TWI402314B - 可硬化之聚矽氧樹脂組合物及其硬化體 - Google Patents
可硬化之聚矽氧樹脂組合物及其硬化體 Download PDFInfo
- Publication number
- TWI402314B TWI402314B TW096105316A TW96105316A TWI402314B TW I402314 B TWI402314 B TW I402314B TW 096105316 A TW096105316 A TW 096105316A TW 96105316 A TW96105316 A TW 96105316A TW I402314 B TWI402314 B TW I402314B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- component
- mass
- hydrocarbon group
- platinum
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims description 24
- 229920002050 silicone resin Polymers 0.000 title description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 63
- 239000000203 mixture Substances 0.000 claims description 45
- 229910052697 platinum Inorganic materials 0.000 claims description 31
- 239000000843 powder Substances 0.000 claims description 27
- 239000003054 catalyst Substances 0.000 claims description 26
- 229920005992 thermoplastic resin Polymers 0.000 claims description 20
- 125000001931 aliphatic group Chemical group 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000002683 reaction inhibitor Substances 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- -1 alcohol modified platinum chloride Chemical class 0.000 description 29
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000002245 particle Substances 0.000 description 11
- 238000001721 transfer moulding Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 239000002685 polymerization catalyst Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920006324 polyoxymethylene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 125000005999 2-bromoethyl group Chemical group 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000012676 equilibrium polymerization Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000006146 oximation reaction Methods 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000004344 phenylpropyl group Chemical group 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 235000019354 vermiculite Nutrition 0.000 description 2
- 229910052902 vermiculite Inorganic materials 0.000 description 2
- 239000010455 vermiculite Substances 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- FRGJFERYCDBOQD-UHFFFAOYSA-N 1,1,1,2-tetrachlorodecane Chemical compound CCCCCCCCC(Cl)C(Cl)(Cl)Cl FRGJFERYCDBOQD-UHFFFAOYSA-N 0.000 description 1
- VJNSCINLGYURMF-UHFFFAOYSA-N 1,1,1-trichloro-2-methyldecane Chemical compound CCCCCCCCC(C)C(Cl)(Cl)Cl VJNSCINLGYURMF-UHFFFAOYSA-N 0.000 description 1
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- NCRNCSZWOOYBQF-UHFFFAOYSA-N 1,1-Dimethoxydecane Chemical compound CCCCCCCCCC(OC)OC NCRNCSZWOOYBQF-UHFFFAOYSA-N 0.000 description 1
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- ZTEHOZMYMCEYRM-UHFFFAOYSA-N 1-chlorodecane Chemical compound CCCCCCCCCCCl ZTEHOZMYMCEYRM-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- JPEWDCTZJFUITH-UHFFFAOYSA-N 1-methoxydecane Chemical compound CCCCCCCCCCOC JPEWDCTZJFUITH-UHFFFAOYSA-N 0.000 description 1
- YTPFRRRNIYVFFE-UHFFFAOYSA-N 2,2,3,3,5,5-hexamethyl-1,4-dioxane Chemical compound CC1(C)COC(C)(C)C(C)(C)O1 YTPFRRRNIYVFFE-UHFFFAOYSA-N 0.000 description 1
- GCZWJRLXIPVNLU-UHFFFAOYSA-N 2,2-dimethoxy-3-methylundecane Chemical compound CC(C(OC)(OC)C)CCCCCCCC GCZWJRLXIPVNLU-UHFFFAOYSA-N 0.000 description 1
- MFAWEYJGIGIYFH-UHFFFAOYSA-N 2-[4-(trimethoxymethyl)dodecoxymethyl]oxirane Chemical compound C(C1CO1)OCCCC(C(OC)(OC)OC)CCCCCCCC MFAWEYJGIGIYFH-UHFFFAOYSA-N 0.000 description 1
- VOQDCMULDZDDLP-UHFFFAOYSA-N 2-methoxy-2,3-dimethyloxane Chemical compound CC1C(OCCC1)(C)OC VOQDCMULDZDDLP-UHFFFAOYSA-N 0.000 description 1
- QSOTUEXTQMNCKM-UHFFFAOYSA-N 2-methoxy-2-methyloxane Chemical compound COC1(C)CCCCO1 QSOTUEXTQMNCKM-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VKEIPALYOJMDAC-UHFFFAOYSA-N 3,3,3-trichloroprop-1-ene Chemical compound ClC(Cl)(Cl)C=C VKEIPALYOJMDAC-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JZHKIUBMQMDQRG-UHFFFAOYSA-N C(=C)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=C)C(C(OC)(OC)OC)CCCCCCCC JZHKIUBMQMDQRG-UHFFFAOYSA-N 0.000 description 1
- XPTUPLZQGRXXIB-UHFFFAOYSA-N C(=CC)C(CCCCCCCCC)(Cl)Cl Chemical compound C(=CC)C(CCCCCCCCC)(Cl)Cl XPTUPLZQGRXXIB-UHFFFAOYSA-N 0.000 description 1
- QBSZKOXEASPZRG-UHFFFAOYSA-N C(=CC)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=CC)OCCCC(C(OC)(OC)OC)CCCCCCCC QBSZKOXEASPZRG-UHFFFAOYSA-N 0.000 description 1
- UVOPESDWPRWGIE-UHFFFAOYSA-N C(=CCCCC)C(C(Cl)(Cl)C)CCCCCCCC Chemical compound C(=CCCCC)C(C(Cl)(Cl)C)CCCCCCCC UVOPESDWPRWGIE-UHFFFAOYSA-N 0.000 description 1
- FRLJFAAZIMAQKC-UHFFFAOYSA-N C(=CCCCC)C(C(OC)(C)C)CCCCCCC Chemical compound C(=CCCCC)C(C(OC)(C)C)CCCCCCC FRLJFAAZIMAQKC-UHFFFAOYSA-N 0.000 description 1
- UETLTRXRRYVQLI-UHFFFAOYSA-N C(=CCCCC)C(C(OC)(OC)OC)CCCCCCCC Chemical compound C(=CCCCC)C(C(OC)(OC)OC)CCCCCCCC UETLTRXRRYVQLI-UHFFFAOYSA-N 0.000 description 1
- JOFKNWNOPWGMBB-UHFFFAOYSA-N C(=CCCCCC)C(C(Cl)(Cl)C)CCCCCCCC Chemical compound C(=CCCCCC)C(C(Cl)(Cl)C)CCCCCCCC JOFKNWNOPWGMBB-UHFFFAOYSA-N 0.000 description 1
- ORIHAKFWHSDRJQ-UHFFFAOYSA-N C(=CCCCCC)C(C(OC)(OC)C)CCCCCCCC Chemical compound C(=CCCCCC)C(C(OC)(OC)C)CCCCCCCC ORIHAKFWHSDRJQ-UHFFFAOYSA-N 0.000 description 1
- SQGGNSFBZLGMOO-UHFFFAOYSA-N C1(=CC=CC=C1)C(C(Cl)(Cl)Cl)CCCCCCCC Chemical compound C1(=CC=CC=C1)C(C(Cl)(Cl)Cl)CCCCCCCC SQGGNSFBZLGMOO-UHFFFAOYSA-N 0.000 description 1
- FMQJPSUCUJGTSW-UHFFFAOYSA-N CC(C(Cl)(C=C)C)CCCCCCCC Chemical compound CC(C(Cl)(C=C)C)CCCCCCCC FMQJPSUCUJGTSW-UHFFFAOYSA-N 0.000 description 1
- UFUYDYUQFXMKFB-UHFFFAOYSA-N CC(C(Cl)(Cl)C)CCCCCCCC Chemical compound CC(C(Cl)(Cl)C)CCCCCCCC UFUYDYUQFXMKFB-UHFFFAOYSA-N 0.000 description 1
- HNMCNAKOFLPNCD-UHFFFAOYSA-N CC(C(Cl)(Cl)C=CCCCCCC)CCCCCCCC Chemical compound CC(C(Cl)(Cl)C=CCCCCCC)CCCCCCCC HNMCNAKOFLPNCD-UHFFFAOYSA-N 0.000 description 1
- AZDCWQRINOFYTE-UHFFFAOYSA-N CC(C(Cl)(Cl)C=CCCCCCCC)CCCCCCCC Chemical compound CC(C(Cl)(Cl)C=CCCCCCCC)CCCCCCCC AZDCWQRINOFYTE-UHFFFAOYSA-N 0.000 description 1
- RKBZEXSQMGSBPO-UHFFFAOYSA-N CC(C(OC)(OC)C=CCCCCCC)CCCCCCCC Chemical compound CC(C(OC)(OC)C=CCCCCCC)CCCCCCCC RKBZEXSQMGSBPO-UHFFFAOYSA-N 0.000 description 1
- WQJSCFQVCUTIPV-UHFFFAOYSA-N CC(C(OC)(OC)C=CCCCCCCC)CCCCCCCC Chemical compound CC(C(OC)(OC)C=CCCCCCCC)CCCCCCCC WQJSCFQVCUTIPV-UHFFFAOYSA-N 0.000 description 1
- JADPKFAWXYVBKB-UHFFFAOYSA-N CC(C(OC)(OC)CCCCCCCCCCC)CCCCCCCC Chemical compound CC(C(OC)(OC)CCCCCCCCCCC)CCCCCCCC JADPKFAWXYVBKB-UHFFFAOYSA-N 0.000 description 1
- COQYUAJAXLUAHF-UHFFFAOYSA-N CC(CCCCCCCCCOC)(C)C Chemical compound CC(CCCCCCCCCOC)(C)C COQYUAJAXLUAHF-UHFFFAOYSA-N 0.000 description 1
- YQNKTSGZUHGTQK-UHFFFAOYSA-N CC1(OC1)C=CCCCC Chemical compound CC1(OC1)C=CCCCC YQNKTSGZUHGTQK-UHFFFAOYSA-N 0.000 description 1
- QDMKQCMHMOHSFP-UHFFFAOYSA-N CC=CC(CCCCCCCCC)(OC)OC Chemical compound CC=CC(CCCCCCCCC)(OC)OC QDMKQCMHMOHSFP-UHFFFAOYSA-N 0.000 description 1
- QHJSCTNRFWNYID-UHFFFAOYSA-N CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound CCC=COCCCC(C(OC)(OC)OC)CCCCCCCC QHJSCTNRFWNYID-UHFFFAOYSA-N 0.000 description 1
- JDUFVMYCPYPHBC-UHFFFAOYSA-N CCCCCCCCCCOCC=C(C)C Chemical compound CCCCCCCCCCOCC=C(C)C JDUFVMYCPYPHBC-UHFFFAOYSA-N 0.000 description 1
- 101100493820 Caenorhabditis elegans best-1 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 description 1
- 229920002675 Polyoxyl Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- TXWQMESAYJKDSP-UHFFFAOYSA-N [PH3](c1ccccc1)c1ccccc1 Chemical compound [PH3](c1ccccc1)c1ccccc1 TXWQMESAYJKDSP-UHFFFAOYSA-N 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CHPXLAPHLQIKCA-UHFFFAOYSA-N but-3-en-2-ylbenzene Chemical compound C=CC(C)C1=CC=CC=C1 CHPXLAPHLQIKCA-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000001162 cycloheptenyl group Chemical group C1(=CCCCCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical group CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- HDZGCSFEDULWCS-UHFFFAOYSA-N monomethylhydrazine Chemical compound CNN HDZGCSFEDULWCS-UHFFFAOYSA-N 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- NBRKLOOSMBRFMH-UHFFFAOYSA-N tert-butyl chloride Chemical compound CC(C)(C)Cl NBRKLOOSMBRFMH-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/14—Powdering or granulating by precipitation from solutions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006055086A JP5420141B2 (ja) | 2006-03-01 | 2006-03-01 | 硬化性シリコーンレジン組成物および硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200736341A TW200736341A (en) | 2007-10-01 |
| TWI402314B true TWI402314B (zh) | 2013-07-21 |
Family
ID=38024102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096105316A TWI402314B (zh) | 2006-03-01 | 2007-02-13 | 可硬化之聚矽氧樹脂組合物及其硬化體 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090099321A1 (enExample) |
| EP (1) | EP1989253B1 (enExample) |
| JP (1) | JP5420141B2 (enExample) |
| KR (1) | KR101456051B1 (enExample) |
| CN (1) | CN101395212A (enExample) |
| TW (1) | TWI402314B (enExample) |
| WO (1) | WO2007099863A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5072263B2 (ja) * | 2006-05-16 | 2012-11-14 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP5442941B2 (ja) * | 2007-07-12 | 2014-03-19 | 株式会社カネカ | 硬化性組成物 |
| JP4623322B2 (ja) * | 2007-12-26 | 2011-02-02 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法 |
| US8491816B2 (en) | 2008-02-07 | 2013-07-23 | Mitsubishi Chemical Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
| JP4678415B2 (ja) * | 2008-03-18 | 2011-04-27 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース |
| JP2010018786A (ja) | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP2010021533A (ja) | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| WO2010096700A2 (en) * | 2009-02-19 | 2010-08-26 | Sajjad Basha S | Photovoltaic module configuration |
| EP2706095B1 (en) * | 2011-05-04 | 2021-03-03 | LG Chem, Ltd. | Curable composition |
| EP2716717B1 (en) * | 2011-05-31 | 2016-04-06 | Momentive Performance Materials Japan LLC | Silicone composition for sealing semiconductor |
| JP5831959B2 (ja) * | 2011-11-25 | 2015-12-16 | エルジー・ケム・リミテッド | 硬化性組成物 |
| EP2784105B1 (en) * | 2011-11-25 | 2017-05-10 | LG Chem, Ltd. | Method for producing organopolysiloxane |
| CN103987787B (zh) * | 2011-11-25 | 2016-08-24 | Lg化学株式会社 | 可固化组合物 |
| TWI498356B (zh) * | 2011-11-25 | 2015-09-01 | Ｌｇ化學股份有限公司 | 有機聚矽氧烷 |
| EP2784126B1 (en) * | 2011-11-25 | 2019-03-13 | LG Chem, Ltd. | Curable composition |
| JP5805883B2 (ja) * | 2011-11-25 | 2015-11-10 | エルジー・ケム・リミテッド | 硬化性組成物 |
| JP6133592B2 (ja) * | 2012-12-22 | 2017-05-24 | 東レ・ダウコーニング株式会社 | 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法 |
| CN103087327B (zh) * | 2013-02-01 | 2014-12-10 | 苏州大学 | 一种室温树脂传递模塑用透明有机硅树脂及其制备方法 |
| WO2014157682A1 (ja) * | 2013-03-29 | 2014-10-02 | 出光興産株式会社 | ポリオルガノシロキサン及びポリカーボネート－ポリオルガノシロキサン共重合体 |
| KR102419245B1 (ko) * | 2014-09-01 | 2022-07-11 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스 |
| JP6707516B2 (ja) * | 2015-02-25 | 2020-06-10 | ダウ・東レ株式会社 | 硬化性粒状シリコーン組成物、およびその製造方法 |
| JP6656045B2 (ja) * | 2016-03-29 | 2020-03-04 | 信越化学工業株式会社 | 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法 |
| CN110809597B (zh) | 2017-06-19 | 2022-02-18 | 美国陶氏有机硅公司 | 用于传递或注射成型光学部件的液体有机硅组合物、由其制成的光学部件及其方法 |
| CN107446145A (zh) * | 2017-09-12 | 2017-12-08 | 广州天赐高新材料股份有限公司 | 一种日化用有机硅弹性体凝胶的制备方法和应用 |
| EP3699236A4 (en) * | 2017-10-20 | 2021-07-14 | Dow Toray Co., Ltd. | COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION |
| CN113195222B (zh) | 2018-12-25 | 2023-05-09 | 陶氏东丽株式会社 | 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途 |
| CN111675996A (zh) * | 2020-06-10 | 2020-09-18 | 湖北平安电工股份有限公司 | 一种硬云母板胶粘剂及其制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0661349A2 (en) * | 1993-12-29 | 1995-07-05 | Dow Corning Toray Silicone Company, Limited | Thermosetting silicone composition |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3844992A (en) * | 1973-11-16 | 1974-10-29 | Dow Corning | Wood graining tool fast cure organopolysiloxane resins |
| JPS5134259A (ja) | 1974-09-17 | 1976-03-23 | Shinetsu Chemical Co | Kotainetsukokaseishirikoonjushisoseibutsu |
| US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| US5082894A (en) * | 1990-03-19 | 1992-01-21 | Dow Corning Corporation | Storage stable one-part organosiloxane compositions |
| US5153238A (en) * | 1991-11-12 | 1992-10-06 | Dow Corning Corporation | Storage stable organosiloxane composition and method for preparing same |
| JP2000026727A (ja) * | 1998-07-06 | 2000-01-25 | Dow Corning Toray Silicone Co Ltd | 硬化性シリコーンレジン組成物 |
| JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
| JP4663969B2 (ja) * | 2002-07-09 | 2011-04-06 | 東レ・ダウコーニング株式会社 | 硬化性シリコーンレジン組成物およびその硬化物 |
| JP4767481B2 (ja) * | 2003-05-02 | 2011-09-07 | 信越化学工業株式会社 | 硬化性組成物 |
-
2006
- 2006-03-01 JP JP2006055086A patent/JP5420141B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-13 TW TW096105316A patent/TWI402314B/zh not_active IP Right Cessation
- 2007-02-16 US US12/281,054 patent/US20090099321A1/en not_active Abandoned
- 2007-02-16 EP EP07737336.3A patent/EP1989253B1/en not_active Not-in-force
- 2007-02-16 WO PCT/JP2007/053347 patent/WO2007099863A1/en not_active Ceased
- 2007-02-16 KR KR1020087021407A patent/KR101456051B1/ko not_active Expired - Fee Related
- 2007-02-16 CN CNA2007800074696A patent/CN101395212A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0661349A2 (en) * | 1993-12-29 | 1995-07-05 | Dow Corning Toray Silicone Company, Limited | Thermosetting silicone composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007231173A (ja) | 2007-09-13 |
| WO2007099863A1 (en) | 2007-09-07 |
| KR101456051B1 (ko) | 2014-11-04 |
| EP1989253A1 (en) | 2008-11-12 |
| TW200736341A (en) | 2007-10-01 |
| KR20080114707A (ko) | 2008-12-31 |
| EP1989253B1 (en) | 2013-10-02 |
| CN101395212A (zh) | 2009-03-25 |
| US20090099321A1 (en) | 2009-04-16 |
| JP5420141B2 (ja) | 2014-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI402314B (zh) | 可硬化之聚矽氧樹脂組合物及其硬化體 | |
| JP5247979B2 (ja) | 透明な硬化物を与えるポリオルガノシロキサン組成物 | |
| TWI402315B (zh) | 硬化性矽酮組合物 | |
| US8178642B2 (en) | Curable organopolysiloxane composition and cured product thereof | |
| TWI698512B (zh) | 熱熔性聚矽氧及硬化性熱熔組合物 | |
| CN101443416B (zh) | 可固化的有机硅树脂组合物及其固化体 | |
| TWI447176B (zh) | 硬化性聚有機矽氧烷組成物 | |
| TWI447175B (zh) | 加成硬化型聚矽氧組成物及其硬化產物 | |
| TWI522423B (zh) | 聚矽氧烷組合物及其硬化物 | |
| TWI544665B (zh) | Silicon oxide compositions for semiconductor encapsulation | |
| JP4528613B2 (ja) | シリコーン樹脂とエポキシ樹脂の接着複合体およびその製造方法 | |
| CN1837284B (zh) | 环氧-有机硅混合树脂组合物及其制造方法、以及发光半导体装置 | |
| CN103571209A (zh) | 加成固化型硅酮组合物、及半导体装置 | |
| EP2271700B1 (en) | Organopolysiloxane, method of manufacturing thereof, curable silicone composition, and cured product thereof | |
| JP2009263433A (ja) | 含ケイ素ポリマー、その製造方法、及び硬化性ポリマー組成物 | |
| TW201605934A (zh) | 有機聚矽氧烷及其製造方法 | |
| JP5913537B2 (ja) | 硬化性オルガノポリシロキサン組成物の製造方法 | |
| TWI801654B (zh) | 加成硬化型聚矽氧組成物及半導體裝置 | |
| EP2880095B1 (en) | Curable compositions for led encapsulants comprising a polycarbosilane and a hydrosilicone | |
| CN117730123A (zh) | 导热有机硅组合物 | |
| WO2021167052A1 (ja) | 硬化性液状シリコーン組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |