JP5420141B2 - 硬化性シリコーンレジン組成物および硬化物 - Google Patents
硬化性シリコーンレジン組成物および硬化物 Download PDFInfo
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- JP5420141B2 JP5420141B2 JP2006055086A JP2006055086A JP5420141B2 JP 5420141 B2 JP5420141 B2 JP 5420141B2 JP 2006055086 A JP2006055086 A JP 2006055086A JP 2006055086 A JP2006055086 A JP 2006055086A JP 5420141 B2 JP5420141 B2 JP 5420141B2
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- silicone resin
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- 229920002050 silicone resin Polymers 0.000 title claims description 35
- 239000011342 resin composition Substances 0.000 title claims description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 60
- 239000000203 mixture Substances 0.000 claims description 42
- 229910052697 platinum Inorganic materials 0.000 claims description 27
- 239000003054 catalyst Substances 0.000 claims description 24
- 239000010419 fine particle Substances 0.000 claims description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims description 18
- 229920001296 polysiloxane Polymers 0.000 claims description 17
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 11
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000002683 reaction inhibitor Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- 239000000047 product Substances 0.000 description 26
- -1 platinum olefin Chemical class 0.000 description 24
- 238000000034 method Methods 0.000 description 17
- 150000002430 hydrocarbons Chemical group 0.000 description 11
- 238000001721 transfer moulding Methods 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002685 polymerization catalyst Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000011067 equilibration Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 125000005999 2-bromoethyl group Chemical group 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- MDFZHDVZRFWRPW-UHFFFAOYSA-N methyl-tris(2-methylbut-3-en-2-yloxy)silane Chemical compound C=CC(C)(C)O[Si](C)(OC(C)(C)C=C)OC(C)(C)C=C MDFZHDVZRFWRPW-UHFFFAOYSA-N 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical group C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-SOFGYWHQSA-N (e)-3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)\C=C(/C)C#C HMVBQEAJQVQOTI-SOFGYWHQSA-N 0.000 description 1
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical group C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- XSDCTSITJJJDPY-UHFFFAOYSA-N chloro-ethenyl-dimethylsilane Chemical compound C[Si](C)(Cl)C=C XSDCTSITJJJDPY-UHFFFAOYSA-N 0.000 description 1
- LGWCCQIZIJQENG-UHFFFAOYSA-N chloro-hex-1-enyl-dimethylsilane Chemical compound CCCCC=C[Si](C)(C)Cl LGWCCQIZIJQENG-UHFFFAOYSA-N 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000005354 coacervation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000001162 cycloheptenyl group Chemical group C1(=CCCCCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- CHSOOADWBVJAOF-VOTSOKGWSA-N dichloro-[(E)-hex-1-enyl]-methylsilane Chemical compound CCCC\C=C\[Si](C)(Cl)Cl CHSOOADWBVJAOF-VOTSOKGWSA-N 0.000 description 1
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 1
- LNHPNZQMQXHNRD-UHFFFAOYSA-N dichloro-hept-1-enyl-methylsilane Chemical compound CCCCCC=C[Si](C)(Cl)Cl LNHPNZQMQXHNRD-UHFFFAOYSA-N 0.000 description 1
- TVYAAXXTNNMBBT-UHFFFAOYSA-N dichloro-methyl-oct-1-enylsilane Chemical compound CCCCCCC=C[Si](C)(Cl)Cl TVYAAXXTNNMBBT-UHFFFAOYSA-N 0.000 description 1
- GCHOFIKEBWCLDP-UHFFFAOYSA-N dichloro-methyl-pent-1-enylsilane Chemical compound CCCC=C[Si](C)(Cl)Cl GCHOFIKEBWCLDP-UHFFFAOYSA-N 0.000 description 1
- YCEQUKAYVABWTE-UHFFFAOYSA-N dichloro-methyl-prop-2-enylsilane Chemical compound C[Si](Cl)(Cl)CC=C YCEQUKAYVABWTE-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- JBGNIEDOGBWVMI-UHFFFAOYSA-N dimethoxy-methyl-oct-1-enylsilane Chemical compound CCCCCCC=C[Si](C)(OC)OC JBGNIEDOGBWVMI-UHFFFAOYSA-N 0.000 description 1
- UXFVCXJAXIYHDB-UHFFFAOYSA-N dimethoxy-methyl-pent-1-enylsilane Chemical compound CCCC=C[Si](C)(OC)OC UXFVCXJAXIYHDB-UHFFFAOYSA-N 0.000 description 1
- WQTNGCZMPUCIEX-UHFFFAOYSA-N dimethoxy-methyl-prop-2-enylsilane Chemical compound CO[Si](C)(OC)CC=C WQTNGCZMPUCIEX-UHFFFAOYSA-N 0.000 description 1
- HBCNHLHGEOIZOC-UHFFFAOYSA-N dimethoxy-methyl-undec-1-enylsilane Chemical compound CCCCCCCCCC=C[Si](C)(OC)OC HBCNHLHGEOIZOC-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- YLDYVZNLVYOGQH-UHFFFAOYSA-N hept-1-enyl(dimethoxy)silane Chemical compound C(=CCCCCC)[SiH](OC)OC YLDYVZNLVYOGQH-UHFFFAOYSA-N 0.000 description 1
- VWRXYSQLCVCTLJ-UHFFFAOYSA-N hex-1-enyl(dimethyl)silane Chemical compound CCCCC=C[SiH](C)C VWRXYSQLCVCTLJ-UHFFFAOYSA-N 0.000 description 1
- BQRXDWAQRKZDIO-UHFFFAOYSA-N hex-1-enyl-dimethoxy-methylsilane Chemical compound CCCCC=C[Si](C)(OC)OC BQRXDWAQRKZDIO-UHFFFAOYSA-N 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 150000003057 platinum Chemical class 0.000 description 1
- 229920000548 poly(silane) polymer Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QROGIFZRVHSFLM-UHFFFAOYSA-N prop-1-enylbenzene Chemical group CC=CC1=CC=CC=C1 QROGIFZRVHSFLM-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011802 pulverized particle Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LTOBLPCUAYUGQP-UHFFFAOYSA-N sulfonylsilane Chemical compound O=S(=O)=[SiH2] LTOBLPCUAYUGQP-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
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- C08J3/14—Powdering or granulating by precipitation from solutions
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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| JP2006055086A JP5420141B2 (ja) | 2006-03-01 | 2006-03-01 | 硬化性シリコーンレジン組成物および硬化物 |
| TW096105316A TWI402314B (zh) | 2006-03-01 | 2007-02-13 | 可硬化之聚矽氧樹脂組合物及其硬化體 |
| PCT/JP2007/053347 WO2007099863A1 (en) | 2006-03-01 | 2007-02-16 | Curable silicone resin composition and cured body thereof |
| EP07737336.3A EP1989253B1 (en) | 2006-03-01 | 2007-02-16 | Curable silicone resin composition and cured body thereof |
| KR1020087021407A KR101456051B1 (ko) | 2006-03-01 | 2007-02-16 | 경화가능한 실리콘 수지 조성물 및 이의 경화체 |
| US12/281,054 US20090099321A1 (en) | 2006-03-01 | 2007-02-16 | Curable Silicone Resin Composition and Cured Body Thereof |
| CNA2007800074696A CN101395212A (zh) | 2006-03-01 | 2007-02-16 | 可固化的有机硅树脂组合物及其固化体 |
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| JP2006055086A JP5420141B2 (ja) | 2006-03-01 | 2006-03-01 | 硬化性シリコーンレジン組成物および硬化物 |
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| TW (1) | TWI402314B (enExample) |
| WO (1) | WO2007099863A1 (enExample) |
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| JP5072263B2 (ja) * | 2006-05-16 | 2012-11-14 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP5442941B2 (ja) * | 2007-07-12 | 2014-03-19 | 株式会社カネカ | 硬化性組成物 |
| JP4623322B2 (ja) * | 2007-12-26 | 2011-02-02 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法 |
| US8491816B2 (en) | 2008-02-07 | 2013-07-23 | Mitsubishi Chemical Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
| JP4678415B2 (ja) * | 2008-03-18 | 2011-04-27 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース |
| JP2010018786A (ja) | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP2010021533A (ja) | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| WO2010096700A2 (en) * | 2009-02-19 | 2010-08-26 | Sajjad Basha S | Photovoltaic module configuration |
| EP2706095B1 (en) * | 2011-05-04 | 2021-03-03 | LG Chem, Ltd. | Curable composition |
| EP2716717B1 (en) * | 2011-05-31 | 2016-04-06 | Momentive Performance Materials Japan LLC | Silicone composition for sealing semiconductor |
| JP5831959B2 (ja) * | 2011-11-25 | 2015-12-16 | エルジー・ケム・リミテッド | 硬化性組成物 |
| EP2784105B1 (en) * | 2011-11-25 | 2017-05-10 | LG Chem, Ltd. | Method for producing organopolysiloxane |
| CN103987787B (zh) * | 2011-11-25 | 2016-08-24 | Lg化学株式会社 | 可固化组合物 |
| TWI498356B (zh) * | 2011-11-25 | 2015-09-01 | Ｌｇ化學股份有限公司 | 有機聚矽氧烷 |
| EP2784126B1 (en) * | 2011-11-25 | 2019-03-13 | LG Chem, Ltd. | Curable composition |
| JP5805883B2 (ja) * | 2011-11-25 | 2015-11-10 | エルジー・ケム・リミテッド | 硬化性組成物 |
| JP6133592B2 (ja) * | 2012-12-22 | 2017-05-24 | 東レ・ダウコーニング株式会社 | 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法 |
| CN103087327B (zh) * | 2013-02-01 | 2014-12-10 | 苏州大学 | 一种室温树脂传递模塑用透明有机硅树脂及其制备方法 |
| WO2014157682A1 (ja) * | 2013-03-29 | 2014-10-02 | 出光興産株式会社 | ポリオルガノシロキサン及びポリカーボネート－ポリオルガノシロキサン共重合体 |
| KR102419245B1 (ko) * | 2014-09-01 | 2022-07-11 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스 |
| JP6707516B2 (ja) * | 2015-02-25 | 2020-06-10 | ダウ・東レ株式会社 | 硬化性粒状シリコーン組成物、およびその製造方法 |
| JP6656045B2 (ja) * | 2016-03-29 | 2020-03-04 | 信越化学工業株式会社 | 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法 |
| CN110809597B (zh) | 2017-06-19 | 2022-02-18 | 美国陶氏有机硅公司 | 用于传递或注射成型光学部件的液体有机硅组合物、由其制成的光学部件及其方法 |
| CN107446145A (zh) * | 2017-09-12 | 2017-12-08 | 广州天赐高新材料股份有限公司 | 一种日化用有机硅弹性体凝胶的制备方法和应用 |
| EP3699236A4 (en) * | 2017-10-20 | 2021-07-14 | Dow Toray Co., Ltd. | COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION |
| CN113195222B (zh) | 2018-12-25 | 2023-05-09 | 陶氏东丽株式会社 | 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途 |
| CN111675996A (zh) * | 2020-06-10 | 2020-09-18 | 湖北平安电工股份有限公司 | 一种硬云母板胶粘剂及其制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3844992A (en) * | 1973-11-16 | 1974-10-29 | Dow Corning | Wood graining tool fast cure organopolysiloxane resins |
| JPS5134259A (ja) | 1974-09-17 | 1976-03-23 | Shinetsu Chemical Co | Kotainetsukokaseishirikoonjushisoseibutsu |
| US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| US5082894A (en) * | 1990-03-19 | 1992-01-21 | Dow Corning Corporation | Storage stable one-part organosiloxane compositions |
| US5153238A (en) * | 1991-11-12 | 1992-10-06 | Dow Corning Corporation | Storage stable organosiloxane composition and method for preparing same |
| JP3899134B2 (ja) * | 1993-12-29 | 2007-03-28 | 東レ・ダウコーニング株式会社 | 加熱硬化性シリコーン組成物 |
| JP2000026727A (ja) * | 1998-07-06 | 2000-01-25 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーンレジン組成物 |
| JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
| JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP4767481B2 (ja) * | 2003-05-02 | 2011-09-07 | 信越化学工業株式会社 | 硬化性組成物 |
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2007
- 2007-02-13 TW TW096105316A patent/TWI402314B/zh not_active IP Right Cessation
- 2007-02-16 US US12/281,054 patent/US20090099321A1/en not_active Abandoned
- 2007-02-16 EP EP07737336.3A patent/EP1989253B1/en not_active Not-in-force
- 2007-02-16 WO PCT/JP2007/053347 patent/WO2007099863A1/en not_active Ceased
- 2007-02-16 KR KR1020087021407A patent/KR101456051B1/ko not_active Expired - Fee Related
- 2007-02-16 CN CNA2007800074696A patent/CN101395212A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007231173A (ja) | 2007-09-13 |
| WO2007099863A1 (en) | 2007-09-07 |
| KR101456051B1 (ko) | 2014-11-04 |
| EP1989253A1 (en) | 2008-11-12 |
| TW200736341A (en) | 2007-10-01 |
| TWI402314B (zh) | 2013-07-21 |
| KR20080114707A (ko) | 2008-12-31 |
| EP1989253B1 (en) | 2013-10-02 |
| CN101395212A (zh) | 2009-03-25 |
| US20090099321A1 (en) | 2009-04-16 |
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