JP5317280B2 - 保護テープの剥離装置 - Google Patents

保護テープの剥離装置 Download PDF

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Publication number
JP5317280B2
JP5317280B2 JP2009168256A JP2009168256A JP5317280B2 JP 5317280 B2 JP5317280 B2 JP 5317280B2 JP 2009168256 A JP2009168256 A JP 2009168256A JP 2009168256 A JP2009168256 A JP 2009168256A JP 5317280 B2 JP5317280 B2 JP 5317280B2
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Japan
Prior art keywords
tape
peeling
protective tape
protective
release
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JP2009168256A
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English (en)
Japanese (ja)
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JP2011023612A5 (enExample
JP2011023612A (ja
Inventor
昌孝 土谷
和哉 原田
達也 本郷
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Takatori Corp
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Takatori Corp
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Priority to JP2009168256A priority Critical patent/JP5317280B2/ja
Priority to CN201010230381.4A priority patent/CN101969018B/zh
Priority to TW099123482A priority patent/TWI466185B/zh
Publication of JP2011023612A publication Critical patent/JP2011023612A/ja
Publication of JP2011023612A5 publication Critical patent/JP2011023612A5/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP2009168256A 2009-07-16 2009-07-16 保護テープの剥離装置 Active JP5317280B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009168256A JP5317280B2 (ja) 2009-07-16 2009-07-16 保護テープの剥離装置
CN201010230381.4A CN101969018B (zh) 2009-07-16 2010-07-15 保护胶带的剥离装置
TW099123482A TWI466185B (zh) 2009-07-16 2010-07-16 保護膠帶的剝離裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009168256A JP5317280B2 (ja) 2009-07-16 2009-07-16 保護テープの剥離装置

Publications (3)

Publication Number Publication Date
JP2011023612A JP2011023612A (ja) 2011-02-03
JP2011023612A5 JP2011023612A5 (enExample) 2012-07-26
JP5317280B2 true JP5317280B2 (ja) 2013-10-16

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ID=43548155

Family Applications (1)

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JP2009168256A Active JP5317280B2 (ja) 2009-07-16 2009-07-16 保護テープの剥離装置

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JP (1) JP5317280B2 (enExample)
CN (1) CN101969018B (enExample)
TW (1) TWI466185B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5981229B2 (ja) * 2012-06-01 2016-08-31 リンテック株式会社 シート剥離装置及び剥離方法
JP6247075B2 (ja) * 2013-10-30 2017-12-13 日東電工株式会社 保護テープ剥離方法および保護テープ剥離装置
JP6325323B2 (ja) * 2014-04-14 2018-05-16 株式会社ディスコ テープ剥離装置
CN104960957B (zh) * 2015-05-22 2017-07-28 泉州市汉威机械制造有限公司 一种线外放卷装置
JP6654831B2 (ja) * 2015-08-31 2020-02-26 リンテック株式会社 シート剥離装置および剥離方法
TWI576978B (zh) * 2016-04-12 2017-04-01 頎邦科技股份有限公司 用以切割可撓性基板及撕除保護膠帶的機台及其方法
TWI616343B (zh) * 2016-08-10 2018-03-01 Jhen Tou Technology Co Ltd 自動晶圓保護層去除設備
CN108336413A (zh) * 2017-04-01 2018-07-27 深圳市新嘉拓自动化技术有限公司 紧凑型收放胶带的贴胶装置
JP6963483B2 (ja) * 2017-12-08 2021-11-10 株式会社ディスコ 剥離用テープカッター
KR102541179B1 (ko) * 2018-04-24 2023-06-12 디스코 하이테크 유럽 게엠베하 반도체 웨이퍼의 보호 테이프 부착장치 및 부착방법
JP7165572B2 (ja) * 2018-12-07 2022-11-04 リンテック株式会社 シート剥離装置およびシート剥離方法
JP7319889B2 (ja) * 2019-10-21 2023-08-02 株式会社東京精密 シート剥離装置
JP7454434B2 (ja) * 2020-04-14 2024-03-22 リンテック株式会社 シート剥離装置およびシート剥離方法
CN112269302B (zh) * 2020-09-16 2023-05-30 上海光起电子设备有限公司 曝光机除尘装置
KR102663485B1 (ko) * 2021-11-16 2024-05-03 세메스 주식회사 필름 박리 장치, 및 이를 포함하는 디라미네이션 모듈 및 반도체 제조 설비
CN114906660B (zh) * 2022-05-06 2023-09-05 安徽省唯一纺织有限公司 一种魔术贴自动粘贴设备
CN116620933A (zh) * 2023-04-07 2023-08-22 广东科达智能装备有限公司 一种胶带切断留助剥头机构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749796Y2 (ja) * 1989-11-07 1995-11-13 松下電子工業株式会社 ウエハの保護シート剥がし装置
JP4204658B2 (ja) * 1997-11-28 2009-01-07 リンテック株式会社 シート剥離装置および方法
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
US6715524B2 (en) * 2002-06-07 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd. DFR laminating and film removing system
JP4057478B2 (ja) * 2003-06-26 2008-03-05 リンテック株式会社 シート剥離装置及び剥離方法
JP4803751B2 (ja) * 2007-08-09 2011-10-26 株式会社タカトリ ウエハの保護テープ剥離装置

Also Published As

Publication number Publication date
CN101969018A (zh) 2011-02-09
TW201104739A (en) 2011-02-01
JP2011023612A (ja) 2011-02-03
CN101969018B (zh) 2015-05-20
TWI466185B (zh) 2014-12-21

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