JP5514419B2 - 印刷回路基板を具備する表示装置及び印刷回路基板の製造方法 - Google Patents

印刷回路基板を具備する表示装置及び印刷回路基板の製造方法 Download PDF

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Publication number
JP5514419B2
JP5514419B2 JP2008233077A JP2008233077A JP5514419B2 JP 5514419 B2 JP5514419 B2 JP 5514419B2 JP 2008233077 A JP2008233077 A JP 2008233077A JP 2008233077 A JP2008233077 A JP 2008233077A JP 5514419 B2 JP5514419 B2 JP 5514419B2
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Japan
Prior art keywords
pattern
wiring
wiring pattern
ground
insulating substrate
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JP2008233077A
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Japanese (ja)
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JP2009071311A (ja
JP2009071311A5 (https=
Inventor
寛 滸 金
益 奎 張
知 萬 明
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3696—Generation of voltages supplied to electrode drivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/06—Handling electromagnetic interferences [EMI], covering emitted as well as received electromagnetic radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008233077A 2007-09-11 2008-09-11 印刷回路基板を具備する表示装置及び印刷回路基板の製造方法 Active JP5514419B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070091958A KR101385094B1 (ko) 2007-09-11 2007-09-11 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
KR10-2007-0091958 2007-09-11

Publications (3)

Publication Number Publication Date
JP2009071311A JP2009071311A (ja) 2009-04-02
JP2009071311A5 JP2009071311A5 (https=) 2011-10-20
JP5514419B2 true JP5514419B2 (ja) 2014-06-04

Family

ID=39863119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008233077A Active JP5514419B2 (ja) 2007-09-11 2008-09-11 印刷回路基板を具備する表示装置及び印刷回路基板の製造方法

Country Status (5)

Country Link
US (3) US8254136B2 (https=)
EP (1) EP2037722B1 (https=)
JP (1) JP5514419B2 (https=)
KR (1) KR101385094B1 (https=)
CN (1) CN101448361B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011239040A (ja) * 2010-05-06 2011-11-24 Canon Inc 撮像装置
DE102011113656A1 (de) * 2011-09-19 2013-03-21 Erni Electronics Gmbh Mehrlagige elektrische Leiterplatte
KR20160066649A (ko) * 2014-12-02 2016-06-13 삼성디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시장치
KR102317897B1 (ko) 2015-06-04 2021-10-28 삼성디스플레이 주식회사 테스트 보드 및 그의 구동방법
GB2540792A (en) * 2015-07-28 2017-02-01 Airbus Operations Ltd Vehicle fairing including an electrical routing
CN209329126U (zh) * 2016-05-17 2019-08-30 株式会社村田制作所 传输线路基板及电子设备
CN107831610A (zh) 2017-10-26 2018-03-23 惠科股份有限公司 信号传输装置及显示装置
US11670435B2 (en) 2021-04-09 2023-06-06 Apple Inc. Hybrid cabling solution for higher bandwidth and millimeter wave applications
KR20240127729A (ko) * 2023-02-16 2024-08-23 삼성전자주식회사 전자 장치 및 전자 장치의 동작 방법

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156493A (ja) * 1984-08-28 1986-03-22 日本電気株式会社 多層回路基板の電源配線構造
US5003273A (en) * 1989-12-04 1991-03-26 Itt Corporation Multilayer printed circuit board with pseudo-coaxial transmission lines
US5165055A (en) * 1991-06-28 1992-11-17 Digital Equipment Corporation Method and apparatus for a PCB and I/O integrated electromagnetic containment
EP0587144B1 (en) * 1992-09-08 1999-06-09 Seiko Epson Corporation Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus
US5376759A (en) * 1993-06-24 1994-12-27 Northern Telecom Limited Multiple layer printed circuit board
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
JPH1041637A (ja) * 1996-07-23 1998-02-13 Nec Corp 高密度多層配線基板
JP2867985B2 (ja) * 1996-12-20 1999-03-10 日本電気株式会社 プリント回路基板
US6246112B1 (en) * 1998-06-11 2001-06-12 Intel Corporation Interleaved signal trace routing
KR100293982B1 (ko) 1998-08-03 2001-07-12 윤종용 액정패널
KR100339019B1 (ko) 1999-05-31 2002-05-31 윤종용 차동 신호 배선 방법 및 차동 신호 배선을 갖는 인쇄회로기판이 실장된 액정 표시 장치
JP3669219B2 (ja) * 1999-08-10 2005-07-06 日本電気株式会社 多層プリント配線板
JP3267274B2 (ja) * 1999-08-13 2002-03-18 日本電気株式会社 多層プリント基板
TW507476B (en) * 1999-11-09 2002-10-21 Gul Technologies Singapore Ltd Printed circuit boards with in-board shielded circuitry and method of producing the same
JP2001144451A (ja) * 1999-11-12 2001-05-25 Ibi Tech Co Ltd 積層配線板
JP3542028B2 (ja) 2000-08-01 2004-07-14 インターナショナル・ビジネス・マシーンズ・コーポレーション Ｅｍｉ対策を施した回路基板
US6614325B1 (en) * 2000-08-31 2003-09-02 Northrop Grumman Corporation RF/IF signal distribution network utilizing broadside coupled stripline
JP3877132B2 (ja) * 2000-11-20 2007-02-07 富士通株式会社 多層配線基板及び半導体装置
CN1316858C (zh) * 2001-04-27 2007-05-16 日本电气株式会社 高频电路基板及其制造方法
US6420778B1 (en) * 2001-06-01 2002-07-16 Aralight, Inc. Differential electrical transmission line structures employing crosstalk compensation and related methods
JP4834937B2 (ja) * 2001-08-22 2011-12-14 凸版印刷株式会社 高周波回路用多層配線板
US6555745B1 (en) * 2001-10-19 2003-04-29 Medtronic, Inc. Electrical interconnect between an articulating display and a PC based planar board
JP4114353B2 (ja) * 2002-01-16 2008-07-09 凸版印刷株式会社 クロストークノイズ低減多層配線回路基板及びその製造方法
JP2003289184A (ja) 2002-03-28 2003-10-10 Canon Inc 多層プリント配線板
JP2003309378A (ja) * 2002-04-18 2003-10-31 Mitsubishi Electric Corp 信号伝送用多層配線板
TW587322B (en) * 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same
US7129416B1 (en) * 2004-02-05 2006-10-31 Apple Computer, Inc. Hybrid ground grid for printed circuit board
US7294791B2 (en) * 2004-09-29 2007-11-13 Endicott Interconnect Technologies, Inc. Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
KR100598118B1 (ko) * 2005-01-12 2006-07-10 삼성전자주식회사 적층형 인쇄회로기판
US7268645B2 (en) * 2005-05-09 2007-09-11 Seiko Epson Corporation Integrated resonator structure and methods for its manufacture and use
KR101256965B1 (ko) * 2005-06-22 2013-04-26 엘지디스플레이 주식회사 액정표시장치 및 그 구동방법
KR101192781B1 (ko) * 2005-09-30 2012-10-18 엘지디스플레이 주식회사 액정표시장치의 구동회로 및 이의 구동방법
KR100881303B1 (ko) * 2005-11-02 2009-02-03 이비덴 가부시키가이샤 반도체 장치용 다층 프린트 배선판 및 그 제조 방법
JP4808468B2 (ja) * 2005-11-04 2011-11-02 日本メクトロン株式会社 混成多層回路基板およびその製造方法
KR100768047B1 (ko) * 2005-11-30 2007-10-18 엘지.필립스 엘시디 주식회사 유기발광다이오드 표시소자 및 그의 구동 방법
US20070222052A1 (en) * 2006-03-24 2007-09-27 Kyocera Corporation Wiring structure, multilayer wiring board, and electronic device
US8134084B2 (en) * 2006-06-30 2012-03-13 Shin-Etsu Polymer Co., Ltd. Noise-suppressing wiring-member and printed wiring board
US8253721B2 (en) * 2006-11-28 2012-08-28 Lg Display Co., Ltd. Liquid crystal display device including source voltage generator and method of driving liquid crystal display device
JP5444619B2 (ja) * 2008-02-07 2014-03-19 株式会社ジェイテクト 多層回路基板およびモータ駆動回路基板
FR2966692B1 (fr) * 2010-10-26 2012-12-14 Sagem Defense Securite Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique

Also Published As

Publication number Publication date
US8254136B2 (en) 2012-08-28
US20170042020A1 (en) 2017-02-09
EP2037722A2 (en) 2009-03-18
CN101448361B (zh) 2013-08-07
US20120285009A1 (en) 2012-11-15
US20090066624A1 (en) 2009-03-12
JP2009071311A (ja) 2009-04-02
KR101385094B1 (ko) 2014-04-14
EP2037722A3 (en) 2010-01-27
KR20090026893A (ko) 2009-03-16
EP2037722B1 (en) 2012-03-21
CN101448361A (zh) 2009-06-03
US9930770B2 (en) 2018-03-27

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