010254494A 2010-11-15 2010-11-15 配線基板、半導体装置及び配線基板の製造方法 Active JP5547615B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010254494A JP5547615B2 (ja) 2010-11-15 2010-11-15 配線基板、半導体装置及び配線基板の製造方法
US13/293,857 US9741647B2 (en) 2010-11-15 2011-11-10 Wiring substrate, semiconductor device, and method of manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010254494A JP5547615B2 (ja) 2010-11-15 2010-11-15 配線基板、半導体装置及び配線基板の製造方法

Publications (3)

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JP2012104774A JP2012104774A (ja) 2012-05-31
JP2012104774A5 JP2012104774A5 (enExample) 2013-07-25
JP5547615B2 true JP5547615B2 (ja) 2014-07-16

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JP (1) JP5547615B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9275925B2 (en) * 2013-03-12 2016-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for an improved interconnect structure
JP6169955B2 (ja) * 2013-04-17 2017-07-26 新光電気工業株式会社 配線基板及びその製造方法
WO2014181697A1 (ja) * 2013-05-08 2014-11-13 株式会社村田製作所 多層配線基板
KR102163041B1 (ko) * 2013-11-19 2020-10-08 삼성전기주식회사 회로기판, 회로기판 제조방법 및 2단 비아 구조
JP5662551B1 (ja) 2013-12-20 2015-01-28 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
TWI504320B (zh) * 2014-06-17 2015-10-11 矽品精密工業股份有限公司 線路結構及其製法
JP7112877B2 (ja) * 2018-04-20 2022-08-04 新光電気工業株式会社 センサモジュール
US10643943B2 (en) * 2018-06-25 2020-05-05 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure, package-on-package structure and manufacturing method thereof
JP2021125643A (ja) * 2020-02-07 2021-08-30 キオクシア株式会社 半導体装置およびその製造方法
TWI781049B (zh) * 2022-01-24 2022-10-11 欣興電子股份有限公司 電路板結構及其製作方法
US20250038093A1 (en) * 2023-07-27 2025-01-30 Taiwan Semiconductor Manufacturing Company Limited Interposers including line-on-via and line-in-via interconnect structures and methods of forming the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2720865B2 (ja) 1996-01-22 1998-03-04 日立エーアイシー株式会社 多層印刷配線板およびその製造方法
US6492719B2 (en) * 1999-07-30 2002-12-10 Hitachi, Ltd. Semiconductor device
JP4869488B2 (ja) 2000-12-15 2012-02-08 イビデン株式会社 多層プリント配線板の製造方法
JP2004273575A (ja) 2003-03-05 2004-09-30 Sony Corp 多層プリント配線基板及びその製造方法
US7211289B2 (en) * 2003-12-18 2007-05-01 Endicott Interconnect Technologies, Inc. Method of making multilayered printed circuit board with filled conductive holes
KR100688701B1 (ko) 2005-12-14 2007-03-02 삼성전기주식회사 랜드리스 비아홀을 구비한 인쇄회로기판의 제조방법
JP5324051B2 (ja) * 2007-03-29 2013-10-23 新光電気工業株式会社 配線基板の製造方法及び半導体装置の製造方法及び配線基板
JP2008283140A (ja) * 2007-05-14 2008-11-20 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板
KR100990618B1 (ko) 2008-04-15 2010-10-29 삼성전기주식회사 랜드리스 비아홀을 갖는 인쇄회로기판 및 그 제조방법
JP2010103435A (ja) 2008-10-27 2010-05-06 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP2011165741A (ja) * 2010-02-05 2011-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
US8541693B2 (en) * 2010-03-31 2013-09-24 Ibiden Co., Ltd. Wiring board and method for manufacturing the same

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US9741647B2 (en) 2017-08-22
JP2012104774A (ja) 2012-05-31
US20120119377A1 (en) 2012-05-17

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