201104739 joiaipif 六、發明說明： 【發明所屬之技術領域】 帶 離 而 本毛明A有關於一種剝離基板上貼附的保護膠 的裝置。更詳細而言，本發明涉及-種使用剝 膝▼來剝離為了保護半導體晶圓（wafer)等基板的表面 貼附的保護膠帶的保護膠帶的剝離裝置。 【先前技術】 "先前以來，在半導體的製造工序中，有下述工序：在 從晶錠（ingot)切出的半導體晶圓（以下簡稱作晶圓)· 表面形成電路圖案（pattern)之後，對晶圓的背面進行 磨、’以使所述晶圓達到規定厚度，由此來對晶圓進行薄化。 在進行s亥晶圓背面的研磨時，會貼附用於保護晶圓表面 保濩膠帶，以避免劃傷晶圓表面形成的電路圖案或者磨 液浸入而污染電路圖案。 1 研磨了晶圓的背面之後，在將晶圓沿著電路圖案而芯 片（chip)化之前，將該保護膠帶從晶圓表面予以^離: 再將該剝離後的晶圓提供給切晶（dicing)工序以進^三 在上述保護膠帶的剝離時，一般已知有兩種方法方 法之一是：將晶圓以該保護膠帶面成為上表面的方式而保 持於剝離臺上，抽出輥狀的剝離谬帶並供給到所述保護^ 帶面上，一邊利用貼附輥來按壓該剝離膠帶一面將其貼附 到保護膠帶上，再與剝離膠帶一體地捲繞該保護膠帶（例 如專利文獻1)。因而，剝離膠帶至少需要保護膠帶的直 201104739 8 : Γ存護膠帶的使用量浪費較多的問 麵左右“離膠圓剥離保護膠帶時，需要230 表面的方式:保臺:晶保，:面成為上 給至該保護谬帶面上，一邊由^具有一端的剝離膠帶供 邊口刹用u 邊由剝離頭部來保持該一端，一 同:字切斷二：的接離動作來貼附所述剝離膠帶的後侧， 膠帶的貼附在保護谬帶上的後側而使剝 帶的一端為1狀之後’拉扯由剝離頭部所保持的剝離膠 Τ的埏，以剝離該保護膠帶（例如專利文獻2)。 •然而’在所述專利文獻2的方法巾，為了剝離 了所使用的剝離膠帶只貼附在保護膠帶的—部分上、，因 在，雖然剝離膠帶的使用量較少即可，但必 的帶 =地廢棄到廢棄部中，從而存在剝離單元 造成大容雜，並且廢棄的保護膠帶體積變大而 構件成短片狀的剝離膠帶的―端貼附到板狀 部）上表:二圓，以後稱作晶圓）的前端側（捲繞前端 sheet)(相#於保護膠帶， 隻夕咿）上，並且將短片狀的剝離膠帶以—部 後幽區域的狀態貼附到晶圓的後端側(捲繞 剥離膠f面的保護膠帶上’拉扯所述晶圓的前端側的 後後端側來剝離該保護膠帶，並將晶圓 ^旬的剝離膠帶的非钻結區域貼附到成為下個剝離對象 201104739 JJlOipif 的晶圓前端側，從而-邊依次經由短片狀的剝 離膠f來連結保護膠帶，一邊連續地剝離保護膠帶（例如 專利文獻3)。通過這種方式，無須逐片廢棄而能夠連續 地捲繞保護膠帶並廢棄，從*提高了作業效率。 先前技術文獻 專利文獻 [專利文獻1]曰本專利實開平3—67442號公報 [專利文獻2[日本專利第4204653號公報 [專利文獻3]曰本專利第4057478號公報 但上述專利文獻3的裝置在剝離晶圓上所貼附的 保護膠帶之前’需要將麟膠帶切斷成短>{狀，並保持成 為該短片狀的剝離膠帶（以後’將成為短片狀的剝離膠帶 稱作連結科）而貼賴保護膠帶上，從而需要用於將從 輥狀的剝離膠帶切出的連轉帶移送至貼_部的橫向移 動和上下移動、以及用於貼附連結膠帶的與所述上下移動 不同的上下移動，因而存在貼附頭部的動作複雜化的問題。 而且，必須分別獨立地設置製作連結膠帶的切斷機構 和保持連結膠帶並將其貼附到保護膠帶的貼附頭部以及一 邊保持連結料-邊進㈣離的獅機構部，從而 置複雜化或大型化的問題》 〜 進而’上述專利文獻3的裝置巾，獅並捲繞保護膠 帶的捲繞捲盤（reel)側與供給剝離膠帶的供給捲盤側： 完全獨立的，初概定時分別需要將引導〇ead)膠= 设至捲繞捲盤侧的作業和將剝離膠帶掛設至供給侧以製作 201104739 連結膠帶的作# (並非使们根連續的剝離膠帶，而需要 分成捲繞側的引導膠帶與供給側的剝離用連結膠帶這兩部 分的膠帶），從而存在初始設定變得複雜的問題。亦即， 上述剝離裝置在貼附之前需要先切出連結膠帶再貼附到保 Λ膠帶上，因此存在設定初始狀態的作業變得非常煩雜的 問題。 進而，當開始保護膠帶的剝離時，如果連結膠帶對保 濩膠帶的粘結不夠充分而發生剝離失敗（miss)，則為了 使裝置恢復初始狀態，必須將引導膠帶掛設至剝離機構部 的吸附格（grid)為止之後，使所述引導膠帶保持於吸附 格的下表面並在吸附格的前端予以切斷，隨後，將所述引 導膠帶改掛到貼關侧，如果在剝射發生因連結膠帶的 粘結不足導致的剝離失敗，則存在恢復非常困難，恢復作 業也需要時間的問題。 而且，當將上述專利文獻3的裝置用於晶圓上貼附的 保護膠帶的剝離時，在將連結膠帶貼附于保護膠帶時，須 將由貼明部的下表面所吸賴持的連結料按壓貼附於 晶圓上的保護膠帶’因此，如果按壓力較弱，則存在連結 膠，會脫，保護膠帶’從而會發生剝離失敗的問題。進而， 保，谬帶是為了在晶圓的背面研料保護電路圖案而貼附 在晶圓上的，該背面研磨時的污垢等有時會殘存於保護膠 帶面上’目絲純姻漏力來進行職，則存在會因 污垢造成_結強度不足，而導致發生剝離失敗。 而且，上述專利文獻2的裝置，僅通過加熱器的接離201104739 joiaipif VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a device for peeling off a protective adhesive attached to a substrate. More specifically, the present invention relates to a peeling device for peeling off a protective tape for protecting a surface of a substrate such as a semiconductor wafer by using a peeling shoe. [Prior Art] In the semiconductor manufacturing process, there has been a process of forming a circuit pattern on a semiconductor wafer (hereinafter referred to simply as a wafer) cut from an ingot. The wafer is polished on the back side of the wafer to reduce the thickness of the wafer by a predetermined thickness. When the back surface of the wafer is polished, a protective tape for protecting the surface of the wafer is attached to prevent scratching of the circuit pattern formed on the surface of the wafer or the infiltration of the grinding liquid to contaminate the circuit pattern. 1 After the back side of the wafer is polished, the protective tape is removed from the surface of the wafer before the wafer is chipped along the circuit pattern: the stripped wafer is then supplied to the crystal ( In the dicing process, in the case of peeling off the protective tape, one of two methods is generally known: the wafer is held on the peeling table so that the surface of the protective tape becomes the upper surface, and the roll is taken out. The peeling tape is supplied to the protective tape surface, and the adhesive tape is attached to the protective tape while being pressed by the attaching roller, and the protective tape is wound integrally with the release tape (for example, patent document) 1). Therefore, the stripping tape needs at least the straight line of the protective tape. 201104739 8 : The amount of the protective tape used is a lot of waste. The way to remove the protective tape from the strip is 230. The way to protect the surface is: Baotai: Jingbao,: Surface When it is applied to the surface of the protective tape, the peeling tape having one end is provided with a peeling tape at one end, and the end is held by the peeling head, and the end is removed by the peeling head: The back side of the release tape is attached to the back side of the protective tape to make the end of the peeling strip 1 shape, and then the pull of the peeling tape held by the peeling head is pulled to peel off the protective tape ( For example, Patent Document 2). However, the method towel of Patent Document 2 is attached to the portion of the protective tape in order to peel off the peeling tape used, because the use amount of the peeling tape is small. However, the necessary tape is discarded into the waste portion, and the peeling unit causes a large amount of impurities, and the discarded protective tape becomes large in size, and the end of the peeling tape which is formed into a short piece is attached to the plate portion. Above table: two circles, to The front side of the wafer (the front end of the wafer) is placed on the front end of the wafer. The side (the protective tape on the side of the front side of the wafer) is pulled on the side of the protective tape on the front side of the wafer to peel off the protective tape, and the non-drilled area of the peeling tape of the wafer is attached to the side. On the wafer front end side of the next peeling target 201104739 JJlOipif, the protective tape is continuously bonded via the short-shaped release adhesive f, and the protective tape is continuously peeled off (for example, Patent Document 3). In addition, it is possible to continuously wind the protective tape and discard it, and the work efficiency is improved from *. The prior art document patent document [Patent Document 1] Japanese Patent Publication No. Hei 3-67442 [Patent Document 2 [Japanese Patent No. 4204465] Patent Document 3] Japanese Patent No. 4,057, 478. However, the apparatus of the above-mentioned Patent Document 3 needs to cut the ligament tape into a short shape before peeling off the protective tape attached to the wafer, and keeps it as the short film. The peeling tape (hereinafter referred to as a short-shaped peeling tape called a joint) is attached to the protective tape, and it is required to transfer the continuous belt cut out from the roll-shaped peeling tape to the lateral movement of the sticker. There is a problem in that the movement of attaching the head is complicated, and the movement of attaching the head is complicated, and the cutting mechanism for making the connecting tape is separately provided. Keeping the connecting tape and attaching it to the attaching head of the protective tape and the lion mechanism that keeps the connecting material-side (4) apart, thereby complication or enlargement. ～ Further, the device of the above Patent Document 3 The reel side of the towel, the lion and the wound protective tape, and the supply reel side of the supply release tape: completely independent, the initial timing needs to be guided to the winding reel side. The work and the peeling tape are hung to the supply side to make the joint of the 201104739 joint tape. (It is not a continuous peeling tape, but it needs to be divided into the guide tape on the winding side and the supply side. When the tapes of the two parts of the connecting tape are peeled off, there is a problem that the initial setting becomes complicated. That is, the peeling device needs to cut the connecting tape before attaching it to the protective tape before attaching, so that the work of setting the initial state becomes very complicated. Further, when the peeling of the protective tape is started, if the bonding tape is insufficiently bonded to the protective tape and a peeling failure occurs, in order to restore the device to the initial state, the guiding tape must be attached to the peeling mechanism portion. After the grid, the guiding tape is held on the lower surface of the adsorption grid and cut at the front end of the adsorption grid, and then the guiding tape is re-attached to the sealing side, if the peeling occurs due to the connection If the peeling failure due to insufficient bonding of the tape is difficult, recovery is very difficult, and recovery work takes time. Further, when the apparatus of the above-described Patent Document 3 is used for peeling off the protective tape attached to the wafer, when the connecting tape is attached to the protective tape, the binder to be held by the lower surface of the exposed portion is required. The protective tape attached to the wafer is pressed. Therefore, if the pressing force is weak, there is a problem that the adhesive is removed and the tape is protected, and peeling failure occurs. Further, the tape is attached to the wafer in order to protect the circuit pattern on the back surface of the wafer, and the dirt or the like during the back surface polishing may remain on the surface of the protective tape. If you come to work, there will be insufficient strength due to dirt, resulting in peeling failure. Moreover, the device of the above Patent Document 2 is only separated by a heater.
201104739 A KJ 動作來將切Wf成短片狀的剝離谬帶（相當於粘結膠帶）貼 附到保護膠帶上，並拉扯該剝離膠帶而使其剝離，因此， 如果粘結不夠充分，則存在會頻繁發生剝離失敗的問題。 尤其當適用於上述晶圓時，對於僅利用加熱器的接離動作 來進行的貼附而言，由於保護膠帶與粘結膠帶的粘結面積 較少’因此，如果像上述那樣背面研磨時的保護膠帶的污 垢部分與，傾部重疊，射存在_強度从而發生剝離 失敗的問題。 【發明内容】 因此’本發明的目的在於提供—種簡化剝離膠帶的供 給機構，削減剝離膠帶的使用量，從而有益於環境的裝置， ，且提供-種防止剝離失敗的產生，進而，即使發生剝離 失敗’剝離裝置的恢復也可自動進行的提高了作業效率 保護膠帶的剝離裝置。 一因此，第1發明是一種保護膠帶的剝離裝置，一邊用 短片狀_離膠帶來連結著貼附在基板表面的保護膠帶， —邊捲繞所述連結的保護膠帶⑽其_，關離裝置包 括： 亲J離口將貼附有所述保護膠帶的基板以該保護膠帶 :作為上表面而予以保持，並且相對於所述剝離膠帶而相 對地水平移動； 上剝離膠帶供給機構，將輥狀的剝離膠帶供給至所述保 護膠帶上； 膠帶捲繞機構’捲繞連結於所述剝轉帶的保護膠帶； 2011047391. 貼附輥，隔著·_科*在所述倾膠帶上按壓 轉動，由此將剝離膠帶貼賴保護膠帶的外周端部附近； 切刀，在剝離膠帶貼附到所述保護膠帶的剥離前端側 之後，切斷該剝離膠帶的貼附後方側； 、切刀台，位於所述貼附輥的前方，設有供所述切刀行 進的切刀槽，並且吸附保持被所述切刀切斷的剝離膠帶的 後方側；以及 ' 剝離膠帶保持機構，位於所述貼附軺<的後方，在所述 切刀切斷剝離膠帶時吸附保持該剝離膠帶， 一邊利用貼附輥將所述剝離膠帶貼附到保護膠帶的剝 離前端侧’並捲繞所述剝離膠帶，以此從剝離前端側來剝 離保護膠帶’並且利用所述切刀台和剝離膠帶保持機構來 吸附保持剝離膠帶，一邊利用所述切刀來切斷所述剝離膠 帶的貼附後方側，再通過膠帶捲繞機構來捲繞貼附有剝離 膠帶的保護膠帶，由此來剝離保護膠帶’接著，利用貼附 輥將由剝離膠帶保持機構吸附保持的剝離膠帶的前端部貼 附到所述保護膠帶的剝離後端側，從而一邊利用剝離膠帶 來依次連結保護膠帶一邊將其剝離。 而且，第2發明是根據第1發明的保護膠帶的剝離裝 置，其在所述貼附報的外周的/部分设置加熱器，從而利 用1根貼附輥來進行通過所述貼附輥的轉動所進行的剝離 膠帶對保護膠帶的貼附和利用所述加熱器來進行的剝離膠 帶對保護膠帶的加熱貼附。 而且，第3發明是根據第1發明及第2發明的保護膠 201104739 35181pif 帶的剝離裝置’在所述膠帶捲繞機構與第_剝離膠帶保持 機構之間設置偵測機構，以偵測有無被剝離的保護膠帶。 另外，對於偵測機構，優選能夠使用反射型、透射型 光學感測器。 【發明的效果】 如上所述，將輥狀的剝離膠帶貼附到保護膠帶的剝離 前端側之後，切斷剝離膠帶的貼附後方側，接著，將切斷 的保護膠帶的被吸附保持的前端部貼_保護膠帶的剝離 後端侧，一邊利用剝離膠帶來連結保護膠帶一邊將其剝 此能夠提供-種可降低剝離膠帶的使用量，從而有 益於壤境的裝置’並且*會造成廢棄的賴料體積變大。 /而且，先將1根連續的剝離膠帶貼附到保護膠帶上， ，後切斷_在保護膠帶上_轉帶的後端部分因此 只要在初錢㈣將_膠帶從供給健-次性沿著路徑 而t設至捲繞捲盤為止’隨制觸王序便可自動進行， 不萬要預先手動製作短片狀的剝離膠帶因此作 到飛躍提高。 〃 ^ 而且’在貼附輕的外周的—部分内置著加熱器因 =要使用在常溫下具妹合性㈣轉帶便可利用i 輥來進行通過_輥的按壓所進行的_膠帶對保 ^帶的_和利用加熱器在規定位置的加熱壓接所進行 土附㈣種貼附，即使保護膠帶的貼附面有所污染，由 广，過兩魏結方法來進行赌，因此能夠確保枯結強 又d離失敗顯著減少。而且，由於貼附親對晶圓表面的 201104739 =壓面積也^是缝轉的連結部，目此與—邊 ，來，個晶圓一邊進行貼附的情況相比，能夠使貼: 輥對晶圓的按塵為最小限度，從而不會損傷晶圓。' 、 進而，在利用剝離膠帶所進行的保護膠帶的 偵測保護膠帶是否已剝離’因此即使因剝離膠帶對保雜 :的而發生剝離失敗，也是在切斷剝離膠帶形成 為短片狀之月”因此不需要改掛剝離膠帶，只要使 帶的接繞和剝離台等恢復初始狀態，便可復 $ 使裝置自動復原）。 把夠 且二可使剝離勝帶的貼附機構部與切斷機構部一體 地構成，並且可使们根連續的剝離 裝置，能夠實現裝置的小型化和成本叫低·一間化 為讓本發明之上述和其他目的、特 二董下了文特舉較佳實施例，並配合所附圖式:作 【實施方式】 署：至圖4 ’對本發明的保護膠帶剝離裝 置的一實施方式進行說明。 J: 本發明的保護膠帶晴置的-部分切開的 M A 1 分被局部誇張描述。而且，圖2是從圖1 的箭頭平面圖，圖3是從圖1的B-B方向 觀察的前頊側面圖。 上，所广在保護膠帶剝離裝置1的基座6 王在該基座6上，與機框7平行地鋪設 12 201104739 著兩條軌道（rail) 8、8。在所述兩軌道8、8上，可滑動 地後合著狀（shder) 9、9，在所述滑塊9、9上，可藉 由未圖示的適當_動源而沿軌道9、9水平移動地設置著 剝離台10。 戶 =述幻離σ 1G在其上表面設有未圖示的多個吸附 孔這二及附孔與同樣未圖示的適當的真空源連接，以產 生吸附力。而且’將通過適當的機構而定位的晶圓2，利 3 矣以貼附在其表面形成的電路圖案3上的保護 膠帶4為=面，置於_台1Q上，並通過所述吸附孔 而吸附保持者。 在所述剝離台1G的上方城框7的上方爾供給 面具有钻t性的輥狀的剝轉帶5的剝離膠帶供給捲般 ==所述剝離膠帶5而剝離的保護膠帶4的膠 所述剝離膠帶5以其點合面與所述剝離台 多個導輥17而被魏至膠帶捲繞捲盤12。另外 是，爽棍U、16及賴17中，剝離膠帶5 _合面所^ 觸的-側通魏處理等而進行了非枯合處理。面所接 而且，所述夾棍16及多個導觀17的兩側由 18而旋轉自如地支撐著’在贿支撐框18的 呈自由旋轉的方式支縣賴2G，該壓繞2()用 ^ 護膠帶4剝離時，將保護膠帶4向銳角方向翻·^保 另外’較好的是，所述夾棍16、_17、壓輥Μ的長度 13 201104739 35181pif 為保護膠帶4的直徑以上，以捲繞被剝離的保護膠帶4。 而且，所述壓輥20如圖2所示，在機框7側的一部分 設有間隙，後述的保護膠帶偵測感測器（sensor) 40從該 間隙來偵測剝離的保護膠帶4。 而且，兩輥支撐框18在上方被掛設而一體形成，在該 掛没的上方部分’安裝著汽缸（cylinder) 19。 而且，在所述夾棍14、16中，設有未圖示的脈衝馬達 (pulse motor)等的驅動源，以控制膠帶的供給及捲繞量。 而且，在剝離膠帶供給捲盤1丨中，設有未圖示的公知的扭 矩限制器（torque keeper)’以用固定的力來抽出剝離膠 帶5，在膠帶捲繞捲盤12中，設有強制捲繞被剝離的保護 膠帶4的未圖示的適當的馬達。 而且’所述夾棍Μ、16通過汽缸15、19而開閉自如， 通常，在進行剝離動作時，所述夾棍14、16關閉以夾持膠 帶，而在膠帶的更換時或使保護膠帶剝離裝置丨長時間停 止時則打開。借此，防止因剝離膠帶5的粘合面的變形等 造成的粘結力下降。 ，所述剝離台10的上方且機框7的中央附近，以從機 框7犬出至前方的方式而設置著支撐板21，在該支樓板^ 上’攸剝離膠帶5的供給側依次朝下固定著汽缸22、23、 24，該汽缸軸可朝向下方伸縮。 f所述支樓板21的下方，在各個汽缸22、23、24的 m ’安产有吸附保持剝離膠帶5的剝離膠帶保持機 才料貼附親27的輕支樓框34、設有吸附保持剝 201104739 離膠帶5的吸附孔31及切刀槽3〇的切刀台29，通過各個 八缸22 23 24的夂缸轴的伸縮，剝離膠帶保持機構25、 貼附輥27、切刀台29分別升降自如。另外，如圖3所示， 在汽缸24的兩側’可滑動地設有導杆知）42，雖然 但在汽缸22、23的兩側也同樣地，可滑動地設有 所述剝轉帶保持機構25設於貼附報27的後方側（剝 轉帶5的供給側），所侧離膠帶保持機構25的下表面 以沿著剝離膠帶5的傾斜的方式而傾斜地形成，並且多個 膠帶5的行進方向垂直的方向上穿設 者，且，、未圖不的適當的真空源相連接，以從 吸附保持剝離膠帶5。另外，剝離膠帶5的_力σ要β 剥離膠帶5不會職的程度即可，以 下剝離膠帶5也_行進。 絲及附狀態 ，述貼附輥27如圖2所示，兩端旋轉自如地支樓於 = 2述貼附輥27的—端，經由以撐框34而 Ϊ接者附有離合器的馬達35，以能夠控制貼附親2 驅而動旋轉的切換。另外，也可以取代附有離合号 如圖4所示’所述貼附輥27在其外周面的一、, 方向設有槽，在該槽的中央附近，埋設有 的—部分進行加熱的加熱器（heateO 28。而且，在二帶5 附觀27的槽以外的外周部分’適當捲繞著橡膠（_=201104739 A KJ operates to attach a peeling tape (corresponding to an adhesive tape) that cuts Wf into a short piece to the protective tape, and pulls the peeling tape to peel it off. Therefore, if the bonding is insufficient, there is a possibility Frequent peeling failures occur frequently. In particular, when it is applied to the above-described wafer, the adhesion of the protective tape to the adhesive tape is small for the attachment by the lift-off operation of the heater only. Therefore, if the back surface is polished as described above, The dirt portion of the protective tape overlaps with the inclined portion, and there is a problem that the peeling failure occurs due to the presence of _ strength. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a device for simplifying the supply mechanism of a release tape, reducing the amount of use of the release tape, thereby benefiting the environment, and providing a prevention of peeling failure, and further, even if Peeling failure 'Recovery of the peeling device can also be automatically performed to improve the work efficiency of the protective tape peeling device. Therefore, the first invention is a peeling device for a protective tape, and the protective tape (10) attached to the surface of the substrate is joined by a short sheet-like tape, and the joined protective tape (10) is wound around the device. The method includes: the pro-J exiting the substrate to which the protective tape is attached, the protective tape: being held as an upper surface, and relatively horizontally moving relative to the peeling tape; the upper peeling tape supply mechanism, which is in the form of a roll a peeling tape is supplied onto the protective tape; a tape winding mechanism 'winds the protective tape attached to the peeling tape; 2011047391. Attaching a roller, pressing the tilting tape on the tilting tape Thereby, the peeling tape is attached to the vicinity of the outer peripheral end portion of the protective tape; the cutter is attached to the peeling front end side of the protective tape after the peeling tape is attached, and the attached back side of the peeling tape is cut off; Located in front of the attaching roller, provided with a cutter groove for the cutter to travel, and adsorbing and holding the rear side of the peeling tape cut by the cutter; and 'peeling tape holding mechanism, located The back side of the attached 轺<, the peeling tape is adsorbed and held when the cutter cuts the peeling tape, and the peeling tape is attached to the peeling front end side of the protective tape by the attaching roller' and is wound up The release tape is used to peel off the protective tape from the peeling front end side, and the peeling tape is sucked and held by the cutter table and the peeling tape holding mechanism, and the peeling tape is cut off by the cutter. On the side, the protective tape attached with the release tape is wound by the tape winding mechanism, thereby peeling off the protective tape. Then, the front end portion of the release tape that is suction-held by the release tape holding mechanism is attached to the same by the attaching roller. The protective tape is peeled off at the rear end side, and the protective tape is peeled off by sequentially connecting the protective tape with a release tape. According to a second aspect of the invention, there is provided a peeling device for a protective tape according to the first aspect of the present invention, wherein a heater is provided on an outer circumference/portion of the attaching post, and rotation of the attaching roller is performed by one attaching roller. The adhesion of the peeling tape to the protective tape and the peeling tape by the heater are attached to the heat of the protective tape. Further, according to the third aspect of the invention, the peeling device of the protective tape 201104739 35181pif tape of the first invention and the second invention is provided with a detecting mechanism between the tape winding mechanism and the _ peeling tape holding mechanism to detect the presence or absence of Peel off the protective tape. Further, for the detecting mechanism, it is preferable to use a reflective type or a transmissive type optical sensor. [Effects of the Invention] As described above, after the roll-shaped release tape is attached to the peeling end side of the protective tape, the adhesive tape is cut off the rear side of the release tape, and then the front end of the cut protective tape is adsorbed and held. The detachment of the protective tape is removed from the rear end side of the protective tape, and the protective tape can be peeled off by a peeling tape to provide a means for reducing the amount of the peeling tape, thereby benefiting the soiled device and causing waste. The size of the material becomes larger. / Moreover, first attach a continuous strip of tape to the protective tape, and then cut off the _ on the protective tape _ the back end of the belt, so as long as the initial money (four) will be _ tape from the supply of health - The path is set until t is set to the winding reel. 'With the system, the order can be automatically performed. It is not necessary to manually make a short piece of peeling tape in advance, so that the leap is improved. 〃 ^ and 'in the light-attached outer part of the part-built heaters = to use at room temperature (4) the transfer belt can use the i-roller to carry out the _-roller press ^With the _ and the use of the heater at the specified position of the heating and crimping of the soil attached (four) type of attachment, even if the protective tape is attached to the contaminated surface, the wide and over two Wei method to gamble, so can ensure The knot is strong and the d is significantly reduced from failure. Moreover, since the connection surface of the wafer surface 201104739 = the pressure area is also a seam, the wafer can be attached to the wafer side as compared with the case where the wafer is attached. The dust of the wafer is minimized so as not to damage the wafer. In addition, the protective tape of the protective tape by the peeling tape is peeled off. Therefore, even if the peeling failure occurs due to the release tape, the peeling tape is formed into a short film shape. Therefore, it is not necessary to change the peeling tape, as long as the belt winding and the peeling table are restored to the initial state, the device can be automatically restored.) The attaching mechanism and the cutting mechanism that can be used to peel off the strap The unit is integrally formed, and the continuous stripping device can be realized, and the miniaturization of the device and the cost can be reduced. The above and other objects of the present invention and the special purpose of the present invention are specifically implemented. For example, an embodiment of the protective tape peeling device of the present invention will be described with reference to the accompanying drawings: [FIG. 4] J: The protective tape of the present invention is partially-partially cut MA 1 The subsection is partially exaggerated, and Fig. 2 is a plan view of the arrow from Fig. 1, and Fig. 3 is a front side view of Fig. 1 as viewed from the direction of BB of Fig. 1. The susceptor 6 of the protective tape peeling device 1 is widely used. On the pedestal 6, 12 201104739 two rails 8 and 8 are laid in parallel with the frame 7. On the two rails 8, 8, slidably rearward (shder) 9, 9 On the sliders 9, 9, the peeling table 10 can be horizontally moved along the rails 9, 9 by an appropriate source (not shown). The user = illusion σ 1G is provided on the upper surface thereof. The plurality of adsorption holes (not shown) and the attachment holes are connected to a suitable vacuum source (not shown) to generate an adsorption force. Moreover, the wafer 2 positioned by an appropriate mechanism is attached to the wafer 2 for attachment. The protective tape 4 on the circuit pattern 3 formed on the surface thereof is a surface, placed on the table 1Q, and adsorbs the holder through the adsorption holes. The upper side of the upper frame 7 of the peeling table 1G is supplied. The release tape of the roll-shaped peeling tape 5 having a t-shaped surface is supplied with a roll-like tape = the tape of the protective tape 4 peeled off by the release tape 5, and the release tape 5 has a plurality of contact faces and the peeling station The guide roller 17 is wound up to the reel 12 by the Wei to the tape. In addition, in the cool sticks U, 16 and Lai 17, the peeling tape 5 _ the joint surface is touched by the side In addition, the non-drying process is carried out, and the two sides of the pinch 16 and the plurality of guides 17 are rotatably supported by the 18 in a freely rotatable manner. When the crimping 2 () is peeled off by the protective tape 4, the protective tape 4 is turned in an acute direction. Further, it is preferable that the length of the pin 16, 16, 17 and the press roller is 13 201104739 35181pif for protection. The protective tape 4 is wound around the diameter of the tape 4, and the pressure roller 20 is wound around the frame 7 side as shown in Fig. 2, and a protective tape detecting sensor (hereinafter referred to as a protective tape) is provided. Sensor) 40 detects the peeled protective tape 4 from the gap. Further, the two-roller support frame 18 is integrally formed by being hung above, and a cylinder 19 is attached to the suspended upper portion ‘. Further, a drive source such as a pulse motor (not shown) is provided in the nippers 14, 16 to control the supply and winding amount of the tape. Further, a known torque limiter (not shown) is provided in the peeling tape supply reel 1 to extract the release tape 5 with a fixed force, and the tape winding reel 12 is provided. An appropriate motor (not shown) of the peeled protective tape 4 is forcibly wound. Further, the clips 16 are opened and closed by the cylinders 15, 19, and generally, when the peeling operation is performed, the clips 14, 16 are closed to hold the tape, and when the tape is replaced or the protective tape is peeled off. Turns on when it is stopped for a long time. Thereby, the adhesive strength due to deformation of the adhesive face of the release tape 5 or the like is prevented from being lowered. The support plate 21 is disposed above the center of the peeling table 10 and near the center of the frame 7, so that the supply side of the detachable tape 5 is sequentially turned toward the front side of the frame 7 The cylinders 22, 23, 24 are fixed downward, and the cylinder shaft can be expanded and contracted downward. f below the support floor 21, in the m' of each of the cylinders 22, 23, 24, the peeling tape retaining machine that adsorbs and holds the peeling tape 5 is attached to the light-weight frame 34 of the pro-27, and is provided with adsorption holding Stripping 201104739 from the suction hole 31 of the tape 5 and the cutter table 29 of the cutter groove 3, by the expansion and contraction of the cylinder shaft of each of the eight cylinders 22 23 24, the peeling tape holding mechanism 25, the attaching roller 27, and the cutter table 29 Lifting freely. Further, as shown in Fig. 3, the guide rods 42 are slidably provided on both sides of the cylinder 24, but the stripping belts are slidably provided on both sides of the cylinders 22 and 23. The holding mechanism 25 is provided on the rear side of the attachment sheet 27 (supply side of the peeling belt 5), and the side surface of the tape holding mechanism 25 is formed obliquely along the inclination of the peeling tape 5, and a plurality of tapes are provided. The direction of travel of the fifth direction is perpendicular to the direction of the wearer, and an appropriate vacuum source, not shown, is connected to hold the release tape 5 from the suction. Further, the _ force σ of the release tape 5 may be such a degree that the release tape 5 does not work, and the lower release tape 5 also travels. In the state of the wire and the attached state, as shown in FIG. 2, the both ends of the attaching roller 27 are rotatably attached to the end of the attaching roller 27, and the motor 35 with the clutch attached to the bracket 34 is attached. It is possible to control the switching of the attached rotation. In addition, instead of the clutch number shown in FIG. 4, the attaching roller 27 may be provided with a groove in one of its outer peripheral faces, and a portion of the groove may be embedded in the vicinity of the center of the groove. (heateO 28. Moreover, the outer peripheral portion of the groove of the second belt 5 with the attachment 27 is appropriately wound with rubber (_=
15 201104739 35l81pif 也不會受到損 或樹脂等，以使得即使按壓晶圓2，晶圓 傷。 上述加熱器28的寬度或長度較好的 減晶圓2的電路圖案3面的方式疋曰圓成為不會 電路圖案3的外周部分的2〜3 mm左曰日圓2的未設有 ^外’所述貼_27在進行貼附動作時， 的馬達35的離合器的卡合得到脫離而呈 = 壓力帶來的轉動下旋轉。而且，當 w按 伯μ、+、·Λ舳口。1。 田便貼附輥27驅動旋轉以 = ,位於保護膠帶4的外周端時，利用未圖示 的感心來偵測加熱器28的位置，再使附有離合器 =馬達35的離合器卡合而使貼附輥27驅動旋轉，以使加 熱器28位於規定位置。 而且，所述切刀台29設於貼_27的前方侧（剝離 ^帶5的捲繞侧）’在所述切刀台29的下表面在剝離膠 帶5的捲繞侧（前方侧），以鋪轉帶5的行進方向成 垂直的方式而設有切刀槽3G，在剝轉帶5的供給側（後 方側），同樣以與剝離膠帶5的行進方向成垂直的方式而 穿設有多個吸附孔31。 在所述切刀台29的下方且機框7側，以與切刀槽30 對應的方式设有圓刀的切刀32，該切刀32以呈自由旋轉 的方式而支撐在切刀支撐框33的前端。而且，所述切刀支 撐框33的後鳊插通機框7上所設的機框開口部36並設有 滑塊38。而且’在所述機框開口部％内，沿與機框7垂 直的方向而固疋有無杆（r〇diess)汽缸37，所述滑塊38 201104739 被連接於該無杆汽缸37的導執39， ::3沿著導轨39而相對於機框7而在前後方 37:利 刀槽30而從實線像兩點鏈線那樣移刀〇 29 又的切 32-邊利用切斷阻力而旋轉，-邊在寬5向:= :台二的吸，31所吸附保持的制離膠帶5。另外，： 刀，但並不限定於此，也可以利㈣當的t刀 Θ機所述壓輥2〇的後方’在沿著所述壓輥20而 置的感測器支樓框41的前端，設有通過適 貞測有無被剝離的保護膠帶4的保護膠帶 3 ί ^ 4 0 °如圖2所示’所述保護膠㈣測感測器4 〇 從壓親2G的裏側所設的間隙沿箭頭方向來照射光，對在剝 離保護膠帶4時由壓輥20抱入而捲起的保護膠帶4的保護 ，帶偵測部46 (參照圖8)進行债測’以確認保護膠帶4 疋否粘結於剝離膠帶5。另外，保護膠帶偵測部46僅表示 了一例，只要在剝離膠帶5及保護膠帶4的捲繞時能夠偵 測到保護膠帶4即可。 通過設置上述保護膠帶偵測感測器4〇,當在將剝離膠 帶5钻結於保護膠帶4時發生粘結失敗而保護膠帶4未被 制離時，能夠使保護膠帶剝離裝置i自動恢復到初始狀 態’以再次進行將剝離膠帶5粘結於保護膠帶4的動作。 201104739 35l81pif 祀二3發明的保護膠帶剝離裝置1的結構，繼而， =據圖5⑷〜圖5 (e)至圖6 (g)〜圖6⑴，對 離裝置1的保護膠帶4的剝離動作進行 5 另外’為了便於理解’使保鄉帶4朗離膠帶s 具備厚於實際的厚度來進行描述。 '夕 1來線位置表示利用保護膠帶剝離農置 1”蔓膠帶4時的初始位置，貼附輥 的作用下從該初始位置下_實線位置 23 :壓並貼附到保護膠帶4的剝離前端部的：〗= …ί日ί’利用未圖示的適當的感測器來檢測該貼附輥27 置’並驅_有離合11的馬達35，以使 a的;;署附輥27的下端向逆時針方向偏離角度 豚帶么 用貼附輥27將剝離膠帶5按壓至保護 斷财離合糾馬達35雜合器，以使貼 過戶的力且此時以不會對剝離膠帶5施加 膠帶二圖^ (bJ所示，一邊利用貼附輥27將剝離 :，加数\呆:蒦f帶4 ’ 一邊使剝離台1〇後退移動，由 201104739 —繼而’如圖5 (c)所示，首先，使貼附輕27退開， 接者使剝離台10前進移動，並且供給剝離膠帶5，由此， 通過壓親20來按壓剝離膠帶5，以使剝離膠帶5成銳角翻 折。 册繼而，如圖6 (d)所示’使夾棍14停止供給剝離膠 ▼ 5 ’並使剝離台10進_步前進，由此，通過失棍π的 驅動及膠帶捲繞謎U的轉來捲_護膠帶*與剝離膠 帶5的點結部’從而一邊利用壓輕2 〇綠保護膠帶4成銳 角翻折一邊將其剝離。 而且’當伴隨保護膠帶4及剝離膠帶5的捲繞，貼附 輥27的後方侧的剝離膠帶5接觸剝離膠帶保持機構25的 :=,:夸令使抽吸力作用于吸附孔26’通過剝離膠帶保持 “吸附保持位於貼_ 27的後方側的剝離膠帶 5。另外，剝離膠帶5是否接觸剝離膠帶保持機構％的下 ί ^ 適當的感測器來侧剝離膠帶保持機構25 的面度交化或剝離膠帶5造成的壓力阻力的變化等即可。 μ ’伴隨剝離膠帶5的捲繞，使切刀台29在汽缸 24的作用下而下降，使抽吸力作用于 持位於貼附輥27的前方彳目,丨沾剌雜皦册c 而及咐保 有離合器的馬達35驅:：:轉▼ 5 ’貼附輥27使附 mm 27 66動而鉍轉，以使加熱器28位於從貼 、Α、下方朝順時針方向旋轉角度b後的位置。另外， 可以在固定於適當位置的狀態下使用，但有時 也會因與剝離膠帶5的麼檢二、4 Τ 刀台29能夠上下移動的摩擦而&成磨耗，因此較好的是切 201104739 35181pif 而且’伴隨剝離膠帶5的捲繞，保護膠帶4 一邊被壓 輕20抱入-邊被捲繞，此時，通過使保護膠帶债測感測器 40發揮作用，而在保護膠帶4枯結於剝離膠帶5時，利用 保護膠帶4的保護膠帶偵測部46來判斷為鱗 4已點 ，，繼續隨後的剝離工序。此時，未由保護膠純測感測 裔40偵測到保護膠帶4時’視為保護膠帶4與剝離膠帶5 ，钻結而發生了剝離失敗，從輯行_#帶、5的捲繞或 剥離台10的恢復，以使保護膠帶剝離裝置i成為初始狀態。15 201104739 35l81pif will not be damaged or resin, etc., so that even if the wafer 2 is pressed, the wafer is wounded. The width or length of the heater 28 is preferably such that the surface of the circuit pattern 3 of the wafer 2 is reduced, so that the outer circumference of the circuit pattern 3 is not 2 to 3 mm. When the attaching plate 27 is attached, the clutch of the motor 35 is disengaged and rotated under the rotation of the pressure. Moreover, when w is pressed, μ, +, · Λ舳 mouth. 1. The field attaching roller 27 is driven to rotate to = when the outer peripheral end of the protective tape 4 is located, the position of the heater 28 is detected by a sense of heart (not shown), and the clutch with the clutch = motor 35 is engaged and attached. The attachment roller 27 is driven to rotate so that the heater 28 is at a prescribed position. Further, the cutter table 29 is provided on the front side of the bonding plate 27 (the winding side of the peeling tape 5)' on the lower surface of the cutting blade 29 on the winding side (front side) of the release tape 5, The cutter groove 3G is provided so that the traveling direction of the turn belt 5 is perpendicular, and the feed side (rear side) of the peeling belt 5 is also provided to be perpendicular to the traveling direction of the release tape 5 A plurality of adsorption holes 31. On the lower side of the cutter table 29 and on the frame 7 side, a cutter 32 for a circular cutter is provided in a manner corresponding to the cutter groove 30, and the cutter 32 is supported by the cutter support frame in a freely rotatable manner. The front end of 33. Further, the rear frame of the cutter support frame 33 is inserted into the frame opening portion 36 provided in the frame 7 and provided with a slider 38. Further, 'within the frame opening portion %, a cylinder 37 is fixed in a direction perpendicular to the frame 7, and the slider 38 201104739 is connected to the guide of the rodless cylinder 37. 39, ::3 along the guide rail 39 with respect to the frame 7, in the front and rear 37: the sipe 30, and the cut 32-edge from the solid line like the two-point chain line Rotation, - side width 5 direction: =: table two suction, 31 adsorption holding retaining tape 5. In addition, the knives are not limited thereto, and the rear end of the press rolls 2A of the t-cutter can be used to be in the sensor branch frame 41 placed along the press rolls 20. The front end is provided with a protective tape 3 by means of a suitable protective tape 4 which is peeled off. ί ^ 4 0 ° as shown in Fig. 2, the protective adhesive (four) measuring sensor 4 is set from the inner side of the pressing pro 2G The gap is irradiated with light in the direction of the arrow, and the protective tape 4 which is rolled up by the pressure roller 20 when the protective tape 4 is peeled off is protected by the tape detecting portion 46 (see FIG. 8) to confirm the protective tape 4疋 No adhesion to the release tape 5. Further, the protective tape detecting portion 46 is only an example, and the protective tape 4 can be detected when the peeling tape 5 and the protective tape 4 are wound. By providing the above-described protective tape detecting sensor 4, when the bonding failure occurs when the peeling tape 5 is drilled to the protective tape 4 and the protective tape 4 is not separated, the protective tape peeling device i can be automatically restored to In the initial state, the action of bonding the release tape 5 to the protective tape 4 is performed again. 201104739 35l81pif The structure of the protective tape peeling device 1 of the invention of 3:3, then, according to Fig. 5 (4) to Fig. 5 (e) to Fig. 6 (g) to Fig. 6 (1), the peeling operation of the protective tape 4 of the device 1 is performed 5 In addition, 'for the sake of easy understanding', the description of the tape is made thicker than the actual thickness. The position of the eve 1 line indicates the initial position when the vine tape 4 is peeled off by the protective tape, and the detachment roller is pressed from the initial position to the solid line position 23: the peeling is applied to the protective tape 4 The front end portion of the front end portion is detected by a suitable sensor (not shown) to detect the attaching roller 27 and drive the motor 35 with the clutch 11 to make a; When the lower end of the lower end is offset from the angled guinea band in the counterclockwise direction, the peeling tape 5 is pressed by the attaching roller 27 to the protective breakage correction motor 35 to make the force applied to the household and the adhesive tape 5 is not applied at this time. Two pieces of tape ^ (bJ shows that the peeling is performed by the attaching roller 27: the addendum\stay: 蒦f with 4' while the peeling station 1 is moved back, by 201104739 - and then as shown in Fig. 5 (c) First, the attaching light 27 is retracted, and the peeling table 10 is moved forward and the peeling tape 5 is supplied, whereby the peeling tape 5 is pressed by the pressing member 20, so that the peeling tape 5 is folded at an acute angle. Then, as shown in FIG. 6(d), 'the gripper 14 is stopped from being supplied with the peeling adhesive ▼ 5 ' and the peeling station 10 is advanced. In this case, by the drive of the lost stick π and the tape winding of the mystery U, the roll _ tape * and the knot portion of the release tape 5 are peeled off at the acute angle by the pressure light 2 〇 green protective tape 4 Further, when the protective tape 4 and the peeling tape 5 are wound, the peeling tape 5 on the rear side of the attaching roller 27 contacts the peeling tape holding mechanism 25: =, : an order is made to apply a suction force to the suction hole 26' The release tape 5 which is adsorbed and held on the rear side of the sticker _ 27 is held by the release tape. Further, whether or not the release tape 5 is in contact with the release tape holding mechanism % ί ^ Appropriate sensor to peel off the face of the tape holding mechanism 25 The change in pressure resistance caused by the cross-linking or peeling tape 5 may be the same. μ 'With the winding of the peeling tape 5, the cutter table 29 is lowered by the action of the cylinder 24, so that the suction force acts on the attached tape. The front side of the roller 27 is stunned, the smear of the smashing c, and the motor 35 that holds the clutch are driven:::turn ▼ 5 ' affixing roller 27 causes the attachment mm 27 66 to move and twir so that the heater 28 is located The position after the angle b is rotated from the bottom, the bottom, and the clockwise direction Further, it may be used in a state of being fixed at an appropriate position, but it may be abrasion due to friction with the peeling tape 5 and the 4 Τ knife table 29 being able to move up and down. Therefore, it is preferable that it is worn. Cut 201104739 35181pif and 'With the winding of the peeling tape 5, the protective tape 4 is wound while being pressed by the light 20, and at this time, by the protective tape debt sensor 40 acting, the protective tape 4 When the peeling tape 5 is dried, the protective tape detecting portion 46 of the protective tape 4 determines that the scale 4 has been clicked, and continues the subsequent peeling process. At this time, it is not detected by the protective tape pure sensing sensory 40. When the protective tape 4 is protected, it is regarded as the protective tape 4 and the peeling tape 5, and the peeling failure occurs due to the knotting, and the winding of the tape_5, the winding of the tape 5 or the peeling table 10 is resumed, so that the protective tape peeling device i becomes the initial. status.
繼而’如圖6(e)所示，在由切刀台29和剝離膠帶 保持機構25而吸附保持剝離膠帶5的狀態下，通過益杆汽 缸37的作用來驅動切刀32，從而沿著切 保護勝帶4枯結的剝離膠帶5的後方側。胃〇木刀I 繼而，如圖6 (f)所示，一邊使剝離台i 邊捲繞該保護膠帶4,並且在由剥離膠 ^ 5 麵膠^> 5而使其位於貼附輕27的 27位於剝離台10上的晶 按者《貼附輕 離後端部的i cm左右内二時護膠帶4的剝 ,.z 么石門側上時，使剝離台10停止。另外， 捲繞剝離膠帶5的後方側，可以減少剝離 mmll 5(δ^ϊτ 25 m 27下降，使剝離膠帶保持機構25在規定:置=愧 吸附，並且使貼附輥27進一打腺現讀置分止並停止 ^下降，從而將剝離膠帶5Then, as shown in FIG. 6(e), in a state in which the peeling tape 5 is sucked and held by the cutter table 29 and the peeling tape holding mechanism 25, the cutter 32 is driven by the action of the boom cylinder 37, thereby cutting along The rear side of the peeling tape 5 that has been smashed with the belt 4 is protected. The stomach trowel I and then, as shown in Fig. 6 (f), the peeling table i is wound around the protective tape 4, and is placed on the attaching light 27 by the peeling rubber 5 27 The crystalizer located on the peeling table 10 "attaches the peeling of the protective tape 4 to the inner side of the i cm which is lightly separated from the rear end portion, and stops the peeling table 10 when the side is on the side of the stone door. Further, on the rear side of the wound release tape 5, the peeling mmll 5 can be reduced (the δ^ϊτ 25 m 27 is lowered, and the peeling tape holding mechanism 25 is placed in a predetermined state: 愧 = 愧 adsorption, and the attaching roller 27 is put into a gland Set the stop and stop ^ drop, thus peeling tape 5
20 201104739 35181pif 的前端部按壓貼附至保護膠帶4的剝離後端側。 繼而，如圖7 (h)所示，在切斷附有離合器的 狀態下’―邊使夹棍14進行供給旋轉而供給制 離勝π 5 ’ 一邊使剝離台10前進，由此，貼附輕2 按f轉動而將剝離膠帶5貼附至保護膠帶4上，通過使： 熱益28位於保護膠帶4的剝離後端部上，將剝離 加熱壓接至保護膠帶4的剝離後端部。 ^ 隨後，如圖7⑴所示，使貼附親27上升之後 過夾棍14的驅動…邊供給麵膠帶5 —邊使剝離a = Γ广膠帶捲繞捲盤12來進行捲繞；離 該保郝T 4。在此_ ’使_膠帶保持機構25及 台29上升至初始位置，並且使貼附輥27的加埶 至初始位置。 、 吹復 通過反復進行上述動作，如圖8所示，一 狀的剝離膠帶5來連結晶圓2上貼附 其剝離。此時，由於在貼_ 27的外周的—^ 1 器1因此要在將剝離膠帶5貼附至保護膠帶4 ^熱 控制使加熱g 28位於保護膠帶4的外 欠^ 利用，輥27而貼附的前端侧貼附部“和加熱 44、後、側貼附部45和加熱器壓接部44，從而能夠 利用剝離膠帶5來連結保護膠帶4-邊將其剝離。 片狀的剝二帶預先製作短 使了成為使短片狀的剝離膠帶 方貼附於保護膠帶4的狀態，因此容易處理該剥離膠帶5， 3 21 201104739 35!8Ipif 並且’即使發生剝離失敗也能夠容易地恢復裝置。 而且’先前的8吋晶圓所使用的剝離膠帶為約23〇 mm，與此相對，通過使用本發明的保護膠帶的制離裝置， 可將剝離膠帶的使用量削減至例如35〜40 mm。該剝離膠 帶的使用量可根據所使用的晶圓直徑、保護膠帶、剝離膠 帶而適當變更。 ^ 另外，上述表示了對半導體晶圓的適用例，但在剝凑 各種基板上貼附的保護膠帶等的膠帶類的時候亦可使用 而且，貼附輥27的直徑或加熱器28的形狀、大小〕 ，根據基板的尺寸而適當變更即可，剝離膠帶5與保護月 I4的粘結面積只要斟酌該剝離膠帶5或保護膠帶4的 合性等而變更即可。 以上是本發明的一實施方式，但並不受上述限定，4 本發明的範圍内可以進行適當變更。 —雖然本發明已啸佳實施觸露如上，然其並非用 發明任何熟習此技藝者，在不脫離本發明之精中 範二田可作些許之更動與潤飾’因此本發明之保费 乾圍δ視後附之申請專利範圍所界定者為 【圖式簡單說明】 置的表示本發明的一實施方式的保護朦帶的剝_ 2 ί從圖1的Α-Α方向觀察的箭頭平面圖。 ^從圖1的Β_Β方向觀察的箭頭側面圖 疋說明本發明中所用的貼附輥的立體圖20 201104739 The front end portion of the 35181pif is pressed and attached to the peeling rear end side of the protective tape 4. Then, as shown in FIG. 7(h), while the clutch is attached, the supply of the nipper 14 is rotated and the supply of the detachment π 5 ' is performed, and the peeling table 10 is advanced. The release tape 5 is attached to the protective tape 4 by the rotation of f, and the peeling heat is crimped to the peeling rear end portion of the protective tape 4 by placing the heat benefit 28 on the peeling rear end portion of the protective tape 4. ^ Subsequently, as shown in Fig. 7 (1), after the attaching pro- 27 is raised, the driving of the gripper 14 is supplied to the surface tape 5, and the peeling a = Γ wide tape is wound around the reel 12 to be wound; T 4. Here, the tape holding mechanism 25 and the table 29 are raised to the initial position, and the attaching roller 27 is twisted to the initial position. By blowing, by repeating the above operation, as shown in Fig. 8, a single release tape 5 is attached to the wafer 2 and peeled off. At this time, since the -1 1 of the outer periphery of the sticker _ 27 is attached to the protective tape 4 by the peeling tape 5, the heat control 28 is placed outside the protective tape 4, and the roller 27 is attached. The front end side attaching portion "and the heating 44, the rear side attaching portion 45, and the heater crimping portion 44 are attached to each other, and the protective tape 4 can be joined by the peeling tape 5 to peel it off. In the state in which the release tape is attached to the protective tape 4 in a short form, it is easy to handle the release tape 5, 3 21 201104739 35! 8Ipif and the device can be easily restored even if peeling failure occurs. The peeling tape used in the previous 8-inch wafer is about 23 mm. In contrast, the use amount of the release tape can be reduced to, for example, 35 to 40 mm by using the separation device of the protective tape of the present invention. The amount of the release tape can be appropriately changed depending on the wafer diameter, the protective tape, and the release tape to be used. ^ In addition, the above shows an example of application to a semiconductor wafer, but a protective tape attached to various substrates is peeled off. of In the case of a belt, the diameter of the attaching roller 27 or the shape and size of the heater 28 may be appropriately changed depending on the size of the substrate, and the bonding area of the peeling tape 5 and the protective month I4 may be determined by the peeling. The above is an embodiment of the present invention, but is not limited to the above, and can be appropriately changed within the scope of the present invention. - Although the present invention has been implemented by Xiaojia In the above, it is not invented by anyone skilled in the art, and without departing from the essence of the invention, Fan Ertian can make some changes and retouchings. Therefore, the premium of the present invention is attached to the patent application scope. The definition is a schematic diagram of the arrow of the protective tape of the embodiment of the present invention as viewed from the Α-Α direction of Fig. 1. The arrow viewed from the direction of Β_Β of Fig. 1 Side view 疋 illustrates a perspective view of the applicator roll used in the present invention
22 201104739 ^^Ιδίρΐί 圖5 (a)〜圖5 (c)是本發明的保護膠帶剝離裝置的 動作說明圖。 圖6⑷〜圖6 (f)是本發明的保護膠帶 動作說明圖。 雕衮置的 _=工〜圖7(1)是本發明的保護膠帶_裳置的 圖8是利用本發明的保護膠帶的剝 護膠帶的說明圖。 爾置而剝離的保 【主要元件符號說明】 1 :保護膠帶的剝離裝置 2 B曰 圓 電路圖案 保護膠帶 剝離膠帶 基座 機框 執道 滑塊 10 :剝離台 11 ··制離膠帶供給捲盤 膠帶捲繞捲盤 導輥 失棍 汽紅 4 6 9 12 13 14 15 23 201104739 1 Ο 1 Ull 16 :爽棍 Π :導輥 18 :輥支撐框 19 :汽缸 20 :壓輥 21 :支撐板 22 :汽缸 23 :汽缸 24 :汽缸 25 :剝離膠帶保持機構 26 :吸附孔 27 :貼附輥 28 :加熱器 29 :切刀台 30 :切刀槽 31 :吸附孔 32 :切刀 33 :切刀支撐框 34 :輥支撐框 35 :附有離合器的馬達 36 :機框開口部 37 :無杆汽缸 38 :滑塊 39 :導軌 24 201104739 jDieipif 40 :保護膠帶偵測感測器 41 :感測器支撐框 42 :導杆 43 :前端側貼附部 44 :加熱器壓接部 45 :後端側貼附部 46 :保護膠帶偵測部22 201104739 ^^Ιδίρΐί Figure 5 (a) to Figure 5 (c) are explanatory views of the operation of the protective tape peeling device of the present invention. Fig. 6 (4) to Fig. 6 (f) are explanatory views of the operation of the protective tape of the present invention. Fig. 7 (1) is a protective tape of the present invention. Fig. 8 is an explanatory view of a stripping tape using the protective tape of the present invention. Protected and peeled off [Main component symbol description] 1 : Peeling device for protective tape 2 B round circuit pattern protective tape peeling tape base frame machine block slider 10 : peeling table 11 · · Separate tape supply reel Tape winding reel guide roller lost stick steam red 4 6 9 12 13 14 15 23 201104739 1 Ο 1 Ull 16 : cool stick Π : guide roller 18 : roller support frame 19 : cylinder 20 : pressure roller 21 : support plate 22 : Cylinder 23: Cylinder 24: Cylinder 25: Peeling tape holding mechanism 26: Adsorption hole 27: Attaching roller 28: Heater 29: Cutter table 30: Cutter groove 31: Adsorption hole 32: Cutter 33: Cutter support frame 34: Roller support frame 35: Motor with clutch 36: Frame opening 37: Rodless cylinder 38: Slider 39: Guide rail 24 201104739 jDieipif 40: Protective tape detecting sensor 41: Sensor support frame 42 : Guide rod 43 : Front end side attachment portion 44 : Heater crimping portion 45 : Rear end side attachment portion 46 : Protective tape detecting portion