JP5436963B2 - 配線基板及び半導体装置 - Google Patents

配線基板及び半導体装置 Download PDF

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Publication number
JP5436963B2
JP5436963B2 JP2009170469A JP2009170469A JP5436963B2 JP 5436963 B2 JP5436963 B2 JP 5436963B2 JP 2009170469 A JP2009170469 A JP 2009170469A JP 2009170469 A JP2009170469 A JP 2009170469A JP 5436963 B2 JP5436963 B2 JP 5436963B2
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JP
Japan
Prior art keywords
wiring
power supply
ground
layer
core substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009170469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011029236A5 (enExample
JP2011029236A (ja
Inventor
道夫 堀内
安衛 徳武
勇一 松田
智生 山崎
勇太 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009170469A priority Critical patent/JP5436963B2/ja
Priority to US12/813,692 priority patent/US8242612B2/en
Publication of JP2011029236A publication Critical patent/JP2011029236A/ja
Publication of JP2011029236A5 publication Critical patent/JP2011029236A5/ja
Application granted granted Critical
Publication of JP5436963B2 publication Critical patent/JP5436963B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H10W70/687—Shapes or dispositions thereof comprising multiple insulating layers characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09345—Power and ground in the same plane; Power planes for two voltages in one plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2009170469A 2009-07-21 2009-07-21 配線基板及び半導体装置 Expired - Fee Related JP5436963B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009170469A JP5436963B2 (ja) 2009-07-21 2009-07-21 配線基板及び半導体装置
US12/813,692 US8242612B2 (en) 2009-07-21 2010-06-11 Wiring board having piercing linear conductors and semiconductor device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009170469A JP5436963B2 (ja) 2009-07-21 2009-07-21 配線基板及び半導体装置

Publications (3)

Publication Number Publication Date
JP2011029236A JP2011029236A (ja) 2011-02-10
JP2011029236A5 JP2011029236A5 (enExample) 2012-08-16
JP5436963B2 true JP5436963B2 (ja) 2014-03-05

Family

ID=43496560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009170469A Expired - Fee Related JP5436963B2 (ja) 2009-07-21 2009-07-21 配線基板及び半導体装置

Country Status (2)

Country Link
US (1) US8242612B2 (enExample)
JP (1) JP5436963B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8415781B2 (en) * 2010-08-09 2013-04-09 Ibiden Co., Ltd. Electronic component and method for manufacturing the same
US9293405B2 (en) * 2011-03-22 2016-03-22 Renesas Electronics Corporation Semiconductor device
JP5775789B2 (ja) * 2011-10-18 2015-09-09 新光電気工業株式会社 積層型半導体パッケージ
US8890273B2 (en) * 2012-01-31 2014-11-18 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for an improved reflectivity optical grid for image sensors
JP6282425B2 (ja) * 2012-10-29 2018-02-21 新光電気工業株式会社 配線基板の製造方法
JP2014192176A (ja) * 2013-03-26 2014-10-06 Ngk Spark Plug Co Ltd 配線基板
US9373576B2 (en) 2014-01-09 2016-06-21 Broadcom Corporation Flip chip pad geometry for an IC package substrate
TW201539596A (zh) * 2014-04-09 2015-10-16 同欣電子工業股份有限公司 中介體及其製造方法
US9699921B2 (en) * 2014-08-01 2017-07-04 Fujikura Ltd. Multi-layer wiring board
US9960120B2 (en) * 2015-03-31 2018-05-01 Shinko Electric Industries Co., Ltd. Wiring substrate with buried substrate having linear conductors
JP6600573B2 (ja) * 2015-03-31 2019-10-30 新光電気工業株式会社 配線基板及び半導体パッケージ
JP2016106427A (ja) * 2016-03-03 2016-06-16 京セラサーキットソリューションズ株式会社 配線基板の製造方法および実装構造体の製造方法
CN109524360B (zh) * 2017-09-20 2020-06-26 永恒光实业股份有限公司 挠性衬底结构及其制造方法
JP2019197423A (ja) * 2018-05-10 2019-11-14 シャープ株式会社 基板の製造方法及び表示装置の製造方法
JP7279538B2 (ja) * 2019-06-19 2023-05-23 富士フイルムビジネスイノベーション株式会社 発光装置
WO2021193092A1 (ja) * 2020-03-25 2021-09-30 京セラ株式会社 配線基板
CN118366875A (zh) 2021-01-26 2024-07-19 长江存储科技有限责任公司 基板结构及其制造和封装方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463084A (en) 1982-02-09 1984-07-31 Alps Electric Co., Ltd. Method of fabricating a circuit board and circuit board provided thereby
JPS58141595A (ja) 1982-02-17 1983-08-22 アルプス電気株式会社 回路板の形成方法
JPS58137915A (ja) 1982-02-09 1983-08-16 アルプス電気株式会社 回路板の形成方法
JPH10308565A (ja) 1997-05-02 1998-11-17 Shinko Electric Ind Co Ltd 配線基板
JP2000031652A (ja) * 1998-07-15 2000-01-28 Nec Corp 多層プリント配線板
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置
WO2005107350A1 (ja) * 2004-04-28 2005-11-10 Ibiden Co., Ltd. 多層プリント配線板
JP2005327932A (ja) * 2004-05-14 2005-11-24 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法
JP4649198B2 (ja) * 2004-12-20 2011-03-09 新光電気工業株式会社 配線基板の製造方法
EP1833286A1 (en) * 2004-12-28 2007-09-12 Ngk Spark Plug Co., Ltd Wiring board and wiring board manufacturing method
JP4357577B2 (ja) 2007-06-14 2009-11-04 太陽誘電株式会社 コンデンサ及びその製造方法
JP5344667B2 (ja) 2007-12-18 2013-11-20 太陽誘電株式会社 回路基板およびその製造方法並びに回路モジュール
JP5385682B2 (ja) * 2009-05-19 2014-01-08 新光電気工業株式会社 電子部品の実装構造
JP5249132B2 (ja) * 2009-06-03 2013-07-31 新光電気工業株式会社 配線基板
JP5280309B2 (ja) * 2009-07-17 2013-09-04 新光電気工業株式会社 半導体装置及びその製造方法
JP2011091185A (ja) * 2009-10-22 2011-05-06 Shinko Electric Ind Co Ltd 導電フィルムおよびその製造方法、並びに半導体装置およびその製造方法
JP2011151185A (ja) * 2010-01-21 2011-08-04 Shinko Electric Ind Co Ltd 配線基板及び半導体装置
JP5363384B2 (ja) * 2010-03-11 2013-12-11 新光電気工業株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
US20110018144A1 (en) 2011-01-27
US8242612B2 (en) 2012-08-14
JP2011029236A (ja) 2011-02-10

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