JP2009071311A5 - - Google Patents
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- Publication number
- JP2009071311A5 JP2009071311A5 JP2008233077A JP2008233077A JP2009071311A5 JP 2009071311 A5 JP2009071311 A5 JP 2009071311A5 JP 2008233077 A JP2008233077 A JP 2008233077A JP 2008233077 A JP2008233077 A JP 2008233077A JP 2009071311 A5 JP2009071311 A5 JP 2009071311A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- ground
- wiring
- wiring pattern
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 3
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0091958 | 2007-09-11 | ||
| KR1020070091958A KR101385094B1 (ko) | 2007-09-11 | 2007-09-11 | 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009071311A JP2009071311A (ja) | 2009-04-02 |
| JP2009071311A5 true JP2009071311A5 (https=) | 2011-10-20 |
| JP5514419B2 JP5514419B2 (ja) | 2014-06-04 |
Family
ID=39863119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008233077A Active JP5514419B2 (ja) | 2007-09-11 | 2008-09-11 | 印刷回路基板を具備する表示装置及び印刷回路基板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8254136B2 (https=) |
| EP (1) | EP2037722B1 (https=) |
| JP (1) | JP5514419B2 (https=) |
| KR (1) | KR101385094B1 (https=) |
| CN (1) | CN101448361B (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011239040A (ja) * | 2010-05-06 | 2011-11-24 | Canon Inc | 撮像装置 |
| DE102011113656A1 (de) * | 2011-09-19 | 2013-03-21 | Erni Electronics Gmbh | Mehrlagige elektrische Leiterplatte |
| KR20160066649A (ko) * | 2014-12-02 | 2016-06-13 | 삼성디스플레이 주식회사 | 인쇄회로기판 및 이를 포함하는 표시장치 |
| KR102317897B1 (ko) | 2015-06-04 | 2021-10-28 | 삼성디스플레이 주식회사 | 테스트 보드 및 그의 구동방법 |
| GB2540792A (en) * | 2015-07-28 | 2017-02-01 | Airbus Operations Ltd | Vehicle fairing including an electrical routing |
| CN209329126U (zh) * | 2016-05-17 | 2019-08-30 | 株式会社村田制作所 | 传输线路基板及电子设备 |
| CN107831610A (zh) | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置及显示装置 |
| US11670435B2 (en) | 2021-04-09 | 2023-06-06 | Apple Inc. | Hybrid cabling solution for higher bandwidth and millimeter wave applications |
| KR20240127729A (ko) * | 2023-02-16 | 2024-08-23 | 삼성전자주식회사 | 전자 장치 및 전자 장치의 동작 방법 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156493A (ja) * | 1984-08-28 | 1986-03-22 | 日本電気株式会社 | 多層回路基板の電源配線構造 |
| US5003273A (en) * | 1989-12-04 | 1991-03-26 | Itt Corporation | Multilayer printed circuit board with pseudo-coaxial transmission lines |
| US5165055A (en) * | 1991-06-28 | 1992-11-17 | Digital Equipment Corporation | Method and apparatus for a PCB and I/O integrated electromagnetic containment |
| EP0867942B1 (en) * | 1992-09-08 | 2002-04-24 | Seiko Epson Corporation | Liquid crystal display apparatus |
| US5376759A (en) * | 1993-06-24 | 1994-12-27 | Northern Telecom Limited | Multiple layer printed circuit board |
| JP3113153B2 (ja) * | 1994-07-26 | 2000-11-27 | 株式会社東芝 | 多層配線構造の半導体装置 |
| JPH1041637A (ja) * | 1996-07-23 | 1998-02-13 | Nec Corp | 高密度多層配線基板 |
| JP2867985B2 (ja) * | 1996-12-20 | 1999-03-10 | 日本電気株式会社 | プリント回路基板 |
| US6246112B1 (en) * | 1998-06-11 | 2001-06-12 | Intel Corporation | Interleaved signal trace routing |
| KR100293982B1 (ko) | 1998-08-03 | 2001-07-12 | 윤종용 | 액정패널 |
| KR100339019B1 (ko) | 1999-05-31 | 2002-05-31 | 윤종용 | 차동 신호 배선 방법 및 차동 신호 배선을 갖는 인쇄회로기판이 실장된 액정 표시 장치 |
| JP3669219B2 (ja) * | 1999-08-10 | 2005-07-06 | 日本電気株式会社 | 多層プリント配線板 |
| JP3267274B2 (ja) * | 1999-08-13 | 2002-03-18 | 日本電気株式会社 | 多層プリント基板 |
| TW507476B (en) * | 1999-11-09 | 2002-10-21 | Gul Technologies Singapore Ltd | Printed circuit boards with in-board shielded circuitry and method of producing the same |
| JP2001144451A (ja) * | 1999-11-12 | 2001-05-25 | Ibi Tech Co Ltd | 積層配線板 |
| JP3542028B2 (ja) | 2000-08-01 | 2004-07-14 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Emi対策を施した回路基板 |
| US6614325B1 (en) * | 2000-08-31 | 2003-09-02 | Northrop Grumman Corporation | RF/IF signal distribution network utilizing broadside coupled stripline |
| JP3877132B2 (ja) * | 2000-11-20 | 2007-02-07 | 富士通株式会社 | 多層配線基板及び半導体装置 |
| CN1316858C (zh) * | 2001-04-27 | 2007-05-16 | 日本电气株式会社 | 高频电路基板及其制造方法 |
| US6420778B1 (en) * | 2001-06-01 | 2002-07-16 | Aralight, Inc. | Differential electrical transmission line structures employing crosstalk compensation and related methods |
| JP4834937B2 (ja) * | 2001-08-22 | 2011-12-14 | 凸版印刷株式会社 | 高周波回路用多層配線板 |
| US6555745B1 (en) * | 2001-10-19 | 2003-04-29 | Medtronic, Inc. | Electrical interconnect between an articulating display and a PC based planar board |
| JP4114353B2 (ja) * | 2002-01-16 | 2008-07-09 | 凸版印刷株式会社 | クロストークノイズ低減多層配線回路基板及びその製造方法 |
| JP2003289184A (ja) | 2002-03-28 | 2003-10-10 | Canon Inc | 多層プリント配線板 |
| JP2003309378A (ja) * | 2002-04-18 | 2003-10-31 | Mitsubishi Electric Corp | 信号伝送用多層配線板 |
| TW587322B (en) * | 2002-12-31 | 2004-05-11 | Phoenix Prec Technology Corp | Substrate with stacked via and fine circuit thereon, and method for fabricating the same |
| US7129416B1 (en) * | 2004-02-05 | 2006-10-31 | Apple Computer, Inc. | Hybrid ground grid for printed circuit board |
| US7294791B2 (en) * | 2004-09-29 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same |
| KR100598118B1 (ko) * | 2005-01-12 | 2006-07-10 | 삼성전자주식회사 | 적층형 인쇄회로기판 |
| US7268645B2 (en) * | 2005-05-09 | 2007-09-11 | Seiko Epson Corporation | Integrated resonator structure and methods for its manufacture and use |
| KR101256965B1 (ko) * | 2005-06-22 | 2013-04-26 | 엘지디스플레이 주식회사 | 액정표시장치 및 그 구동방법 |
| KR101192781B1 (ko) * | 2005-09-30 | 2012-10-18 | 엘지디스플레이 주식회사 | 액정표시장치의 구동회로 및 이의 구동방법 |
| KR100881303B1 (ko) * | 2005-11-02 | 2009-02-03 | 이비덴 가부시키가이샤 | 반도체 장치용 다층 프린트 배선판 및 그 제조 방법 |
| JP4808468B2 (ja) * | 2005-11-04 | 2011-11-02 | 日本メクトロン株式会社 | 混成多層回路基板およびその製造方法 |
| KR100768047B1 (ko) * | 2005-11-30 | 2007-10-18 | 엘지.필립스 엘시디 주식회사 | 유기발광다이오드 표시소자 및 그의 구동 방법 |
| US20070222052A1 (en) * | 2006-03-24 | 2007-09-27 | Kyocera Corporation | Wiring structure, multilayer wiring board, and electronic device |
| US8134084B2 (en) * | 2006-06-30 | 2012-03-13 | Shin-Etsu Polymer Co., Ltd. | Noise-suppressing wiring-member and printed wiring board |
| US8253721B2 (en) * | 2006-11-28 | 2012-08-28 | Lg Display Co., Ltd. | Liquid crystal display device including source voltage generator and method of driving liquid crystal display device |
| JP5444619B2 (ja) * | 2008-02-07 | 2014-03-19 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
| FR2966692B1 (fr) * | 2010-10-26 | 2012-12-14 | Sagem Defense Securite | Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique |
-
2007
- 2007-09-11 KR KR1020070091958A patent/KR101385094B1/ko active Active
-
2008
- 2008-03-29 EP EP08006205A patent/EP2037722B1/en active Active
- 2008-09-04 US US12/204,015 patent/US8254136B2/en active Active
- 2008-09-11 CN CN2008101769735A patent/CN101448361B/zh active Active
- 2008-09-11 JP JP2008233077A patent/JP5514419B2/ja active Active
-
2012
- 2012-07-24 US US13/556,274 patent/US20120285009A1/en not_active Abandoned
-
2016
- 2016-10-18 US US15/296,434 patent/US9930770B2/en active Active
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