JP5522776B2 - 基板処理装置、基板処理装置の制御方法及びメンテナンス方法 - Google Patents

基板処理装置、基板処理装置の制御方法及びメンテナンス方法 Download PDF

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Publication number
JP5522776B2
JP5522776B2 JP2009209150A JP2009209150A JP5522776B2 JP 5522776 B2 JP5522776 B2 JP 5522776B2 JP 2009209150 A JP2009209150 A JP 2009209150A JP 2009209150 A JP2009209150 A JP 2009209150A JP 5522776 B2 JP5522776 B2 JP 5522776B2
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maintenance
screen
information
setting
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Japanese (ja)
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JP2010098298A (ja
JP2010098298A5 (enExample
Inventor
雅子 末吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Priority to JP2009209150A priority Critical patent/JP5522776B2/ja
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Publication of JP2010098298A5 publication Critical patent/JP2010098298A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
JP2009209150A 2008-09-18 2009-09-10 基板処理装置、基板処理装置の制御方法及びメンテナンス方法 Active JP5522776B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009209150A JP5522776B2 (ja) 2008-09-18 2009-09-10 基板処理装置、基板処理装置の制御方法及びメンテナンス方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008238826 2008-09-18
JP2008238826 2008-09-18
JP2009209150A JP5522776B2 (ja) 2008-09-18 2009-09-10 基板処理装置、基板処理装置の制御方法及びメンテナンス方法

Publications (3)

Publication Number Publication Date
JP2010098298A JP2010098298A (ja) 2010-04-30
JP2010098298A5 JP2010098298A5 (enExample) 2012-10-18
JP5522776B2 true JP5522776B2 (ja) 2014-06-18

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JP2009209150A Active JP5522776B2 (ja) 2008-09-18 2009-09-10 基板処理装置、基板処理装置の制御方法及びメンテナンス方法

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JP (1) JP5522776B2 (enExample)
WO (1) WO2010032499A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5841336B2 (ja) * 2011-02-08 2016-01-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および情報管理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08161007A (ja) * 1994-12-09 1996-06-21 Canon Inc 制御装置
JP3954124B2 (ja) * 1996-02-21 2007-08-08 株式会社日立国際電気 半導体製造装置
JP4024888B2 (ja) * 1996-10-17 2007-12-19 株式会社日立国際電気 半導体製造装置の制御装置
JP4355193B2 (ja) * 2003-11-10 2009-10-28 株式会社ルネサステクノロジ 半導体デバイスの製造方法及び半導体デバイス製造システム
JP4513102B2 (ja) * 2006-02-06 2010-07-28 東京エレクトロン株式会社 処理装置における処理器具の交換方法及び交換用プログラム
JP2007329345A (ja) * 2006-06-08 2007-12-20 Hitachi Kokusai Electric Inc 基板処理装置
JP4616798B2 (ja) * 2006-06-12 2011-01-19 株式会社日立国際電気 基板処理装置及び基板処理装置の表示方法
JP5142353B2 (ja) * 2006-09-29 2013-02-13 株式会社日立国際電気 基板処理装置、基板処理装置の異常検出方法、基板処理システム、基板処理装置の異常検出プログラム及び半導体装置の製造方法
JP2008147631A (ja) * 2006-11-17 2008-06-26 Hitachi Kokusai Electric Inc 基板処理装置
JP4447618B2 (ja) * 2007-03-16 2010-04-07 株式会社日立国際電気 半導体製造装置

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JP2010098298A (ja) 2010-04-30
WO2010032499A1 (ja) 2010-03-25

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