JP5401714B2 - 無電解メッキによるスズホイスカーの防止方法 - Google Patents

無電解メッキによるスズホイスカーの防止方法 Download PDF

Info

Publication number
JP5401714B2
JP5401714B2 JP2007336812A JP2007336812A JP5401714B2 JP 5401714 B2 JP5401714 B2 JP 5401714B2 JP 2007336812 A JP2007336812 A JP 2007336812A JP 2007336812 A JP2007336812 A JP 2007336812A JP 5401714 B2 JP5401714 B2 JP 5401714B2
Authority
JP
Japan
Prior art keywords
tin
film
silver
acid
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007336812A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009155703A (ja
Inventor
薫 田中
拓郎 不可三
洋 旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd filed Critical Ishihara Chemical Co Ltd
Priority to JP2007336812A priority Critical patent/JP5401714B2/ja
Priority to TW97143674A priority patent/TWI470116B/zh
Priority to KR1020080126730A priority patent/KR101514788B1/ko
Publication of JP2009155703A publication Critical patent/JP2009155703A/ja
Application granted granted Critical
Publication of JP5401714B2 publication Critical patent/JP5401714B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
JP2007336812A 2007-12-27 2007-12-27 無電解メッキによるスズホイスカーの防止方法 Active JP5401714B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007336812A JP5401714B2 (ja) 2007-12-27 2007-12-27 無電解メッキによるスズホイスカーの防止方法
TW97143674A TWI470116B (zh) 2007-12-27 2008-11-12 To prevent electroless plating caused by tin whisker method
KR1020080126730A KR101514788B1 (ko) 2007-12-27 2008-12-12 무전해 도금에 의한 주석 휘스커의 방지 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007336812A JP5401714B2 (ja) 2007-12-27 2007-12-27 無電解メッキによるスズホイスカーの防止方法

Publications (2)

Publication Number Publication Date
JP2009155703A JP2009155703A (ja) 2009-07-16
JP5401714B2 true JP5401714B2 (ja) 2014-01-29

Family

ID=40960018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007336812A Active JP5401714B2 (ja) 2007-12-27 2007-12-27 無電解メッキによるスズホイスカーの防止方法

Country Status (3)

Country Link
JP (1) JP5401714B2 (zh)
KR (1) KR101514788B1 (zh)
TW (1) TWI470116B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9175400B2 (en) 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
JP5138827B1 (ja) * 2012-03-23 2013-02-06 Jx日鉱日石金属株式会社 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品
TWI648151B (zh) * 2017-09-13 2019-01-21 國立屏東科技大學 半導體之錫銀接合結構及其製造方法
CN108012449A (zh) * 2017-10-28 2018-05-08 惠州市盈海数码电器有限公司 Cd收音组合机电路板用定位安装机构及定位系统
CN112291941B (zh) * 2019-07-24 2022-02-18 北大方正集团有限公司 印制电路板及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3513709B2 (ja) * 2001-10-16 2004-03-31 石原薬品株式会社 前処理によるスズホイスカーの防止方法
JP3855161B2 (ja) * 2002-05-10 2006-12-06 石原薬品株式会社 電子部品のスズホイスカーの防止方法
JP2006009039A (ja) * 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
JP2007053039A (ja) * 2005-08-19 2007-03-01 Matsushita Electric Ind Co Ltd 電気コネクタ接合構造及びそれに用いるフレキシブル配線基板

Also Published As

Publication number Publication date
JP2009155703A (ja) 2009-07-16
KR101514788B1 (ko) 2015-04-23
TW200936806A (en) 2009-09-01
KR20090071388A (ko) 2009-07-01
TWI470116B (zh) 2015-01-21

Similar Documents

Publication Publication Date Title
JP3871013B2 (ja) 錫−銅合金電気めっき浴及びそれを使用するめっき方法
JP5401714B2 (ja) 無電解メッキによるスズホイスカーの防止方法
JP2008174817A (ja) 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
JPH1121673A (ja) 鉛フリーの無電解スズ合金メッキ浴及びメッキ方法、並びに当該無電解メッキ浴で鉛を含まないスズ合金皮膜を形成した電子部品
JP4288469B2 (ja) 銅侵食防止用の無電解スズメッキ浴、及び銅侵食防止方法
JP3855161B2 (ja) 電子部品のスズホイスカーの防止方法
JP7015975B2 (ja) 錫又は錫合金めっき液
CN107406999A (zh) 使用了铵盐的电镀液
JP6029259B2 (ja) 無電解錫又は錫合金めっき液及び該めっき液を用いて錫又は錫合金被膜を形成した電子部品
JP4609703B2 (ja) 銅系素材用置換ビスマスメッキ浴
JP4157975B2 (ja) 無電解スズ及びスズ合金メッキ浴、当該無電解メッキ方法、並びに当該無電解メッキ浴でスズ又はスズ合金皮膜を形成したtabのフィルムキャリア
JP4901181B2 (ja) 無電解スズメッキ浴
JP4665244B2 (ja) 置換銀メッキ浴
TW201704545A (zh) 使用鏻鹽之鍍敷液
JP4186030B2 (ja) 無電解スズ−銀合金メッキ浴及び当該メッキ浴でスズ−銀合金皮膜を施したtabのフィルムキャリア等
JP4640558B2 (ja) 無電解スズ−銀合金メッキ浴
JP4901168B2 (ja) 置換銀メッキ浴
JP5278988B2 (ja) 無電解スズメッキ浴及び電子部品の無電解スズメッキ方法
JP4147388B2 (ja) 銅侵食防止用の無電解スズメッキ浴、及び銅侵食防止方法
JP3489037B2 (ja) Tab用無電解スズ又はスズ―鉛合金メッキ浴、及びtabのフィルムキャリヤの無電解スズ又はスズ―鉛合金メッキ方法
WO2016152983A1 (ja) ホスホニウム塩を用いためっき液
JP5424461B2 (ja) 無電解錫又は錫合金めっき液及び該めっき液を用いて錫又は錫合金被膜を形成した電子部品
CN107406998A (zh) 使用了硫鎓盐的电镀液
WO2020230504A1 (ja) フレキシブル配線回路基板の製造方法
JP4150901B2 (ja) 無電解スズ系メッキの前処理方法、及びスズ系メッキ皮膜の異常析出防止方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20101214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20101215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130312

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130412

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131001

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131009

R150 Certificate of patent or registration of utility model

Ref document number: 5401714

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250