JP5535448B2 - 半導体装置、半導体装置の実装方法、および半導体装置の実装構造 - Google Patents
半導体装置、半導体装置の実装方法、および半導体装置の実装構造 Download PDFInfo
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Description
2 電極(半導体基板に設けられた電極)
4 Cuバンプ(半導体基板に設けられた電極)
5 実装基板
6 電極(実装基板に設けられた電極)
30〜39 Cu層(金属材料、金属材料の層、銅)
70 Cu3Sn層(金属間化合物)
71 Cu6Sn5層(金属間化合物)
100〜103、106〜109、111、112、114〜116、118、119
半田層(接合材料、接合材料の層、錫)
117、120〜122 金属間化合物層
Claims (11)
- 金属接合により、実装基板と、接合および電気的に接続される半導体装置であって、
上記接合および電気的接続に使用される接合材料との相互拡散により金属間化合物を形成するための金属材料の層を備えるメタルバンプが、半導体基板に設けられた第1電極に堆積され、
上記メタルバンプは、上記接合材料からなる第1接合材料層に上記金属材料の層が積層されたメタルバンプ積層層であり、かつ、該メタルバンプ積層層は上記第1電極上に2層以上5層以下で積層され、
上記金属材料の層と、金属材料で構成されていると共に
上記実装基板に設けられた第2電極とが、上記接合材料からなる第2接合材料層により金属接合され、
上記第1接合材料層および上記第2接合材料層が、上記第1電極、上記第2電極および上記金属材料の層を起点として、上記金属材料の層と相互拡散を呈することで金属間化合物化しており、
上記金属材料の層が、上記第2接合材料層よりも厚く形成されていることを特徴とする半導体装置。 - 上記メタルバンプに、上記接合材料の層がさらに積層されていることを特徴とする請求項1に記載の半導体装置。
- 少なくとも1層の、上記接合材料の層の厚みは、3μm以上12μm以下であることを特徴とする請求項1または2に記載の半導体装置。
- 上記接合材料の層および上記金属材料の層の、少なくとも一方は、めっき法により形成された膜であることを特徴とする請求項1、2または3に記載の半導体装置。
- 複数の上記接合材料の層が、一体的に形成されていることを特徴とする請求項1または2に記載の半導体装置。
- 上記接合材料は錫であり、上記金属材料は銅であることを特徴とする請求項1〜5のいずれか1項に記載の半導体装置。
- 金属接合による接合および電気的接続に使用される接合材料からなる第1接合材料層と、該接合材料との相互拡散により金属間化合物を形成するための金属材料とを備え、上記第1接合材料層に上記金属材料の層が積層されるメタルバンプ積層層を、半導体基板に設けられた第1電極上に2層以上5層以下で積層されるように堆積し、
上記金属材料で構成されていると共に実装基板に設けられた第2電極に、プリコート法またはめっき法により、第2接合材料層を形成するように上記接合材料を堆積し、
上記第1接合材料層および上記第2接合材料層が、上記第1電極、上記第2電極および上記金属材料の層を起点として、上記金属材料の層と相互拡散を呈することで金属間化合物化するように、上記金属材料の層と、上記第1電極および上記第2電極との金属接合をそれぞれ上記第1接合材料層および上記第2接合材料層により行い、
上記金属材料の層を、上記第2接合材料層よりも厚く形成することを特徴とする半導体装置の実装方法。 - 金属接合による接合および電気的接続に使用される接合材料からなる第1接合材料層に、該第1接合材料層との相互拡散により金属間化合物を形成するための金属材料の層を積層されるメタルバンプ積層層を、半導体基板に設けられた第1電極上に2層以上5層以下で積層し、
上記金属材料で構成されていると共に実装基板に設けられた第2電極に、プリコート法またはめっき法により、第2接合材料層を形成するように上記接合材料を堆積し、
上記第1接合材料層および上記第2接合材料層が、上記第1電極、上記第2電極および上記金属材料の層を起点として、上記金属材料の層と相互拡散を呈することで金属間化合物化するように、上記金属材料の層と、上記第1電極および上記第2電極との金属接合をそれぞれ上記第1接合材料層および上記第2接合材料層により行い、
上記金属材料の層を、上記第2接合材料層よりも厚く形成することを特徴とする半導体装置の実装方法。 - 金属接合による接合および電気的接続に使用される接合材料からなる第1接合材料層に、該第1接合材料層との相互拡散により金属間化合物を形成するための金属材料の層を積層されるメタルバンプ積層層を、半導体基板に設けられた第1電極上に2層以上5層以下で積層し、
上記メタルバンプ積層層に、上記第1接合材料層をさらに積層し、
上記第1接合材料層と、上記金属材料で構成されていると共に実装基板に設けられた第2電極に形成された上記接合材料からなる第2接合材料層とが、上記第1電極、上記第2電極および上記金属材料の層を起点として、上記金属材料の層と相互拡散を呈することで金属間化合物化するように、上記金属材料の層と、上記第1電極および上記第2電極との金属接合をそれぞれ上記第1接合材料層および上記第2接合材料層により行い、
上記金属材料の層を、上記第2接合材料層よりも厚く形成することを特徴とする半導体装置の実装方法。 - 上記実装基板は、セラミック基板、有機基板、およびシリコンインターポーザ基板のいずれかであることを特徴とする請求項7〜9のいずれか1項に記載の半導体装置の実装方法。
- 請求項7〜10のいずれか1項に記載の半導体装置の実装方法により、上記実装基板と上記半導体装置とが実装されたことを特徴とする半導体装置の実装構造。
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