JP5523062B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP5523062B2
JP5523062B2 JP2009254548A JP2009254548A JP5523062B2 JP 5523062 B2 JP5523062 B2 JP 5523062B2 JP 2009254548 A JP2009254548 A JP 2009254548A JP 2009254548 A JP2009254548 A JP 2009254548A JP 5523062 B2 JP5523062 B2 JP 5523062B2
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Japan
Prior art keywords
substrate
unit
nozzle
physical tool
liquid
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Active
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JP2009254548A
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English (en)
Japanese (ja)
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JP2010153807A (ja
JP2010153807A5 (enExample
Inventor
航之介 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009254548A priority Critical patent/JP5523062B2/ja
Priority to TW098138471A priority patent/TWI415207B/zh
Priority to KR1020090110953A priority patent/KR101068755B1/ko
Priority to US12/621,663 priority patent/US9202724B2/en
Publication of JP2010153807A publication Critical patent/JP2010153807A/ja
Publication of JP2010153807A5 publication Critical patent/JP2010153807A5/ja
Application granted granted Critical
Publication of JP5523062B2 publication Critical patent/JP5523062B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/0804—Cleaning containers having tubular shape, e.g. casks, barrels, drums
    • B08B9/0813—Cleaning containers having tubular shape, e.g. casks, barrels, drums by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
    • B08B9/28—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus cleaning by splash, spray, or jet application, with or without soaking
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/005—Drying solid materials or objects by processes not involving the application of heat by dipping them into or mixing them with a chemical liquid, e.g. organic; chemical, e.g. organic, dewatering aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2009254548A 2008-11-20 2009-11-06 基板処理装置および基板処理方法 Active JP5523062B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009254548A JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法
TW098138471A TWI415207B (zh) 2008-11-20 2009-11-12 A substrate processing apparatus and a substrate processing method
KR1020090110953A KR101068755B1 (ko) 2008-11-20 2009-11-17 기판 처리 장치 및 기판 처리 방법
US12/621,663 US9202724B2 (en) 2008-11-20 2009-11-19 Substrate treatment apparatus and substrate treatment method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008296301 2008-11-20
JP2008296301 2008-11-20
JP2009254548A JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2010153807A JP2010153807A (ja) 2010-07-08
JP2010153807A5 JP2010153807A5 (enExample) 2012-12-20
JP5523062B2 true JP5523062B2 (ja) 2014-06-18

Family

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Application Number Title Priority Date Filing Date
JP2009254548A Active JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法

Country Status (4)

Country Link
US (1) US9202724B2 (enExample)
JP (1) JP5523062B2 (enExample)
KR (1) KR101068755B1 (enExample)
TW (1) TWI415207B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法
US10043651B2 (en) * 2011-06-23 2018-08-07 Brooks Automation (Germany) Gmbh Semiconductor cleaner systems and methods
US9623449B2 (en) 2012-04-09 2017-04-18 Lam Research Corporation Dielectric window cleaning apparatuses
JP6250924B2 (ja) 2012-10-02 2017-12-20 株式会社荏原製作所 基板洗浄装置および研磨装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
JP2015023138A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ スピンナ洗浄装置
TWI597770B (zh) * 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
CN104607430B (zh) * 2013-11-01 2016-08-17 沈阳芯源微电子设备有限公司 一种胶杯自动清洗的方法
KR102424630B1 (ko) * 2016-07-27 2022-07-25 도쿄엘렉트론가부시키가이샤 도포막 형성 방법, 도포막 형성 장치 및 컴퓨터 판독 가능한 기록 매체
US10509321B2 (en) * 2018-01-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature controlling apparatus and method for forming coating layer
CN111286886A (zh) * 2018-12-08 2020-06-16 泰兴市佰银服饰有限公司 一种纺织纺织布料加湿器
CN111359954A (zh) * 2020-03-12 2020-07-03 李义飞 一种用于新能源汽车铝合金轮毂智能清洗器
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
JP2023137995A (ja) * 2022-03-18 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN119650457A (zh) * 2023-09-15 2025-03-18 盛美半导体设备(上海)股份有限公司 基板处理方法及基板处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3140556B2 (ja) * 1992-04-23 2001-03-05 沖電気工業株式会社 半導体ウエハの洗浄方法
KR100488753B1 (ko) * 2001-07-23 2005-05-11 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 그 장치
JP4481576B2 (ja) * 2003-02-28 2010-06-16 芝浦メカトロニクス株式会社 ペースト塗布装置
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4759359B2 (ja) * 2005-10-07 2011-08-31 芝浦メカトロニクス株式会社 基板の処理装置
JP4986566B2 (ja) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2010153807A (ja) 2010-07-08
US9202724B2 (en) 2015-12-01
TWI415207B (zh) 2013-11-11
TW201023287A (en) 2010-06-16
KR101068755B1 (ko) 2011-09-28
US20100122772A1 (en) 2010-05-20
KR20100056975A (ko) 2010-05-28

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