CN101963758B - 杯芳烃混合分子玻璃光致抗蚀剂及使用方法 - Google Patents

杯芳烃混合分子玻璃光致抗蚀剂及使用方法 Download PDF

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Publication number
CN101963758B
CN101963758B CN2010102378473A CN201010237847A CN101963758B CN 101963758 B CN101963758 B CN 101963758B CN 2010102378473 A CN2010102378473 A CN 2010102378473A CN 201010237847 A CN201010237847 A CN 201010237847A CN 101963758 B CN101963758 B CN 101963758B
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calix
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resorcinol
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arene
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Chinese (zh)
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CN101963758A (zh
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L·D·伯扎诺
伊藤淳子
L·K·桑德伯格
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Core Usa Second LLC
GlobalFoundries Inc
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International Business Machines Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN2010102378473A 2009-07-23 2010-07-23 杯芳烃混合分子玻璃光致抗蚀剂及使用方法 Expired - Fee Related CN101963758B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/507,968 2009-07-23
US12/507,968 US7993812B2 (en) 2009-07-23 2009-07-23 Calixarene blended molecular glass photoresists and processes of use

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CN101963758A CN101963758A (zh) 2011-02-02
CN101963758B true CN101963758B (zh) 2013-04-17

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US (1) US7993812B2 (enExample)
JP (1) JP5385870B2 (enExample)
KR (1) KR20110010056A (enExample)
CN (1) CN101963758B (enExample)

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US8883937B2 (en) * 2009-08-31 2014-11-11 Mitsubishi Gas Chemical Company, Inc. Cyclic compound, manufacturing method therefor, radiation-sensitive composition, and method for forming a resist pattern
KR101669705B1 (ko) * 2009-09-09 2016-10-27 미츠비시 가스 가가쿠 가부시키가이샤 환상 화합물, 그 제조 방법, 감방사선성 조성물 및 레지스트 패턴 형성 방법
KR101779512B1 (ko) * 2009-10-06 2017-09-18 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 시클릭 화합물, 이의 제조방법, 감방사선 조성물, 및 레지스트 패턴의 형성 방법
KR101801523B1 (ko) * 2009-11-27 2017-11-27 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 환상 화합물, 그 제조 방법, 감방사선성 조성물 및 레지스트 패턴 형성 방법
JP5692090B2 (ja) * 2009-12-07 2015-04-01 三菱瓦斯化学株式会社 低分子量ポジ型感放射線性組成物及びレジストパターン形成方法
JP2011180579A (ja) * 2010-02-04 2011-09-15 Sumitomo Chemical Co Ltd レジスト組成物
JPWO2012032790A1 (ja) * 2010-09-10 2014-01-20 出光興産株式会社 酸解離性溶解抑止基を有する組成物
JP2013067612A (ja) * 2011-09-23 2013-04-18 Rohm & Haas Electronic Materials Llc カリックスアレーン化合物およびこれを含むフォトレジスト組成物
JP2013079230A (ja) * 2011-09-23 2013-05-02 Rohm & Haas Electronic Materials Llc カリックスアレーンおよびこれを含むフォトレジスト組成物
CN102557930B (zh) * 2012-01-05 2014-01-29 南京航空航天大学 联苯型分子玻璃及其制备方法
JP5798964B2 (ja) * 2012-03-27 2015-10-21 富士フイルム株式会社 パターン形成方法、及び、これらを用いる電子デバイスの製造方法
GB2501681A (en) * 2012-04-30 2013-11-06 Ibm Nanoimprint lithographic methods
EP2911002B1 (en) 2012-10-17 2019-07-17 Mitsubishi Gas Chemical Company, Inc. Resist composition
US9063420B2 (en) * 2013-07-16 2015-06-23 Rohm And Haas Electronic Materials Llc Photoresist composition, coated substrate, and method of forming electronic device
CN103752208A (zh) * 2014-01-28 2014-04-30 扬州大学 一种起泡剂和稳泡剂及其合成方法
CN108897192B (zh) * 2018-04-19 2022-04-05 中科院广州化学有限公司南雄材料生产基地 一种巯基-烯纳米压印光刻胶及其使用方法

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US20110020756A1 (en) 2011-01-27
US7993812B2 (en) 2011-08-09
JP5385870B2 (ja) 2014-01-08
JP2011028270A (ja) 2011-02-10
CN101963758A (zh) 2011-02-02
KR20110010056A (ko) 2011-01-31

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