JP5385870B2 - カリックスアレーン・ブレンド分子ガラス・フォトレジスト及び使用のプロセス - Google Patents
カリックスアレーン・ブレンド分子ガラス・フォトレジスト及び使用のプロセス Download PDFInfo
- Publication number
- JP5385870B2 JP5385870B2 JP2010163887A JP2010163887A JP5385870B2 JP 5385870 B2 JP5385870 B2 JP 5385870B2 JP 2010163887 A JP2010163887 A JP 2010163887A JP 2010163887 A JP2010163887 A JP 2010163887A JP 5385870 B2 JP5385870 B2 JP 5385870B2
- Authority
- JP
- Japan
- Prior art keywords
- calix
- resorcinarene
- unprotected
- fully protected
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/507,968 US7993812B2 (en) | 2009-07-23 | 2009-07-23 | Calixarene blended molecular glass photoresists and processes of use |
| US12/507968 | 2009-07-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011028270A JP2011028270A (ja) | 2011-02-10 |
| JP2011028270A5 JP2011028270A5 (enExample) | 2013-10-10 |
| JP5385870B2 true JP5385870B2 (ja) | 2014-01-08 |
Family
ID=43497606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010163887A Expired - Fee Related JP5385870B2 (ja) | 2009-07-23 | 2010-07-21 | カリックスアレーン・ブレンド分子ガラス・フォトレジスト及び使用のプロセス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7993812B2 (enExample) |
| JP (1) | JP5385870B2 (enExample) |
| KR (1) | KR20110010056A (enExample) |
| CN (1) | CN101963758B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102597034A (zh) * | 2009-08-31 | 2012-07-18 | 三菱瓦斯化学株式会社 | 环状化合物、其制造方法、辐射敏感组合物及抗蚀图案形成方法 |
| CN102596874A (zh) * | 2009-09-09 | 2012-07-18 | 三菱瓦斯化学株式会社 | 环状化合物、其制造方法、辐射敏感组合物及抗蚀图案形成方法 |
| EP2487148B1 (en) * | 2009-10-06 | 2014-12-31 | Mitsubishi Gas Chemical Company, Inc. | Cyclic compound, method for producing same, radiation sensitive composition, and method for forming resist pattern |
| CN102666461B (zh) * | 2009-11-27 | 2015-09-30 | 三菱瓦斯化学株式会社 | 环状化合物、其生产方法、放射线敏感性组合物和抗蚀图案形成方法 |
| JP5692090B2 (ja) * | 2009-12-07 | 2015-04-01 | 三菱瓦斯化学株式会社 | 低分子量ポジ型感放射線性組成物及びレジストパターン形成方法 |
| JP2011180579A (ja) * | 2010-02-04 | 2011-09-15 | Sumitomo Chemical Co Ltd | レジスト組成物 |
| JPWO2012032790A1 (ja) * | 2010-09-10 | 2014-01-20 | 出光興産株式会社 | 酸解離性溶解抑止基を有する組成物 |
| JP2013067612A (ja) * | 2011-09-23 | 2013-04-18 | Rohm & Haas Electronic Materials Llc | カリックスアレーン化合物およびこれを含むフォトレジスト組成物 |
| JP2013079230A (ja) * | 2011-09-23 | 2013-05-02 | Rohm & Haas Electronic Materials Llc | カリックスアレーンおよびこれを含むフォトレジスト組成物 |
| CN102557930B (zh) * | 2012-01-05 | 2014-01-29 | 南京航空航天大学 | 联苯型分子玻璃及其制备方法 |
| JP5798964B2 (ja) * | 2012-03-27 | 2015-10-21 | 富士フイルム株式会社 | パターン形成方法、及び、これらを用いる電子デバイスの製造方法 |
| GB2501681A (en) * | 2012-04-30 | 2013-11-06 | Ibm | Nanoimprint lithographic methods |
| JP6268677B2 (ja) | 2012-10-17 | 2018-01-31 | 三菱瓦斯化学株式会社 | レジスト組成物 |
| US9063420B2 (en) * | 2013-07-16 | 2015-06-23 | Rohm And Haas Electronic Materials Llc | Photoresist composition, coated substrate, and method of forming electronic device |
| CN103752208A (zh) * | 2014-01-28 | 2014-04-30 | 扬州大学 | 一种起泡剂和稳泡剂及其合成方法 |
| CN108897192B (zh) * | 2018-04-19 | 2022-04-05 | 中科院广州化学有限公司南雄材料生产基地 | 一种巯基-烯纳米压印光刻胶及其使用方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5143784A (en) | 1990-05-10 | 1992-09-01 | Nec Corporation | Soluble calixarene derivative and films thereof |
| JP3443466B2 (ja) * | 1993-10-28 | 2003-09-02 | シップレーカンパニー エル エル シー | 感光性樹脂組成物 |
| JP3116751B2 (ja) | 1993-12-03 | 2000-12-11 | ジェイエスアール株式会社 | 感放射線性樹脂組成物 |
| JP3486341B2 (ja) | 1997-09-18 | 2004-01-13 | 株式会社東芝 | 感光性組成物およびそれを用いたパターン形成法 |
| US6093517A (en) * | 1998-07-31 | 2000-07-25 | International Business Machines Corporation | Calixarenes for use as dissolution inhibitors in lithographic photoresist compositions |
| US7037638B1 (en) | 2000-05-31 | 2006-05-02 | International Business Machines Corporation | High sensitivity crosslinkable photoresist composition, based on soluble, film forming dendrimeric calix[4] arene compositions method and for use thereof |
| US6713225B2 (en) | 2002-03-15 | 2004-03-30 | Toyo Gosei Kogyo Co., Ltd. | 1,2-Naphthoquinone-2-diazidesulfonate ester photosensitive agent, method for producing the photosensitive agent, and photoresist composition |
| JP4076789B2 (ja) * | 2002-05-09 | 2008-04-16 | Jsr株式会社 | カリックスレゾルシンアレーン誘導体および感放射線性樹脂組成物 |
| CN1688939A (zh) * | 2002-10-15 | 2005-10-26 | 出光兴产株式会社 | 光致抗蚀剂基材及其精制方法、和光致抗蚀剂组合物 |
| US7141692B2 (en) | 2003-11-24 | 2006-11-28 | International Business Machines Corporation | Molecular photoresists containing nonpolymeric silsesquioxanes |
| TWI342873B (en) | 2004-02-04 | 2011-06-01 | Univ Kanagawa | Calixarene compound, method for menufacturing same, intermediate of same, and composition containing same |
| CN101650531A (zh) * | 2004-04-05 | 2010-02-17 | 出光兴产株式会社 | 间苯二酚杯芳烃化合物、光致抗蚀剂基材及其组合物 |
| JPWO2005097725A1 (ja) | 2004-04-05 | 2008-02-28 | 出光興産株式会社 | カリックスレゾルシナレン化合物、フォトレジスト基材及びその組成物 |
| JP5092238B2 (ja) * | 2004-12-24 | 2012-12-05 | 三菱瓦斯化学株式会社 | レジスト用化合物および感放射線性組成物 |
| JP4434985B2 (ja) | 2005-02-18 | 2010-03-17 | 信越化学工業株式会社 | レジスト材料並びにこれを用いたパターン形成方法 |
| CN101218202A (zh) * | 2005-06-01 | 2008-07-09 | 木下博雄 | 杯间苯二酚芳烃化合物以及由其构成的光致抗蚀剂基材及其组合物 |
| KR100707163B1 (ko) * | 2005-10-12 | 2007-04-13 | 삼성에스디아이 주식회사 | 고체산, 이를 포함하는 고분자 전해질막 및 이를 채용한연료전지 |
| US20070122734A1 (en) | 2005-11-14 | 2007-05-31 | Roberts Jeanette M | Molecular photoresist |
| US8092976B2 (en) | 2006-09-28 | 2012-01-10 | Fujifilm Corporation | Resist composition and pattern forming method using the same |
| WO2008136372A1 (ja) * | 2007-04-27 | 2008-11-13 | Idemitsu Kosan Co., Ltd. | フォトレジスト基材、及びそれを含んでなるフォトレジスト組成物 |
| JP5435995B2 (ja) * | 2009-01-30 | 2014-03-05 | 出光興産株式会社 | 環状化合物の製造方法 |
-
2009
- 2009-07-23 US US12/507,968 patent/US7993812B2/en not_active Expired - Fee Related
-
2010
- 2010-07-08 KR KR1020100065657A patent/KR20110010056A/ko not_active Ceased
- 2010-07-21 JP JP2010163887A patent/JP5385870B2/ja not_active Expired - Fee Related
- 2010-07-23 CN CN2010102378473A patent/CN101963758B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7993812B2 (en) | 2011-08-09 |
| US20110020756A1 (en) | 2011-01-27 |
| CN101963758A (zh) | 2011-02-02 |
| CN101963758B (zh) | 2013-04-17 |
| JP2011028270A (ja) | 2011-02-10 |
| KR20110010056A (ko) | 2011-01-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5385870B2 (ja) | カリックスアレーン・ブレンド分子ガラス・フォトレジスト及び使用のプロセス | |
| US6749987B2 (en) | Positive photosensitive composition | |
| JP2002055452A (ja) | ポジ型レジスト組成物およびそのレジスト層を設けた基材 | |
| JP5796237B2 (ja) | フェノール系分子性ガラス、およびフェノール系分子ガラスを含むフォトレジスト組成物、および基板上にレジスト像を発生させるための方法 | |
| KR102644255B1 (ko) | 물질 조성물 및 이로부터 제조된 분자 레지스트 | |
| CN104914672B (zh) | 基于含多羟基结构分子玻璃的底部抗反射组合物及其应用 | |
| KR20020018132A (ko) | 포지티브형 포토레지스트조성물 및 이것을 이용한레지스트패턴형성방법 | |
| JP3666807B2 (ja) | ホトレジストパターンの形成方法およびホトレジスト積層体 | |
| TWI304155B (en) | Negative type resist composition | |
| JP3849486B2 (ja) | 化学増幅型ポジ型レジスト組成物 | |
| JP3711198B2 (ja) | レジストパターンの形成方法 | |
| US7329478B2 (en) | Chemical amplified positive photo resist composition and method for forming resist pattern | |
| US7901864B2 (en) | Radiation-sensitive composition and method of fabricating a device using the radiation-sensitive composition | |
| KR102856372B1 (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JP2011257635A (ja) | 絶縁膜形成用感光性組成物 | |
| TW567405B (en) | Positive resist composition | |
| KR102710053B1 (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JPH1195434A (ja) | ポジ型フォトレジスト組成物 | |
| KR20240025955A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| KR20240025956A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JP2004354954A (ja) | ホトレジスト組成物及びそれを用いたレジストパターン形成方法 | |
| KR20230105564A (ko) | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 | |
| JP2000122283A (ja) | レジスト用材料、該材料を用いた感光性樹脂組成物および該組成物を半導体装置の製造に使用する方法 | |
| KR20060068798A (ko) | 감광성 폴리머, 이를 포함하는 포토레지스트 조성물 및이를 이용한 포토레지스트 패턴 형성 방법 | |
| JP2005326580A (ja) | ネガ型レジスト組成物およびレジストパターン形成方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130402 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130805 Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130805 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20130805 |
|
| RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20130805 |
|
| TRDD | Decision of grant or rejection written | ||
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130806 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20130814 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130911 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20130911 |
|
| RD14 | Notification of resignation of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7434 Effective date: 20130911 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131004 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |