JP5410094B2 - 導電フィルム、その製造方法及び高周波部品 - Google Patents

導電フィルム、その製造方法及び高周波部品 Download PDF

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Publication number
JP5410094B2
JP5410094B2 JP2008550187A JP2008550187A JP5410094B2 JP 5410094 B2 JP5410094 B2 JP 5410094B2 JP 2008550187 A JP2008550187 A JP 2008550187A JP 2008550187 A JP2008550187 A JP 2008550187A JP 5410094 B2 JP5410094 B2 JP 5410094B2
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JP
Japan
Prior art keywords
thin film
metal thin
film
metal
conductive film
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Expired - Fee Related
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JP2008550187A
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English (en)
Japanese (ja)
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JPWO2008075746A1 (ja
Inventor
清二 加川
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清二 加川
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Priority to JP2008550187A priority Critical patent/JP5410094B2/ja
Publication of JPWO2008075746A1 publication Critical patent/JPWO2008075746A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2008550187A 2006-12-20 2007-12-20 導電フィルム、その製造方法及び高周波部品 Expired - Fee Related JP5410094B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008550187A JP5410094B2 (ja) 2006-12-20 2007-12-20 導電フィルム、その製造方法及び高周波部品

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006343396 2006-12-20
JP2006343396 2006-12-20
JP2007086047 2007-03-28
JP2007086047 2007-03-28
PCT/JP2007/074574 WO2008075746A1 (ja) 2006-12-20 2007-12-20 導電フィルム、その製造方法及び高周波部品
JP2008550187A JP5410094B2 (ja) 2006-12-20 2007-12-20 導電フィルム、その製造方法及び高周波部品

Publications (2)

Publication Number Publication Date
JPWO2008075746A1 JPWO2008075746A1 (ja) 2010-04-15
JP5410094B2 true JP5410094B2 (ja) 2014-02-05

Family

ID=39536374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008550187A Expired - Fee Related JP5410094B2 (ja) 2006-12-20 2007-12-20 導電フィルム、その製造方法及び高周波部品

Country Status (3)

Country Link
JP (1) JP5410094B2 (zh)
TW (1) TWI455400B (zh)
WO (1) WO2008075746A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101572459B1 (ko) * 2008-06-26 2015-11-27 세이지 까가와 전자파 흡수 필름 및 그것을 사용한 전자파 흡수체
JP5150534B2 (ja) * 2009-03-06 2013-02-20 信越ポリマー株式会社 カバーレイフィルム、その製造方法およびフレキシブルプリント配線板
US9326433B2 (en) 2009-12-25 2016-04-26 Seiji Kagawa Composite electromagnetic-wave-absorbing film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102217A (ja) * 1995-03-06 1997-04-15 W L Gore & Assoc Inc 改良された高周波信号伝送特性を有する複合導体
JP2004039455A (ja) * 2002-07-03 2004-02-05 Seiji Kagawa 導通孔付き金属蒸着導電性薄膜及びその製造方法並びに用途
JP2007221713A (ja) * 2006-02-20 2007-08-30 Seiji Kagawa 高周波伝送線路
WO2008026743A1 (fr) * 2006-08-31 2008-03-06 Seiji Kagawa Film conducteur de liaison de gradient, ligne de transmission à haute fréquence et filtre à haute fréquence associé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102217A (ja) * 1995-03-06 1997-04-15 W L Gore & Assoc Inc 改良された高周波信号伝送特性を有する複合導体
JP2004039455A (ja) * 2002-07-03 2004-02-05 Seiji Kagawa 導通孔付き金属蒸着導電性薄膜及びその製造方法並びに用途
JP2007221713A (ja) * 2006-02-20 2007-08-30 Seiji Kagawa 高周波伝送線路
WO2008026743A1 (fr) * 2006-08-31 2008-03-06 Seiji Kagawa Film conducteur de liaison de gradient, ligne de transmission à haute fréquence et filtre à haute fréquence associé

Also Published As

Publication number Publication date
TW200835045A (en) 2008-08-16
WO2008075746A1 (ja) 2008-06-26
TWI455400B (zh) 2014-10-01
JPWO2008075746A1 (ja) 2010-04-15

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