KR101385094B1 - 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 - Google Patents

인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 Download PDF

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Publication number
KR101385094B1
KR101385094B1 KR1020070091958A KR20070091958A KR101385094B1 KR 101385094 B1 KR101385094 B1 KR 101385094B1 KR 1020070091958 A KR1020070091958 A KR 1020070091958A KR 20070091958 A KR20070091958 A KR 20070091958A KR 101385094 B1 KR101385094 B1 KR 101385094B1
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KR
South Korea
Prior art keywords
pattern
layer
ground
printed circuit
wiring
Prior art date
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Application number
KR1020070091958A
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English (en)
Korean (ko)
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KR20090026893A (ko
Inventor
장익규
명지만
김관호
Original Assignee
삼성디스플레이 주식회사
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Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020070091958A priority Critical patent/KR101385094B1/ko
Priority to EP08006205A priority patent/EP2037722B1/en
Priority to US12/204,015 priority patent/US8254136B2/en
Priority to JP2008233077A priority patent/JP5514419B2/ja
Priority to CN2008101769735A priority patent/CN101448361B/zh
Publication of KR20090026893A publication Critical patent/KR20090026893A/ko
Priority to US13/556,274 priority patent/US20120285009A1/en
Application granted granted Critical
Publication of KR101385094B1 publication Critical patent/KR101385094B1/ko
Priority to US15/296,434 priority patent/US9930770B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611—Control of matrices with row and column drivers
    • G09G3/3696—Generation of voltages supplied to electrode drivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/06—Handling electromagnetic interferences [EMI], covering emitted as well as received electromagnetic radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020070091958A 2007-09-11 2007-09-11 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법 Active KR101385094B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020070091958A KR101385094B1 (ko) 2007-09-11 2007-09-11 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
EP08006205A EP2037722B1 (en) 2007-09-11 2008-03-29 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board
US12/204,015 US8254136B2 (en) 2007-09-11 2008-09-04 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board
CN2008101769735A CN101448361B (zh) 2007-09-11 2008-09-11 印刷电路板、具有其的显示设备及其制造方法
JP2008233077A JP5514419B2 (ja) 2007-09-11 2008-09-11 印刷回路基板を具備する表示装置及び印刷回路基板の製造方法
US13/556,274 US20120285009A1 (en) 2007-09-11 2012-07-24 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board
US15/296,434 US9930770B2 (en) 2007-09-11 2016-10-18 Printed circuit board, display apparatus having a printed circuit board and method of manufacturing the printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070091958A KR101385094B1 (ko) 2007-09-11 2007-09-11 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법

Publications (2)

Publication Number Publication Date
KR20090026893A KR20090026893A (ko) 2009-03-16
KR101385094B1 true KR101385094B1 (ko) 2014-04-14

Family

ID=39863119

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070091958A Active KR101385094B1 (ko) 2007-09-11 2007-09-11 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법

Country Status (5)

Country Link
US (3) US8254136B2 (https=)
EP (1) EP2037722B1 (https=)
JP (1) JP5514419B2 (https=)
KR (1) KR101385094B1 (https=)
CN (1) CN101448361B (https=)

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KR20160066649A (ko) * 2014-12-02 2016-06-13 삼성디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시장치
KR102317897B1 (ko) 2015-06-04 2021-10-28 삼성디스플레이 주식회사 테스트 보드 및 그의 구동방법
GB2540792A (en) * 2015-07-28 2017-02-01 Airbus Operations Ltd Vehicle fairing including an electrical routing
CN209329126U (zh) * 2016-05-17 2019-08-30 株式会社村田制作所 传输线路基板及电子设备
CN107831610A (zh) 2017-10-26 2018-03-23 惠科股份有限公司 信号传输装置及显示装置
US11670435B2 (en) 2021-04-09 2023-06-06 Apple Inc. Hybrid cabling solution for higher bandwidth and millimeter wave applications
KR20240127729A (ko) * 2023-02-16 2024-08-23 삼성전자주식회사 전자 장치 및 전자 장치의 동작 방법

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US6614325B1 (en) * 2000-08-31 2003-09-02 Northrop Grumman Corporation RF/IF signal distribution network utilizing broadside coupled stripline

Also Published As

Publication number Publication date
US8254136B2 (en) 2012-08-28
US20170042020A1 (en) 2017-02-09
EP2037722A2 (en) 2009-03-18
CN101448361B (zh) 2013-08-07
US20120285009A1 (en) 2012-11-15
JP5514419B2 (ja) 2014-06-04
US20090066624A1 (en) 2009-03-12
JP2009071311A (ja) 2009-04-02
EP2037722A3 (en) 2010-01-27
KR20090026893A (ko) 2009-03-16
EP2037722B1 (en) 2012-03-21
CN101448361A (zh) 2009-06-03
US9930770B2 (en) 2018-03-27

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