TWI402314B - 可硬化之聚矽氧樹脂組合物及其硬化體 - Google Patents

可硬化之聚矽氧樹脂組合物及其硬化體 Download PDF

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Publication number
TWI402314B
TWI402314B TW096105316A TW96105316A TWI402314B TW I402314 B TWI402314 B TW I402314B TW 096105316 A TW096105316 A TW 096105316A TW 96105316 A TW96105316 A TW 96105316A TW I402314 B TWI402314 B TW I402314B
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TW
Taiwan
Prior art keywords
composition
component
mass
hydrocarbon group
platinum
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TW096105316A
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English (en)
Chinese (zh)
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TW200736341A (en
Inventor
Makoto Yoshitake
Kasumi Takeuchi
Koji Nakanishi
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Dow Corning Toray Co Ltd
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Publication of TW200736341A publication Critical patent/TW200736341A/zh
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Publication of TWI402314B publication Critical patent/TWI402314B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW096105316A 2006-03-01 2007-02-13 可硬化之聚矽氧樹脂組合物及其硬化體 TWI402314B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006055086A JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物

Publications (2)

Publication Number Publication Date
TW200736341A TW200736341A (en) 2007-10-01
TWI402314B true TWI402314B (zh) 2013-07-21

Family

ID=38024102

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096105316A TWI402314B (zh) 2006-03-01 2007-02-13 可硬化之聚矽氧樹脂組合物及其硬化體

Country Status (7)

Country Link
US (1) US20090099321A1 (enExample)
EP (1) EP1989253B1 (enExample)
JP (1) JP5420141B2 (enExample)
KR (1) KR101456051B1 (enExample)
CN (1) CN101395212A (enExample)
TW (1) TWI402314B (enExample)
WO (1) WO2007099863A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072263B2 (ja) * 2006-05-16 2012-11-14 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP5442941B2 (ja) * 2007-07-12 2014-03-19 株式会社カネカ 硬化性組成物
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
KR101559603B1 (ko) 2008-02-07 2015-10-12 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치, 백라이트, 컬러 화상 표시 장치, 및 그들에 사용하는 형광체
JP4678415B2 (ja) * 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010018786A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
WO2010096700A2 (en) * 2009-02-19 2010-08-26 Sajjad Basha S Photovoltaic module configuration
EP2706095B1 (en) * 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
CN103562321B (zh) * 2011-05-31 2016-01-20 迈图高新材料日本合同公司 半导体密封用有机硅组合物
TWI473839B (zh) * 2011-11-25 2015-02-21 Ｌｇ化學股份有限公司 可固化組成物
KR101409537B1 (ko) * 2011-11-25 2014-06-19 주식회사 엘지화학 경화성 조성물
EP2784105B1 (en) * 2011-11-25 2017-05-10 LG Chem, Ltd. Method for producing organopolysiloxane
KR101560037B1 (ko) * 2011-11-25 2015-10-15 주식회사 엘지화학 경화성 조성물
WO2013077705A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 오가노폴리실록산
JP5805883B2 (ja) * 2011-11-25 2015-11-10 エルジー・ケム・リミテッド 硬化性組成物
JP6133592B2 (ja) * 2012-12-22 2017-05-24 東レ・ダウコーニング株式会社 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法
CN103087327B (zh) * 2013-02-01 2014-12-10 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
US9567442B2 (en) * 2013-03-29 2017-02-14 Idemitsu Kosan Co., Ltd. Polyorganosiloxane and polycarbonate-polyorganosiloxane copolymer
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
CN117801544A (zh) * 2015-02-25 2024-04-02 陶氏东丽株式会社 可固化的颗粒状有机硅组合物以及用于制造它们的方法
JP6656045B2 (ja) * 2016-03-29 2020-03-04 信越化学工業株式会社 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法
WO2018236127A1 (en) * 2017-06-19 2018-12-27 Dow Silicones Corporation LIQUID SILICONE COMPOSITION FOR TRANSFER OR INJECTION MOLDING OF OPTICAL PARTS, OPTICAL PARTS MADE THEREFROM, AND CORRESPONDING PROCESS
CN107446145A (zh) * 2017-09-12 2017-12-08 广州天赐高新材料股份有限公司 一种日化用有机硅弹性体凝胶的制备方法和应用
US11479668B2 (en) * 2017-10-20 2022-10-25 Dow Toray Co., Ltd. Curable granular silicone composition, cured object obtained therefrom, and production method therefor
KR102776795B1 (ko) 2018-12-25 2025-03-10 다우 도레이 캄파니 리미티드 경화 반응성 실리콘 점착제 조성물 및 그 경화물 및 이들의 용도
CN111675996A (zh) * 2020-06-10 2020-09-18 湖北平安电工股份有限公司 一种硬云母板胶粘剂及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0661349A2 (en) * 1993-12-29 1995-07-05 Dow Corning Toray Silicone Company, Limited Thermosetting silicone composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844992A (en) 1973-11-16 1974-10-29 Dow Corning Wood graining tool fast cure organopolysiloxane resins
JPS5134259A (ja) 1974-09-17 1976-03-23 Shinetsu Chemical Co Kotainetsukokaseishirikoonjushisoseibutsu
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US5082894A (en) * 1990-03-19 1992-01-21 Dow Corning Corporation Storage stable one-part organosiloxane compositions
US5153238A (en) 1991-11-12 1992-10-06 Dow Corning Corporation Storage stable organosiloxane composition and method for preparing same
JP2000026727A (ja) * 1998-07-06 2000-01-25 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
JP4663969B2 (ja) * 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP4767481B2 (ja) * 2003-05-02 2011-09-07 信越化学工業株式会社 硬化性組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0661349A2 (en) * 1993-12-29 1995-07-05 Dow Corning Toray Silicone Company, Limited Thermosetting silicone composition

Also Published As

Publication number Publication date
KR20080114707A (ko) 2008-12-31
TW200736341A (en) 2007-10-01
JP5420141B2 (ja) 2014-02-19
CN101395212A (zh) 2009-03-25
EP1989253A1 (en) 2008-11-12
JP2007231173A (ja) 2007-09-13
WO2007099863A1 (en) 2007-09-07
KR101456051B1 (ko) 2014-11-04
EP1989253B1 (en) 2013-10-02
US20090099321A1 (en) 2009-04-16

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