CN101969018B - 保护胶带的剥离装置 - Google Patents
保护胶带的剥离装置 Download PDFInfo
- Publication number
- CN101969018B CN101969018B CN201010230381.4A CN201010230381A CN101969018B CN 101969018 B CN101969018 B CN 101969018B CN 201010230381 A CN201010230381 A CN 201010230381A CN 101969018 B CN101969018 B CN 101969018B
- Authority
- CN
- China
- Prior art keywords
- stripping
- protective tapes
- tape
- stripping tape
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 56
- 238000005520 cutting process Methods 0.000 claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 173
- 238000004804 winding Methods 0.000 claims description 31
- 230000009471 action Effects 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 13
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 44
- 238000001179 sorption measurement Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-168256 | 2009-07-16 | ||
| JP2009168256A JP5317280B2 (ja) | 2009-07-16 | 2009-07-16 | 保護テープの剥離装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101969018A CN101969018A (zh) | 2011-02-09 |
| CN101969018B true CN101969018B (zh) | 2015-05-20 |
Family
ID=43548155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010230381.4A Expired - Fee Related CN101969018B (zh) | 2009-07-16 | 2010-07-15 | 保护胶带的剥离装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5317280B2 (enExample) |
| CN (1) | CN101969018B (enExample) |
| TW (1) | TWI466185B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5981229B2 (ja) * | 2012-06-01 | 2016-08-31 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| JP6247075B2 (ja) * | 2013-10-30 | 2017-12-13 | 日東電工株式会社 | 保護テープ剥離方法および保護テープ剥離装置 |
| JP6325323B2 (ja) * | 2014-04-14 | 2018-05-16 | 株式会社ディスコ | テープ剥離装置 |
| CN104960957B (zh) * | 2015-05-22 | 2017-07-28 | 泉州市汉威机械制造有限公司 | 一种线外放卷装置 |
| JP6654831B2 (ja) * | 2015-08-31 | 2020-02-26 | リンテック株式会社 | シート剥離装置および剥離方法 |
| TWI576978B (zh) * | 2016-04-12 | 2017-04-01 | 頎邦科技股份有限公司 | 用以切割可撓性基板及撕除保護膠帶的機台及其方法 |
| TWI616343B (zh) * | 2016-08-10 | 2018-03-01 | Jhen Tou Technology Co Ltd | 自動晶圓保護層去除設備 |
| CN108336413A (zh) * | 2017-04-01 | 2018-07-27 | 深圳市新嘉拓自动化技术有限公司 | 紧凑型收放胶带的贴胶装置 |
| JP6963483B2 (ja) * | 2017-12-08 | 2021-11-10 | 株式会社ディスコ | 剥離用テープカッター |
| KR102541179B1 (ko) * | 2018-04-24 | 2023-06-12 | 디스코 하이테크 유럽 게엠베하 | 반도체 웨이퍼의 보호 테이프 부착장치 및 부착방법 |
| JP7165572B2 (ja) * | 2018-12-07 | 2022-11-04 | リンテック株式会社 | シート剥離装置およびシート剥離方法 |
| JP7319889B2 (ja) * | 2019-10-21 | 2023-08-02 | 株式会社東京精密 | シート剥離装置 |
| JP7454434B2 (ja) * | 2020-04-14 | 2024-03-22 | リンテック株式会社 | シート剥離装置およびシート剥離方法 |
| CN112269302B (zh) * | 2020-09-16 | 2023-05-30 | 上海光起电子设备有限公司 | 曝光机除尘装置 |
| KR102663485B1 (ko) * | 2021-11-16 | 2024-05-03 | 세메스 주식회사 | 필름 박리 장치, 및 이를 포함하는 디라미네이션 모듈 및 반도체 제조 설비 |
| CN114906660B (zh) * | 2022-05-06 | 2023-09-05 | 安徽省唯一纺织有限公司 | 一种魔术贴自动粘贴设备 |
| CN116620933A (zh) * | 2023-04-07 | 2023-08-22 | 广东科达智能装备有限公司 | 一种胶带切断留助剥头机构 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203181A (zh) * | 1997-06-20 | 1998-12-30 | 琳得科株式会社 | 移去薄片的设备和方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0749796Y2 (ja) * | 1989-11-07 | 1995-11-13 | 松下電子工業株式会社 | ウエハの保護シート剥がし装置 |
| JP4204658B2 (ja) * | 1997-11-28 | 2009-01-07 | リンテック株式会社 | シート剥離装置および方法 |
| US6715524B2 (en) * | 2002-06-07 | 2004-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | DFR laminating and film removing system |
| JP4057478B2 (ja) * | 2003-06-26 | 2008-03-05 | リンテック株式会社 | シート剥離装置及び剥離方法 |
| JP4803751B2 (ja) * | 2007-08-09 | 2011-10-26 | 株式会社タカトリ | ウエハの保護テープ剥離装置 |
-
2009
- 2009-07-16 JP JP2009168256A patent/JP5317280B2/ja active Active
-
2010
- 2010-07-15 CN CN201010230381.4A patent/CN101969018B/zh not_active Expired - Fee Related
- 2010-07-16 TW TW099123482A patent/TWI466185B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1203181A (zh) * | 1997-06-20 | 1998-12-30 | 琳得科株式会社 | 移去薄片的设备和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5317280B2 (ja) | 2013-10-16 |
| CN101969018A (zh) | 2011-02-09 |
| TW201104739A (en) | 2011-02-01 |
| JP2011023612A (ja) | 2011-02-03 |
| TWI466185B (zh) | 2014-12-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20210715 |