JP5391869B2 - 基板検査方法 - Google Patents

基板検査方法 Download PDF

Info

Publication number
JP5391869B2
JP5391869B2 JP2009152670A JP2009152670A JP5391869B2 JP 5391869 B2 JP5391869 B2 JP 5391869B2 JP 2009152670 A JP2009152670 A JP 2009152670A JP 2009152670 A JP2009152670 A JP 2009152670A JP 5391869 B2 JP5391869 B2 JP 5391869B2
Authority
JP
Japan
Prior art keywords
unit
electrode side
inspection
wiring pattern
wiring patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009152670A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011007687A (ja
Inventor
宗寛 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2009152670A priority Critical patent/JP5391869B2/ja
Priority to TW099120438A priority patent/TWI403734B/zh
Priority to KR1020100060173A priority patent/KR101112696B1/ko
Priority to CN2010102142102A priority patent/CN101937030B/zh
Publication of JP2011007687A publication Critical patent/JP2011007687A/ja
Application granted granted Critical
Publication of JP5391869B2 publication Critical patent/JP5391869B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2009152670A 2009-06-26 2009-06-26 基板検査方法 Active JP5391869B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009152670A JP5391869B2 (ja) 2009-06-26 2009-06-26 基板検査方法
TW099120438A TWI403734B (zh) 2009-06-26 2010-06-23 基板檢驗方法
KR1020100060173A KR101112696B1 (ko) 2009-06-26 2010-06-24 기판검사방법
CN2010102142102A CN101937030B (zh) 2009-06-26 2010-06-25 基板检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009152670A JP5391869B2 (ja) 2009-06-26 2009-06-26 基板検査方法

Publications (2)

Publication Number Publication Date
JP2011007687A JP2011007687A (ja) 2011-01-13
JP5391869B2 true JP5391869B2 (ja) 2014-01-15

Family

ID=43390466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009152670A Active JP5391869B2 (ja) 2009-06-26 2009-06-26 基板検査方法

Country Status (4)

Country Link
JP (1) JP5391869B2 (ko)
KR (1) KR101112696B1 (ko)
CN (1) CN101937030B (ko)
TW (1) TWI403734B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013104799A (ja) * 2011-11-15 2013-05-30 Sharp Corp 検査装置、検査方法、検査プログラム及びプログラム記録媒体
JP2013104798A (ja) * 2011-11-15 2013-05-30 Sharp Corp 検査装置、検査方法、検査プログラム及びプログラム記録媒体
JP2014020815A (ja) * 2012-07-13 2014-02-03 Hioki Ee Corp 基板検査装置および基板検査方法
JP2015001470A (ja) * 2013-06-17 2015-01-05 日本電産リード株式会社 基板検査装置
JP6229877B2 (ja) * 2013-08-27 2017-11-15 日本電産リード株式会社 検査装置
JP6592885B2 (ja) * 2014-10-08 2019-10-23 日本電産リード株式会社 基板検査方法及び基板検査装置
KR20160105082A (ko) 2015-02-27 2016-09-06 삼성전기주식회사 기판 검사 장치 및 그 검사 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2718370B2 (ja) * 1994-07-29 1998-02-25 日本電気株式会社 配線ショート箇所検出方法および配線ショート箇所検出装置
JP3163909B2 (ja) * 1994-08-19 2001-05-08 株式会社富士通ゼネラル 安全試験の自動化装置
JP4068248B2 (ja) * 1998-12-28 2008-03-26 日本電産リード株式会社 基板の絶縁検査装置及びその絶縁検査方法
JP2001337051A (ja) 2000-05-29 2001-12-07 Aitesu:Kk 基板製品検査装置、基板製品検査方法、及び検査用プローブ
JP2007206050A (ja) 2000-11-17 2007-08-16 Ebara Corp 基板検査方法、基板検査装置及び電子線装置
JP4810741B2 (ja) * 2001-03-23 2011-11-09 富士ゼロックス株式会社 自己走査型発光デバイス
JP2004239877A (ja) 2003-02-10 2004-08-26 Renesas Technology Corp 回路パターンの検査方法および半導体装置の製造方法
JP2007178318A (ja) * 2005-12-28 2007-07-12 Nidec-Read Corp 基板検査装置及び方法
CN101101886A (zh) * 2006-06-05 2008-01-09 松下电器产业株式会社 半导体检查装置及半导体集成电路的检查方法
JP4825083B2 (ja) * 2006-08-28 2011-11-30 株式会社アドテックエンジニアリング なぞり式回路基板検査装置
JP2008128678A (ja) * 2006-11-16 2008-06-05 Nidec-Read Corp 絶縁検査装置及び絶縁検査方法
JP4918339B2 (ja) * 2006-11-30 2012-04-18 日本電産リード株式会社 基板検査装置
US7714596B2 (en) * 2006-12-15 2010-05-11 Four Dimensions Inc. System and methods of measuring semiconductor sheet resistivity and junction leakage current
JP5014778B2 (ja) * 2006-12-28 2012-08-29 日本電産リード株式会社 基板検査方法及び基板検査装置

Also Published As

Publication number Publication date
CN101937030A (zh) 2011-01-05
TW201111812A (en) 2011-04-01
KR101112696B1 (ko) 2012-02-17
JP2011007687A (ja) 2011-01-13
CN101937030B (zh) 2013-03-27
KR20110000518A (ko) 2011-01-03
TWI403734B (zh) 2013-08-01

Similar Documents

Publication Publication Date Title
JP5391869B2 (ja) 基板検査方法
KR101367439B1 (ko) 절연 검사 장치 및 절연 검사 방법
KR101612091B1 (ko) 정전 척의 검사방법 및 정전 척 장치
US9606166B2 (en) Insulation inspection apparatus and insulation inspection method
KR20080049624A (ko) 기판 검사 장치 및 기판 검사 방법
KR20150111865A (ko) 저항 측정 장치, 기판 검사 장치, 검사 방법, 및 검사용 지그의 메인터넌스 방법
US9606162B2 (en) Insulation inspection method and insulation inspection apparatus
JP4008173B2 (ja) 蓄電器の絶縁抵抗測定方法および絶縁抵抗測定装置
JP2008203077A (ja) 回路検査装置及び回路検査方法
JP2007333465A (ja) 検査装置
KR20150138828A (ko) 기판 검사 장치 및 기판 검사 방법
KR20130092462A (ko) 부품내장기판의 검사방법
JP2012149914A (ja) プリント基板劣化検査装置および劣化検査方法
JP2015001470A (ja) 基板検査装置
JP2009162669A (ja) 絶縁抵抗測定回路
KR101961536B1 (ko) 기판 검사 장치 및 기판 검사 방법
JP2008164416A (ja) 基板検査方法及び基板検査装置
JP4259692B2 (ja) 回路基板検査装置
JP5425709B2 (ja) 絶縁検査装置および絶縁検査方法
JP2007139797A (ja) 絶縁検査装置及び絶縁検査方法
JP2014219335A (ja) 検査装置および検査方法
JP5307085B2 (ja) 回路基板検査装置
KR20230089427A (ko) 절연 검사 장치 및 절연 검사 방법
JP2008076266A (ja) 基板検査装置及び基板検査方法
KR20230089426A (ko) Ai를 이용한 기판 검사 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120425

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130911

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130917

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130930

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5391869

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250