JP2010153807A5 - - Google Patents

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Publication number
JP2010153807A5
JP2010153807A5 JP2009254548A JP2009254548A JP2010153807A5 JP 2010153807 A5 JP2010153807 A5 JP 2010153807A5 JP 2009254548 A JP2009254548 A JP 2009254548A JP 2009254548 A JP2009254548 A JP 2009254548A JP 2010153807 A5 JP2010153807 A5 JP 2010153807A5
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JP
Japan
Prior art keywords
substrate
unit
nozzle
physical tool
moving mechanism
Prior art date
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Application number
JP2009254548A
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English (en)
Japanese (ja)
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JP2010153807A (ja
JP5523062B2 (ja
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Application filed filed Critical
Priority to JP2009254548A priority Critical patent/JP5523062B2/ja
Priority claimed from JP2009254548A external-priority patent/JP5523062B2/ja
Priority to TW098138471A priority patent/TWI415207B/zh
Priority to KR1020090110953A priority patent/KR101068755B1/ko
Priority to US12/621,663 priority patent/US9202724B2/en
Publication of JP2010153807A publication Critical patent/JP2010153807A/ja
Publication of JP2010153807A5 publication Critical patent/JP2010153807A5/ja
Application granted granted Critical
Publication of JP5523062B2 publication Critical patent/JP5523062B2/ja
Active legal-status Critical Current
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JP2009254548A 2008-11-20 2009-11-06 基板処理装置および基板処理方法 Active JP5523062B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009254548A JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法
TW098138471A TWI415207B (zh) 2008-11-20 2009-11-12 A substrate processing apparatus and a substrate processing method
KR1020090110953A KR101068755B1 (ko) 2008-11-20 2009-11-17 기판 처리 장치 및 기판 처리 방법
US12/621,663 US9202724B2 (en) 2008-11-20 2009-11-19 Substrate treatment apparatus and substrate treatment method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008296301 2008-11-20
JP2008296301 2008-11-20
JP2009254548A JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2010153807A JP2010153807A (ja) 2010-07-08
JP2010153807A5 true JP2010153807A5 (enExample) 2012-12-20
JP5523062B2 JP5523062B2 (ja) 2014-06-18

Family

ID=42171054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009254548A Active JP5523062B2 (ja) 2008-11-20 2009-11-06 基板処理装置および基板処理方法

Country Status (4)

Country Link
US (1) US9202724B2 (enExample)
JP (1) JP5523062B2 (enExample)
KR (1) KR101068755B1 (enExample)
TW (1) TWI415207B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法
US10043651B2 (en) * 2011-06-23 2018-08-07 Brooks Automation (Germany) Gmbh Semiconductor cleaner systems and methods
US9623449B2 (en) 2012-04-09 2017-04-18 Lam Research Corporation Dielectric window cleaning apparatuses
JP6250924B2 (ja) 2012-10-02 2017-12-20 株式会社荏原製作所 基板洗浄装置および研磨装置
JP6148475B2 (ja) * 2013-01-25 2017-06-14 株式会社東芝 半導体製造装置および半導体装置の製造方法
US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
JP2015023138A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ スピンナ洗浄装置
TWI597770B (zh) * 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
CN104607430B (zh) * 2013-11-01 2016-08-17 沈阳芯源微电子设备有限公司 一种胶杯自动清洗的方法
KR102424630B1 (ko) * 2016-07-27 2022-07-25 도쿄엘렉트론가부시키가이샤 도포막 형성 방법, 도포막 형성 장치 및 컴퓨터 판독 가능한 기록 매체
US10509321B2 (en) * 2018-01-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature controlling apparatus and method for forming coating layer
CN111286886A (zh) * 2018-12-08 2020-06-16 泰兴市佰银服饰有限公司 一种纺织纺织布料加湿器
CN111359954A (zh) * 2020-03-12 2020-07-03 李义飞 一种用于新能源汽车铝合金轮毂智能清洗器
KR102762332B1 (ko) * 2020-09-02 2025-02-03 에스케이하이닉스 주식회사 기판의 평탄화 장치 및 방법
JP2023137995A (ja) * 2022-03-18 2023-09-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN119650457A (zh) * 2023-09-15 2025-03-18 盛美半导体设备(上海)股份有限公司 基板处理方法及基板处理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3140556B2 (ja) * 1992-04-23 2001-03-05 沖電気工業株式会社 半導体ウエハの洗浄方法
KR100488753B1 (ko) * 2001-07-23 2005-05-11 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 그 장치
JP4481576B2 (ja) * 2003-02-28 2010-06-16 芝浦メカトロニクス株式会社 ペースト塗布装置
JP4527660B2 (ja) * 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4759359B2 (ja) * 2005-10-07 2011-08-31 芝浦メカトロニクス株式会社 基板の処理装置
JP4986566B2 (ja) * 2005-10-14 2012-07-25 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5523062B2 (ja) * 2008-11-20 2014-06-18 芝浦メカトロニクス株式会社 基板処理装置および基板処理方法

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