JP5469874B2 - 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 - Google Patents

硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Download PDF

Info

Publication number
JP5469874B2
JP5469874B2 JP2009025254A JP2009025254A JP5469874B2 JP 5469874 B2 JP5469874 B2 JP 5469874B2 JP 2009025254 A JP2009025254 A JP 2009025254A JP 2009025254 A JP2009025254 A JP 2009025254A JP 5469874 B2 JP5469874 B2 JP 5469874B2
Authority
JP
Japan
Prior art keywords
group
optical semiconductor
semiconductor element
component
average
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009025254A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010084118A (ja
JP2010084118A5 (https=
Inventor
誠 吉武
博司 江南
智子 加藤
匡慶 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009025254A priority Critical patent/JP5469874B2/ja
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to KR1020117007834A priority patent/KR101723387B1/ko
Priority to CN2009801326886A priority patent/CN102131874B/zh
Priority to EP09740543.5A priority patent/EP2324079B9/en
Priority to MYPI20110999 priority patent/MY151260A/en
Priority to US13/062,374 priority patent/US8373286B2/en
Priority to PCT/JP2009/065885 priority patent/WO2010027105A1/en
Priority to TW098129913A priority patent/TWI495688B/zh
Publication of JP2010084118A publication Critical patent/JP2010084118A/ja
Publication of JP2010084118A5 publication Critical patent/JP2010084118A5/ja
Application granted granted Critical
Publication of JP5469874B2 publication Critical patent/JP5469874B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
JP2009025254A 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置 Active JP5469874B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2009025254A JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
CN2009801326886A CN102131874B (zh) 2008-09-05 2009-09-04 可固化的有机基聚硅氧烷组合物，光学半导体元件密封剂，和光学半导体器件
EP09740543.5A EP2324079B9 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
MYPI20110999 MY151260A (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
KR1020117007834A KR101723387B1 (ko) 2008-09-05 2009-09-04 경화성 오가노폴리실록산 조성물, 광반도체 소자 봉지제 및 광반도체 장치
US13/062,374 US8373286B2 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
PCT/JP2009/065885 WO2010027105A1 (en) 2008-09-05 2009-09-04 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
TW098129913A TWI495688B (zh) 2008-09-05 2009-09-04 可固化有機聚矽氧烷組合物、光學半導體元件密封劑及光學半導體裝置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008228980 2008-09-05
JP2008228980 2008-09-05
JP2009025254A JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Publications (3)

Publication Number Publication Date
JP2010084118A JP2010084118A (ja) 2010-04-15
JP2010084118A5 JP2010084118A5 (https=) 2013-09-19
JP5469874B2 true JP5469874B2 (ja) 2014-04-16

Family

ID=41328764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009025254A Active JP5469874B2 (ja) 2008-09-05 2009-02-05 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置

Country Status (8)

Country Link
US (1) US8373286B2 (https=)
EP (1) EP2324079B9 (https=)
JP (1) JP5469874B2 (https=)
KR (1) KR101723387B1 (https=)
CN (1) CN102131874B (https=)
MY (1) MY151260A (https=)
TW (1) TWI495688B (https=)
WO (1) WO2010027105A1 (https=)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946353B2 (en) 2008-10-31 2015-02-03 Dow Corning Toray Co. Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
WO2011162294A1 (ja) * 2010-06-24 2011-12-29 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
KR101277722B1 (ko) * 2010-07-14 2013-06-24 제일모직주식회사 하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자
JP5323037B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5323038B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012222202A (ja) * 2011-04-11 2012-11-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
KR101518104B1 (ko) * 2011-06-17 2015-05-06 주식회사 엘지화학 경화성 조성물
WO2013077700A1 (ko) 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
KR101317776B1 (ko) * 2011-12-14 2013-10-11 한국과학기술연구원 코어-쉘 구조를 갖는 페닐폴리실록산 수지
RU2495895C1 (ru) * 2012-05-10 2013-10-20 Общество с ограниченной ответственностью "Элкон" Эмаль термостойкая
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
JP2015528046A (ja) * 2012-07-27 2015-09-24 エルジー・ケム・リミテッド 硬化性組成物
KR101560042B1 (ko) * 2012-07-27 2015-10-15 주식회사 엘지화학 경화성 조성물
JP2014031394A (ja) * 2012-08-01 2014-02-20 Shin Etsu Chem Co Ltd 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置
WO2014062843A1 (en) * 2012-10-16 2014-04-24 Brewer Science Inc. Silicone polymers with high refractive indices and extended pot life
US9181400B2 (en) 2012-11-09 2015-11-10 Sumitomo Seika Chemicals Co., Ltd. Silicone resin composition, cured silicone resin, and sealed optical semiconductor element
CN104884535B (zh) 2012-12-26 2017-05-10 第一毛织株式会社 用于光学元件的可固化聚硅氧烷组成物、包封材料、以及光学元件
WO2014105959A1 (en) * 2012-12-28 2014-07-03 Dow Corning Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
TWI616477B (zh) 2012-12-28 2018-03-01 道康寧公司 用於轉換器之可固化有機聚矽氧烷組合物及該可固化聚矽氧組合物於轉換器之應用
JP5985981B2 (ja) * 2012-12-28 2016-09-06 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6212122B2 (ja) * 2012-12-28 2017-10-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
WO2014148852A1 (ko) * 2013-03-21 2014-09-25 주식회사 동진쎄미켐 광학소자의 다층구조 봉지방법
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR102189563B1 (ko) 2013-08-19 2020-12-11 스미또모 세이까 가부시키가이샤 부가 경화형 실리콘 수지 조성물, 부가 경화형 실리콘 수지 경화물 및 광 반도체 소자 봉지체
US9963552B2 (en) 2013-08-20 2018-05-08 Sumitomo Seika Chemicals Co., Ltd. Condensation-curable silicone resin composition, condensation-curable silicone resin cured product, and sealed optical semiconductor element
EP3039079B1 (en) * 2013-08-29 2022-05-18 Ddp Specialty Electronic Materials Us 9, Llc. Curable silicone composition, cured product thereof, and optical semiconductor device
KR101868327B1 (ko) * 2013-10-17 2018-07-23 다우 코닝 도레이 캄파니 리미티드 경화성 실리콘 조성물 및 광 반도체 장치
JP6569036B2 (ja) * 2013-10-17 2019-09-04 ダウ・東レ株式会社 硬化性シリコーン組成物および光半導体装置
JP6254833B2 (ja) 2013-11-25 2017-12-27 信越化学工業株式会社 シリコーン樹脂組成物及び光半導体装置
WO2015083446A1 (ja) * 2013-12-06 2015-06-11 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
WO2015098072A1 (en) * 2013-12-27 2015-07-02 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, member for transducers
WO2015115812A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115810A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115811A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
WO2015115808A1 (ko) * 2014-01-28 2015-08-06 주식회사 엘지화학 경화체
JP6643985B2 (ja) * 2014-01-28 2020-02-12 エルジー・ケム・リミテッド 硬化体
WO2015129140A1 (ja) * 2014-02-28 2015-09-03 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
JP6100717B2 (ja) * 2014-03-05 2017-03-22 信越化学工業株式会社 付加硬化型シリコーン組成物及び光学素子
WO2015136820A1 (ja) * 2014-03-12 2015-09-17 横浜ゴム株式会社 硬化性樹脂組成物
EP3153544A4 (en) * 2014-06-04 2018-01-24 Dow Corning Toray Co., Ltd. Adhesion promoter, curable silicone composition, and semiconductor device
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
KR20160002243A (ko) * 2014-06-30 2016-01-07 제일모직주식회사 경화형 폴리오르가노실록산 조성물, 봉지재, 및 광학기기
DE102015225906A1 (de) * 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
JP6515940B2 (ja) * 2017-03-17 2019-05-22 日亜化学工業株式会社 発光装置及びその製造方法
CN110832033A (zh) * 2017-07-21 2020-02-21 美国陶氏有机硅公司 可固化有机聚硅氧烷组合物及其固化产物
JP6915527B2 (ja) * 2017-12-27 2021-08-04 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
WO2019202837A1 (ja) * 2018-04-16 2019-10-24 信越化学工業株式会社 有機ｅｌ用透明乾燥剤及びその使用方法
CN110272627B (zh) * 2019-07-24 2021-11-23 杭州之江新材料有限公司 一种高折光指数的有机硅凝胶及其制备方法
CN110684357A (zh) * 2019-09-16 2020-01-14 安徽若水化工有限公司 一种低密度导热阻燃有机硅材料
IL293546A (en) * 2019-12-06 2022-08-01 Nusil Tech Llc Solvent catalyst for one-part organopolysiloxane systems and related methods
KR20210147211A (ko) 2020-05-28 2021-12-07 롬엔드하스전자재료코리아유한회사 광경화성 실록산 수지 조성물 및 이의 경화물
JP7673941B2 (ja) 2020-07-20 2025-05-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR20220012648A (ko) 2020-07-23 2022-02-04 롬엔드하스전자재료코리아유한회사 광경화성 실록산 수지 조성물 및 이의 경화물
WO2022191186A1 (ja) 2021-03-08 2022-09-15 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性シリコーン組成物、封止剤、及び光半導体装置
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
WO2025264369A1 (en) * 2024-06-18 2025-12-26 Dow Silicones Corporation Polyphenylsiloxane with anhydride functionalized adhesion promoter

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661210A (en) * 1996-09-25 1997-08-26 Dow Corning Corporation Optically clear liquid silicone rubber
JP4040858B2 (ja) 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TW200427111A (en) * 2003-03-12 2004-12-01 Shinetsu Chemical Co Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device
JP4766222B2 (ja) 2003-03-12 2011-09-07 信越化学工業株式会社 発光半導体被覆保護材及び発光半導体装置
JP4908736B2 (ja) 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005272697A (ja) * 2004-03-25 2005-10-06 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP4590253B2 (ja) * 2004-12-16 2010-12-01 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびシリコーン組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5025917B2 (ja) * 2005-06-15 2012-09-12 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物
JP4586981B2 (ja) * 2005-06-23 2010-11-24 信越化学工業株式会社 自己接着性オルガノポリシロキサン組成物
EP1749861B1 (en) * 2005-08-03 2014-08-20 Shin-Etsu Chemical Co., Ltd. Addition curable silicone resin composition for light emitting diode
JP4872296B2 (ja) 2005-09-30 2012-02-08 日亜化学工業株式会社 シリコーンゴム封止型発光装置、及び該発光装置の製造方法
US8258502B2 (en) 2006-02-24 2012-09-04 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP5202822B2 (ja) 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4933179B2 (ja) * 2006-07-14 2012-05-16 信越化学工業株式会社 硬化性シリコーンゴム組成物及びその硬化物
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US8946353B2 (en) 2008-10-31 2015-02-03 Dow Corning Toray Co. Ltd. Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材

Also Published As

Publication number Publication date
TWI495688B (zh) 2015-08-11
CN102131874A (zh) 2011-07-20
US20110227235A1 (en) 2011-09-22
TW201014885A (en) 2010-04-16
MY151260A (en) 2014-04-30
KR101723387B1 (ko) 2017-04-06
US8373286B2 (en) 2013-02-12
WO2010027105A1 (en) 2010-03-11
JP2010084118A (ja) 2010-04-15
EP2324079B1 (en) 2012-10-24
EP2324079B9 (en) 2013-10-16
EP2324079A1 (en) 2011-05-25
CN102131874B (zh) 2013-02-27
KR20110053470A (ko) 2011-05-23

Similar Documents

Publication Publication Date Title
JP5469874B2 (ja) 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5769622B2 (ja) 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5972512B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5534977B2 (ja) 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5680889B2 (ja) 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5060074B2 (ja) 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP5667740B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
KR102044675B1 (ko) 경화성 실리콘 조성물, 이의 경화물, 및 광반도체 디바이스
EP3587498B1 (en) Curable organopolysiloxane composition and semiconductor device
TW201934665A (zh) 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
JP5913538B2 (ja) 硬化性オルガノポリシロキサン組成物及び半導体装置
CN110862802B (zh) 加成固化型有机硅组合物及半导体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130812

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130905

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131001

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140203

R150 Certificate of patent or registration of utility model

Ref document number: 5469874

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250