KR101456051B1 - 경화가능한 실리콘 수지 조성물 및 이의 경화체 - Google Patents

경화가능한 실리콘 수지 조성물 및 이의 경화체 Download PDF

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Publication number
KR101456051B1
KR101456051B1 KR1020087021407A KR20087021407A KR101456051B1 KR 101456051 B1 KR101456051 B1 KR 101456051B1 KR 1020087021407 A KR1020087021407 A KR 1020087021407A KR 20087021407 A KR20087021407 A KR 20087021407A KR 101456051 B1 KR101456051 B1 KR 101456051B1
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South Korea
Prior art keywords
silicone resin
curable silicone
group
resin composition
component
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Expired - Fee Related
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KR1020087021407A
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English (en)
Korean (ko)
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KR20080114707A (ko
Inventor
마코토 요시타케
카스미 타케우치
코지 나카니시
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020087021407A 2006-03-01 2007-02-16 경화가능한 실리콘 수지 조성물 및 이의 경화체 Expired - Fee Related KR101456051B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006055086A JP5420141B2 (ja) 2006-03-01 2006-03-01 硬化性シリコーンレジン組成物および硬化物
JPJP-P-2006-00055086 2006-03-01
PCT/JP2007/053347 WO2007099863A1 (en) 2006-03-01 2007-02-16 Curable silicone resin composition and cured body thereof

Publications (2)

Publication Number Publication Date
KR20080114707A KR20080114707A (ko) 2008-12-31
KR101456051B1 true KR101456051B1 (ko) 2014-11-04

Family

ID=38024102

Family Applications (1)

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KR1020087021407A Expired - Fee Related KR101456051B1 (ko) 2006-03-01 2007-02-16 경화가능한 실리콘 수지 조성물 및 이의 경화체

Country Status (7)

Country Link
US (1) US20090099321A1 (enExample)
EP (1) EP1989253B1 (enExample)
JP (1) JP5420141B2 (enExample)
KR (1) KR101456051B1 (enExample)
CN (1) CN101395212A (enExample)
TW (1) TWI402314B (enExample)
WO (1) WO2007099863A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072263B2 (ja) * 2006-05-16 2012-11-14 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP5442941B2 (ja) * 2007-07-12 2014-03-19 株式会社カネカ 硬化性組成物
JP4623322B2 (ja) * 2007-12-26 2011-02-02 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法
US8491816B2 (en) 2008-02-07 2013-07-23 Mitsubishi Chemical Corporation Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them
JP4678415B2 (ja) * 2008-03-18 2011-04-27 信越化学工業株式会社 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース
JP2010018786A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP2010021533A (ja) 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
WO2010096700A2 (en) * 2009-02-19 2010-08-26 Sajjad Basha S Photovoltaic module configuration
EP2706095B1 (en) * 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
EP2716717B1 (en) * 2011-05-31 2016-04-06 Momentive Performance Materials Japan LLC Silicone composition for sealing semiconductor
JP5831959B2 (ja) * 2011-11-25 2015-12-16 エルジー・ケム・リミテッド 硬化性組成物
EP2784105B1 (en) * 2011-11-25 2017-05-10 LG Chem, Ltd. Method for producing organopolysiloxane
CN103987787B (zh) * 2011-11-25 2016-08-24 Lg化学株式会社 可固化组合物
TWI498356B (zh) * 2011-11-25 2015-09-01 Ｌｇ化學股份有限公司 有機聚矽氧烷
EP2784126B1 (en) * 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
JP5805883B2 (ja) * 2011-11-25 2015-11-10 エルジー・ケム・リミテッド 硬化性組成物
JP6133592B2 (ja) * 2012-12-22 2017-05-24 東レ・ダウコーニング株式会社 低白金量のヒドロシリル化反応架橋性シリコーンゴムパウダー、化粧料およびシリコーンゴムパウダーの製造方法
CN103087327B (zh) * 2013-02-01 2014-12-10 苏州大学 一种室温树脂传递模塑用透明有机硅树脂及其制备方法
WO2014157682A1 (ja) * 2013-03-29 2014-10-02 出光興産株式会社 ポリオルガノシロキサン及びポリカーボネート－ポリオルガノシロキサン共重合体
KR102419245B1 (ko) * 2014-09-01 2022-07-11 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 실리콘 조성물, 경화성 핫 멜트 실리콘, 및 광 디바이스
JP6707516B2 (ja) * 2015-02-25 2020-06-10 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、およびその製造方法
JP6656045B2 (ja) * 2016-03-29 2020-03-04 信越化学工業株式会社 担持白金触媒を含有する樹脂組成物、及びそれを用いた熱硬化性オルガノポリシロキサン組成物ならびにその硬化方法
CN110809597B (zh) 2017-06-19 2022-02-18 美国陶氏有机硅公司 用于传递或注射成型光学部件的液体有机硅组合物、由其制成的光学部件及其方法
CN107446145A (zh) * 2017-09-12 2017-12-08 广州天赐高新材料股份有限公司 一种日化用有机硅弹性体凝胶的制备方法和应用
EP3699236A4 (en) * 2017-10-20 2021-07-14 Dow Toray Co., Ltd. COMPOSITION OF PARTICULAR CURING SILICONE, RELATED CURED ARTICLE, AND METHOD FOR MANUFACTURING THIS COMPOSITION
CN113195222B (zh) 2018-12-25 2023-05-09 陶氏东丽株式会社 固化反应性有机硅粘合剂组合物及其固化物以及它们的用途
CN111675996A (zh) * 2020-06-10 2020-09-18 湖北平安电工股份有限公司 一种硬云母板胶粘剂及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US5153238A (en) * 1991-11-12 1992-10-06 Dow Corning Corporation Storage stable organosiloxane composition and method for preparing same
US5877237A (en) * 1993-12-29 1999-03-02 Dow Corning Toray Silicone Co., Ltd. Thermosetting silicone composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844992A (en) * 1973-11-16 1974-10-29 Dow Corning Wood graining tool fast cure organopolysiloxane resins
JPS5134259A (ja) 1974-09-17 1976-03-23 Shinetsu Chemical Co Kotainetsukokaseishirikoonjushisoseibutsu
US5082894A (en) * 1990-03-19 1992-01-21 Dow Corning Corporation Storage stable one-part organosiloxane compositions
JP2000026727A (ja) * 1998-07-06 2000-01-25 Dow Corning Toray Silicone Co Ltd 硬化性シリコーンレジン組成物
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
JP4663969B2 (ja) * 2002-07-09 2011-04-06 東レ・ダウコーニング株式会社 硬化性シリコーンレジン組成物およびその硬化物
JP4767481B2 (ja) * 2003-05-02 2011-09-07 信越化学工業株式会社 硬化性組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
US5153238A (en) * 1991-11-12 1992-10-06 Dow Corning Corporation Storage stable organosiloxane composition and method for preparing same
US5877237A (en) * 1993-12-29 1999-03-02 Dow Corning Toray Silicone Co., Ltd. Thermosetting silicone composition

Also Published As

Publication number Publication date
JP2007231173A (ja) 2007-09-13
WO2007099863A1 (en) 2007-09-07
EP1989253A1 (en) 2008-11-12
TW200736341A (en) 2007-10-01
TWI402314B (zh) 2013-07-21
KR20080114707A (ko) 2008-12-31
EP1989253B1 (en) 2013-10-02
CN101395212A (zh) 2009-03-25
US20090099321A1 (en) 2009-04-16
JP5420141B2 (ja) 2014-02-19

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