CN101395212A - 可固化的有机硅树脂组合物及其固化体 - Google Patents

可固化的有机硅树脂组合物及其固化体 Download PDF

Info

Publication number
CN101395212A
CN101395212A CNA2007800074696A CN200780007469A CN101395212A CN 101395212 A CN101395212 A CN 101395212A CN A2007800074696 A CNA2007800074696 A CN A2007800074696A CN 200780007469 A CN200780007469 A CN 200780007469A CN 101395212 A CN101395212 A CN 101395212A
Authority
CN
China
Prior art keywords
composition
component
silicone resin
platinum
curable silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800074696A
Other languages
English (en)
Chinese (zh)
Inventor
吉武诚
竹内香须美
中西康二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN101395212A publication Critical patent/CN101395212A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/10Encapsulated ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • C08J3/22Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • C08J3/14Powdering or granulating by precipitation from solutions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNA2007800074696A 2006-03-01 2007-02-16 可固化的有机硅树脂组合物及其固化体 Pending CN101395212A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006055086A JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物
JP055086/2006 2006-03-01

Publications (1)

Publication Number Publication Date
CN101395212A true CN101395212A (zh) 2009-03-25

Family

ID=38024102

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800074696A Pending CN101395212A (zh) 2006-03-01 2007-02-16 可固化的有机硅树脂组合物及其固化体

Country Status (7)

Country Link
US (1) US20090099321A1 (enExample)
EP (1) EP1989253B1 (enExample)
JP (1) JP5420141B2 (enExample)
KR (1) KR101456051B1 (enExample)
CN (1) CN101395212A (enExample)
TW (1) TWI402314B (enExample)
WO (1) WO2007099863A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103087327A (zh) * 2013-02-01 2013-05-08 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
CN113637450A (zh) * 2020-06-10 2021-11-12 湖北平安电工科技股份公司 一种硬云母板胶粘剂及其制备方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072263B2 (ja) * 2006-05-16 2012-11-14 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP5442941B2 (ja) * 2007-07-12 2014-03-19 株式会社カネカ 硬化性組成物
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
US8491816B2 (en) 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
JP4678415B2 (ja) * 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010018786A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
WO2010096700A2 (en) * 2009-02-19 2010-08-26 Sajjad Basha S Photovoltaic module configuration
EP2706095B1 (en) * 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
EP2716717B1 (en) * 2011-05-31 2016-04-06 Momentive Performance Materials Japan LLC Silicone composition for sealing semiconductor
JP5831959B2 (ja) * 2011-11-25 2015-12-16 エルジー・ケム・リミテッド 硬化性組成物
EP2784105B1 (en) * 2011-11-25 2017-05-10 LG Chem, Ltd. Method for producing organopolysiloxane
CN103987787B (zh) * 2011-11-25 2016-08-24 Lg化学株式会社 可固化组合物
TWI498356B (zh) * 2011-11-25 2015-09-01 Lg化學股份有限公司 有機聚矽氧烷
EP2784126B1 (en) * 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
JP5805883B2 (ja) * 2011-11-25 2015-11-10 エルジー・ケム・リミテッド 硬化性組成物
JP6133592B2 (ja) * 2012-12-22 2017-05-24 東レ・ダウコーニング株式会社 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法
WO2014157682A1 (ja) * 2013-03-29 2014-10-02 出光興産株式会社 ポリオルガノシロキサン及びポリカーボネート-ポリオルガノシロキサン共重合体
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
JP6707516B2 (ja) * 2015-02-25 2020-06-10 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、およびその製造方法
JP6656045B2 (ja) * 2016-03-29 2020-03-04 信越化学工業株式会社 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法
CN110809597B (zh) 2017-06-19 2022-02-18 美国陶氏有机硅公司 用于传递或注射成型光学部件的液体有机硅组合物、由其制成的光学部件及其方法
CN107446145A (zh) * 2017-09-12 2017-12-08 广州天赐高新材料股份有限公司 一种日化用有机硅弹性体凝胶的制备方法和应用
EP3699236A4 (en) * 2017-10-20 2021-07-14 Dow Toray Co., Ltd. COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION
CN113195222B (zh) 2018-12-25 2023-05-09 陶氏东丽株式会社 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844992A (en) * 1973-11-16 1974-10-29 Dow Corning Wood graining tool fast cure organopolysiloxane resins
JPS5134259A (ja) 1974-09-17 1976-03-23 Shinetsu Chemical Co Kotainetsukokaseishirikoonjushisoseibutsu
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US5082894A (en) * 1990-03-19 1992-01-21 Dow Corning Corporation Storage stable one-part organosiloxane compositions
US5153238A (en) * 1991-11-12 1992-10-06 Dow Corning Corporation Storage stable organosiloxane composition and method for preparing same
JP3899134B2 (ja) * 1993-12-29 2007-03-28 東レ・ダウコーニング株式会社 加熱硬化性シリコーン組成物
JP2000026727A (ja) * 1998-07-06 2000-01-25 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
JP4663969B2 (ja) * 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP4767481B2 (ja) * 2003-05-02 2011-09-07 信越化学工業株式会社 硬化性組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103087327A (zh) * 2013-02-01 2013-05-08 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
CN103087327B (zh) * 2013-02-01 2014-12-10 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
CN113637450A (zh) * 2020-06-10 2021-11-12 湖北平安电工科技股份公司 一种硬云母板胶粘剂及其制备方法

Also Published As

Publication number Publication date
JP2007231173A (ja) 2007-09-13
WO2007099863A1 (en) 2007-09-07
KR101456051B1 (ko) 2014-11-04
EP1989253A1 (en) 2008-11-12
TW200736341A (en) 2007-10-01
TWI402314B (zh) 2013-07-21
KR20080114707A (ko) 2008-12-31
EP1989253B1 (en) 2013-10-02
US20090099321A1 (en) 2009-04-16
JP5420141B2 (ja) 2014-02-19

Similar Documents

Publication Publication Date Title
CN101395212A (zh) 可固化的有机硅树脂组合物及其固化体
CN101443416B (zh) 可固化的有机硅树脂组合物及其固化体
EP2271714B1 (en) Curable organopolysiloxane composition and cured product thereof
KR101800341B1 (ko) 폴리실록산 조성물 및 이의 경화물
TW201922932A (zh) 硬化性粒狀聚矽氧組成物、其硬化物、及其製造方法
EP2892953B1 (en) Curable silicone composition and cured product thereof
JP6965346B2 (ja) ダイボンディング用硬化性シリコーン組成物
JP4875251B2 (ja) シリコーンゲル組成物
CN109312160B (zh) 加成固化性液体硅橡胶组合物
EP2733160A1 (en) Organo polysiloxane, and method for producing same
TW201918513A (zh) 包含填料之聚矽氧組成物
JP4733933B2 (ja) 硬化性オルガノポリシロキサン組成物
EP2721108A1 (en) Cross-linkable silicone composition and cross-linked product thereof
CN110382625A (zh) 可固化的有机聚硅氧烷组合物和半导体器件
TWI870520B (zh) 固化性白色有機矽組成物、光半導體裝置用反射材料及光半導體裝置
JP4553562B2 (ja) 接着性ポリオルガノシロキサン組成物
TWI890864B (zh) 固化性氟矽氧組成物
TW202428781A (zh) 固化性矽酮組成物
JP7728369B2 (ja) 熱伝導性シリコーン組成物
CN115315487A (zh) 固化性液态有机硅组合物、其固化物、包含该组合物的光学填充剂、以及包含由该固化物形成的层的显示装置
JP7721388B2 (ja) 硬化性シリコーン組成物
JP2025064157A (ja) 付加反応硬化型シリコーン組成物
JP2014024987A (ja) 微粒子及びそれを含む硬化性オルガノポリシロキサン組成物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20090325