TWI466185B - Peeling device of a protection tape - Google Patents

Description

Protective tape stripping device

The present invention relates to a device for peeling off a protective tape attached to a substrate. More specifically, the present invention relates to a peeling device for peeling off a protective tape of a protective tape attached to protect a surface of a substrate such as a wafer using a release tape.

In the semiconductor manufacturing process, there has been a process of forming a circuit pattern on the surface of a semiconductor wafer (hereinafter referred to simply as a wafer) cut out from an ingot, and then on the back surface of the wafer. The wafer is subjected to polishing so that the wafer reaches a predetermined thickness, thereby thinning the wafer. When polishing the back surface of the wafer, a protective tape for protecting the surface of the wafer is attached to avoid scratching the circuit pattern formed on the surface of the wafer or immersing the polishing liquid to contaminate the circuit pattern.

After the back surface of the wafer is polished, the protective tape is peeled off from the wafer surface before the wafer is chip-cut along the circuit pattern, and the stripped wafer is supplied to the dicing. The process is performed in a chip.

When the protective tape is peeled off, two methods are generally known. One of the methods is to hold the wafer on the peeling table so that the surface of the protective tape becomes the upper surface, and take out the roll-shaped peeling tape and supply it to the strip. On the surface of the protective tape, the release tape is pressed against the protective tape by a bonding roller, and the protective tape is wound integrally with the release tape (for example, Patent Document 1). Therefore, the release tape requires at least the straightness of the protective tape. The length above the diameter is such that there is a problem that the amount of use of the protective tape is excessively wasted (for example, when the protective tape is peeled off from the 8 inch wafer, a peeling tape of about 230 mm is required).

Further, in another method, the wafer is held on the peeling table so that the surface of the protective tape becomes the upper surface, and a peeling tape having one end is supplied to the surface of the protective tape, and the end is held by the peeling head. The back side of the release tape is attached by only the lift-off operation of the heater, and the peeling tape is attached to the back side of the protective tape to make the release tape into a short sheet shape, and then the peeling tape is peeled off. One end of the peeling tape held by the head is peeled off from the protective tape (for example, Patent Document 2).

However, in the method of Patent Document 2, the release tape used for peeling off the protective tape is attached only to a part of the protective tape, and therefore, although the amount of the release tape used is small, the protection of the peeling must be performed. When the tape is discarded into the waste portion piece by piece, the operation of the peeling unit becomes complicated, and the volume of the discarded protective tape becomes large, which causes a problem of increasing the capacity.

Therefore, one end of the peeling tape cut into a short sheet is attached to a sheet on the upper surface of the front end side (winding end portion) of the plate member (corresponding to a wafer, hereinafter referred to as a wafer) (equivalent It is attached to the upper surface of the rear end side (winding rear end side) of the wafer in a state where a short piece of the release tape is protruded to the outside to form a non-bonded area on the protective tape, which is hereinafter referred to as a protective tape. On the protective tape, the release tape on the front end side of the wafer is pulled, and the protective tape is peeled toward the rear end side of the wafer, and the non-bonded area of the release tape on the rear end side of the wafer is attached to the next Stripping object On the front end side of the wafer of the protective tape, the protective tape is continuously peeled off by a short-shaped release tape, and the protective tape is continuously peeled off (for example, Patent Document 3). In this way, the protective tape can be continuously wound and discarded without being discarded one by one, thereby improving work efficiency.

Prior technical literature Patent literature

[Patent Document 1] Japanese Patent Laid-Open No. 3-67442

[Patent Document 2] Japanese Patent No. 4204653

[Patent Document 3] Japanese Patent No. 4057478

However, in the apparatus of the above-mentioned Patent Document 3, before peeling off the protective tape attached to the wafer, it is necessary to cut the release tape into a short sheet shape and hold the strip-shaped peeling tape (hereinafter, a strip-shaped peeling tape) Attached to the protective tape, it is called a connecting tape, and it is required to transfer the connecting tape cut out from the roll-shaped peeling tape to the lateral movement and the up and down movement of the attaching head, and to attach the connecting tape. The up and down movement is different from the up and down movement, and thus there is a problem that the action of attaching the head is complicated.

Further, it is necessary to separately provide a cutting mechanism for producing a connecting tape and a peeling mechanism portion that holds the connecting tape and attaches it to the protective tape, and peels off the tape while holding the connecting tape, and the device is complicated or The problem of large-scale.

Further, in the apparatus of Patent Document 3, the reel side on which the protective tape is peeled off and wound is completely independent from the supply reel side on which the release tape is supplied, and the lead tape is required to be set at the initial setting. Hanging to the winding reel side and hanging the peeling tape to the supply side to make In the work of connecting the tape (not using one continuous peeling tape, it is necessary to divide the tape on both the winding side guide tape and the supply side peeling connecting tape), and there is a problem that the initial setting is complicated. That is, the peeling device needs to cut off the connecting tape and attach it to the protective tape before attaching, so that the work of setting the initial state becomes very complicated.

Further, when the peeling of the protective tape is started, if the bonding tape is insufficiently bonded to the protective tape and a peeling failure occurs, in order to restore the device to the initial state, the guiding tape must be hung to the adsorption frame of the peeling mechanism portion. After the (grid), the guiding tape is held on the lower surface of the adsorption cell and the front end is cut, and then the guiding tape is hung to the attachment head side, if the adhesive tape is stuck in the peeling If the peeling failure caused by insufficient knots is very difficult, recovery time is also a problem.

Further, when the apparatus of the above Patent Document 3 is used for peeling off the protective tape attached to the wafer, when the connecting tape is attached to the protective tape, the connecting tape which is adhered and held by the lower surface of the attached head must be adhered. The protective tape attached to the wafer is pressed. Therefore, if the pressing force is weak, the connecting tape may be detached from the protective tape, and the peeling failure may occur. Further, the protective tape is attached to the wafer to protect the circuit pattern when the back surface of the wafer is polished, and dirt or the like during the back surface polishing may remain on the surface of the protective tape, so that only the pressing force is used. When attached, there is insufficient bonding strength due to dirt, which causes peeling failure.

Moreover, the device of the above Patent Document 2 is only separated by a heater. The action is to attach a release tape (corresponding to an adhesive tape) cut into a short sheet to the protective tape, and pull the peeling tape to peel it off. Therefore, if the bonding is insufficient, there is a frequent peeling failure. The problem. In particular, when it is applied to the above-described wafer, the adhesion of the protective tape to the adhesive tape is small for the attachment by the lift-off operation of only the heater, and therefore, if it is back-grinded as described above, When the dirt portion of the protective tape overlaps with the bonding portion, there is a problem that the adhesion strength is insufficient and peeling failure occurs.

Accordingly, it is an object of the present invention to provide a device for simplifying the supply mechanism of a release tape, reducing the amount of use of the release tape, thereby benefiting the environment, and providing a prevention of peeling failure, and further, even if peeling failure occurs, the peeling device is recovered. A peeling device for a protective tape that can be automatically performed to improve work efficiency.

Therefore, the first aspect of the invention is a peeling device for a protective tape, which is obtained by winding the protective tape which is attached to the surface of the substrate while being attached to the surface of the substrate by a short-shaped release tape, and peeling off the bonded protective tape. : a peeling station that holds the substrate to which the protective tape is attached with the protective tape surface as an upper surface, and relatively horizontally moves relative to the peeling tape; peels off the tape supply mechanism, and applies a roll-shaped peeling tape Supplyed to the protective tape; a tape winding mechanism that winds a protective tape attached to the release tape; The attaching roller is pressed and rotated on the protective tape via the peeling tape, thereby attaching the peeling tape to the vicinity of the outer peripheral end portion of the protective tape; the cutter is attached to the protective tape by the peeling tape After peeling off the front end side, the attaching rear side of the peeling tape is cut; the cutter table is located in front of the attaching roller, and is provided with a cutter groove for the cutter to travel, and is sucked and held by the cutter a back side of the cut release tape; and a peeling tape holding mechanism located behind the attaching roll, and the peeling tape is adsorbed and held when the cutting blade cuts the peeling tape, and the peeling tape is attached by an attaching roll It is attached to the peeling front end side of the protective tape, and the peeling tape is wound, and the protective tape is peeled off from the peeling front end side, and the peeling tape is adsorbed and held by the cutter table and the peeling tape holding mechanism, and the peeling tape is used. The cutter is used to cut the attachment side of the release tape, and the protective tape attached to the release tape is wound by a tape winding mechanism to peel off the protective tape, and then the attachment roller is used. The distal end portion of release tape held by the suction mechanism holding release tape is attached to the rear end side of the protective release tape, so that the protective tape while sequentially coupling while peeling it off using a release tape.

According to a second aspect of the invention, there is provided a peeling device for a protective tape according to the first aspect of the present invention, wherein a heater is provided on a part of an outer circumference of the attaching roller, and the rotation of the attaching roller is performed by one attaching roller. The adhesion of the release tape to the protective tape and the peeling tape by the heater are attached to the heat of the protective tape.

Further, according to a third aspect of the invention, the protective adhesive according to the first invention and the second invention The stripping device of the belt is provided with a detecting mechanism between the tape winding mechanism and the cutter table to detect the presence or absence of the peeled protective tape. Further, as the detecting means, it is preferable to use an optical sensor such as a reflection type or a transmission type.

As described above, after the roll-shaped peeling tape is attached to the peeling front end side of the protective tape, the adhesive back side of the peeling tape is cut, and then the front end portion of the cut protective tape that is adsorbed and held is attached to the protective tape. Since the tape is peeled off by the release tape and the protective tape is peeled off by the peeling tape, it is possible to provide a device which can reduce the amount of the tape to be used, thereby benefiting the environment, and does not cause an increase in the volume of the discarded protective tape. .

Moreover, a continuous peeling tape is attached to the protective tape first, and then the rear end portion of the peeling tape attached to the protective tape is cut, so that the peeling tape is once from the supply reel at the initial setting When the path is hung to the winding reel, the subsequent peeling process can be automatically performed, and it is not necessary to manually prepare a short-shaped peeling tape in advance, so that work efficiency is greatly improved.

Further, since a heater is incorporated in a part of the outer circumference of the attaching roller, the peeling tape which has adhesiveness at normal temperature can be used, and peeling by the attaching roller can be performed by one attaching roller. The attachment of the tape to the protective tape and the attachment by the heating and crimping of the heater at a predetermined position, even if the attachment surface of the protective tape is contaminated, since it is adhered by two bonding methods The knot thus ensures the bond strength and the peel failure is significantly reduced. Moreover, since the pressing area of the attaching roller to the surface of the wafer is only the connecting portion of the peeling tape, the attaching to the side is attached. Compared with the case where the roller is attached while pressing the entire wafer, the pressing of the wafer by the attaching roller can be minimized, and the wafer is not damaged.

Further, when the protective tape is peeled off by the release tape, it is detected whether or not the protective tape has been peeled off. Therefore, even if the peeling failure occurs due to the adhesion of the release tape to the protective tape, the peeling tape is formed into a short sheet shape. In the past, it is not necessary to change the peeling tape, and the winding of the peeling tape and the peeling table can be restored to the initial state (that is, the device can be automatically restored).

Further, since the attachment mechanism portion of the release tape and the cutting mechanism portion can be integrally formed, and one continuous release tape can be used, the apparatus can be simplified, and the size and cost of the apparatus can be reduced.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Hereinafter, an embodiment of the protective tape peeling device of the present invention will be described with reference to Figs. 1 to 4 .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a portion of a protective tape peeling device of the present invention, which is partially exaggerated. 2 is a plan view of an arrow seen from the direction of A-A of FIG. 1, and FIG. 3 is a side view of the arrow as viewed from the direction of B-B of FIG.

As shown in FIG. 1 to FIG. 3, a frame 7 is erected on the base 6 of the protective tape peeling device 1, and two rails 8 are laid on the base 6 in parallel with the frame 7. 8. Slidable on the two rails 8, 8 Sliders 9 and 9 are fitted to the sliders 9, and the peeling table 10 is horizontally movable on the sliders 9 and 9 along the rails 8 and 8 by an appropriate driving source (not shown).

The peeling stage 10 is provided with a plurality of adsorption holes (not shown) on its upper surface, and these adsorption holes are connected to an appropriate vacuum source (not shown) to generate an adsorption force. Further, the wafer 2 positioned by an appropriate mechanism is placed on the peeling table 10 by the appropriate mechanism, with the protective tape 4 attached to the circuit pattern 3 formed on the surface thereof as the upper surface, and passed through the The pores are adsorbed and held by adsorption.

Above the peeling table 10 and above the machine frame 7, a release tape supply reel 11 for supplying a roll-like release tape 5 having adhesiveness on one side is provided, and the tape is peeled off by the release tape 5 The tape of the protective tape 4 is wound around the reel 12.

The release tape 5 is wound onto the tape via a plurality of guide rolls 13, nip rollers 14, 16 and a plurality of guide rolls 17 in such a manner that the bonding faces thereof face the upper surface of the peeling stage 10. Winding reel 12. Further, it is preferable that the side of the nipples 14, 16 and the guide roller 17 that the adhesive surface of the release tape 5 contacts is subjected to a non-adhesion treatment by fluorine treatment or the like.

Further, both sides of the pinch 16 and the plurality of guide rollers 17 are rotatably supported by the roller support frame 18, and the press roller 20 is rotatably supported at the lowermost end of the roller support frame 18, which The pressure roller 20 is used to peel the protective tape 4 in an acute direction and peel off when the protective tape 4 is peeled off. Further, it is preferable that the length of the nipple 16, the guide roller 17, and the pressure roller 20 is equal to or larger than the diameter of the protective tape 4 to wind the peeled protective tape 4.

Further, as shown in FIG. 2, the pressure roller 20 is provided with a gap on a portion of the frame 7 side, and a protective tape detecting sensor 40, which will be described later, detects the peeled protective tape 4 from the gap.

Further, the two-roller support frame 18 is integrally formed by being hung above, and a cylinder 19 is attached to the upper portion of the hung.

Further, a drive source such as a pulse motor (not shown) is provided in the nippers 14 and 16, to control the supply and winding amount of the tape. Further, in the peeling tape supply reel 11, a known torque limiter (not shown) is provided to extract the peeling tape 5 with a fixed force, and the tape winding reel 12 is provided with a forcible An appropriate motor (not shown) of the peeled protective tape 4 is wound.

Further, the pinches 14, 16 are opened and closed by the cylinders 15, 19, and generally, when the peeling operation is performed, the pinches 14, 16 are closed to hold the tape, and when the tape is replaced or the protective tape peeling device 1 is removed Turns on when it is stopped for a long time. Thereby, the adhesive strength by the deformation of the adhesive surface of the peeling tape 5, etc. is prevented.

A support plate 21 is provided above the peeling table 10 and near the center of the frame 7, so as to protrude from the frame 7 to the front, and the support plate 21 is sequentially faced downward from the supply side of the peeling tape 5. Cylinders 22, 23, 24 are fixed, which can be telescoped downward.

A peeling tape holding mechanism 25 that adsorbs and holds the release tape 5, and a roller support frame 34 that supports the attaching roller 27 are attached to the front end of the shaft of each of the cylinders 22, 23, 24 under the support plate 21, and are provided. Adsorbing and holding the adsorption hole 31 of the peeling tape 5 and the cutter table 29 of the cutter groove 30 The cylinder shafts of the cylinders 22, 23, and 24 are expanded and contracted, and the peeling tape holding mechanism 25, the attaching roller 27, and the cutter table 29 are lifted and lowered. Further, as shown in FIG. 3, guides 42 are slidably provided on both sides of the cylinder 24, and are not slidably provided on both sides of the cylinders 22 and 23, although not shown. Guide rod 42.

The peeling tape holding mechanism 25 is provided on the rear side of the attaching roller 27 (supply side of the peeling tape 5), and the lower surface of the peeling tape holding mechanism 25 is formed obliquely along the inclination of the peeling tape 5, and The plurality of adsorption holes 26 are bored in a direction perpendicular to the traveling direction of the release tape 5, and are connected to an appropriate vacuum source (not shown) to adsorb and hold the release tape 5 from the non-adhesive surface side. Further, the suction force of the release tape 5 may be such that the release tape 5 does not fall off so that the tape 5 can be peeled off even in an adsorbed state.

As shown in FIG. 2, the attaching roller 27 is rotatably supported by the roller support frame 34 at both ends, and a motor 35 with a clutch is connected to one end of the attaching roller 27 via a roller support frame 34. The switching of the free rotation of the attaching roller 27 and the driving rotation can be controlled. Further, instead of the motor 35 with the clutch, a normal motor may be provided, and a mechanism that can be freely engaged with the motor may be employed.

As shown in FIG. 4, the attaching roller 27 is provided with a groove in a part of the outer peripheral surface thereof in the axial direction, and a heater 28 for heating only a part of the peeling tape 5 is embedded in the vicinity of the center of the groove. . Further, rubber or resin or the like is appropriately wound around the outer peripheral portion of the groove of the attaching roller 27 so that the wafer 2 is not damaged even if the wafer 2 is pressed. hurt.

The width or length of the heater 28 is preferably formed so as to press about 2 to 3 mm of the outer peripheral portion of the wafer 2 where the circuit pattern 3 is not provided so as not to press the surface of the circuit pattern 3 of the wafer 2.

Further, when the attaching roller 27 performs the attaching operation, the engagement of the clutch of the motor 35 with the clutch is released and freely rotated, and is rotated by the rotation by the pressing force. Further, when the attaching roller 27 is driven to rotate so that the heater 28 is positioned at the outer peripheral end of the protective tape 4, the position of the heater 28 is detected by an appropriate sensor (not shown), and the clutch is attached. The clutch of the motor 35 is engaged to rotate the attaching roller 27 so that the heater 28 is at a predetermined position.

Further, the cutter table 29 is provided on the front side of the attachment roller 27 (the winding side of the release tape 5), and on the lower surface of the cutter table 29 on the winding side (front side) of the release tape 5 The cutter groove 30 is provided so as to be perpendicular to the traveling direction of the release tape 5, and is similarly provided on the supply side (rear side) of the release tape 5 so as to be perpendicular to the traveling direction of the release tape 5. A plurality of adsorption holes 31.

A cutter 32 for a circular cutter is provided on the lower side of the cutter table 29 and on the frame 7 side so as to correspond to the cutter groove 30. The cutter 32 is supported by the cutter support frame in a freely rotatable manner. The front end of 33. Further, the rear end of the cutter support frame 33 is inserted into the frame opening portion 36 provided in the machine frame 7, and a slider 38 is provided. Further, in the frame opening portion 36, a rodless cylinder 37 is fixed in a direction perpendicular to the frame 7, and the slider 38 is connected to the guide rail 39 of the rodless cylinder 37, whereby The cutter support The frame 33 is movable in the front-rear direction with respect to the frame 7 along the guide rail 39.

Therefore, as shown in FIG. 3, the cutter 32 drives the rodless cylinder 37, thereby using the cutter support frame 33 to follow the cutter groove 30 provided on the cutter table 29 from the solid line like a two-point chain line. In the same manner, the cutter 32 of the round knife cuts the release tape 5 sucked and held by the suction hole 31 of the cutter table 29 in the width direction while rotating by the cutting resistance. In addition, the cutter 32 is a round knife from the viewpoint of abrasion resistance and cutting property, but the invention is not limited thereto, and an appropriate cutter may be used.

Further, at the rear end of the pressure roller 20, a front end of the sensor support frame 41 extending toward the frame 7 along the pressure roller 20 is provided with an appropriate optical mechanism for detecting the presence or absence of peeling. The protective tape of the protective tape 4 detects the sensor 40. As shown in FIG. 2, the protective tape detecting sensor 40 irradiates light in the direction of the arrow from the gap provided on the back side of the pressure roller 20, and is rolled up by the pressure roller 20 when the protective tape 4 is peeled off. The protective tape detecting portion 46 (see FIG. 8) of the protective tape 4 detects the adhesive tape 4 to confirm whether or not the protective tape 4 is bonded to the release tape 5. Further, the protective tape detecting portion 46 is merely an example, and the protective tape 4 can be detected when the peeling tape 5 and the protective tape 4 are wound.

By providing the above-described protective tape detecting sensor 40, when the bonding failure occurs when the release tape 5 is bonded to the protective tape 4 and the protective tape 4 is not peeled off, the protective tape peeling device 1 can be automatically restored to the initial state. The action of bonding the release tape 5 to the protective tape 4 is performed again.

The above is the structure of the protective tape peeling device 1 of the present invention, and then, The peeling operation of the protective tape 4 of the protective tape peeling device 1 of the present invention will be described with reference to Figs. 5(a) to 5(c) to 7(g) to 7(i). Further, for the sake of easy understanding, the protective tape 4 or the release tape 5 is described in a thickness thicker than the actual thickness.

The two-dot chain line position in Fig. 5(a) indicates the initial position when the protective tape 4 is peeled off by the protective tape peeling device 1, and the attaching roller 27 is lowered from the initial position to the solid line position by the action of the cylinder 23, thereby The release tape 5 is pressed and attached to the inner side of about 1 cm of the peeling front end portion of the protective tape 4.

At this time, the position of the heater 28 of the attaching roller 27 is detected by an appropriate sensor (not shown), and the motor 35 with the clutch is driven so that the heater 28 is located from the lower end of the attaching roller 27 The counterclockwise direction is deviated from the position of the angle a, and after the peeling tape 5 is pressed to the protective tape 4 by the attaching roller 27, the clutch of the motor 35 with the clutch is cut off to allow the attaching roller 27 to freely rotate. Further, at this time, an appropriate amount of the release tape 5 is gradually discharged from the release tape supply reel 11 by the driving of the nipper 14 so as not to apply excessive force to the release tape 5.

Then, as shown in FIG. 5(b), the peeling tape 10 is moved back to the protective tape 4 by the attaching roller 27, and the peeling table 10 is moved backward, whereby the heater 28 is rotated in accordance with the rotation of the attaching roller 27. At the angle a, the peeling tape 5 is heated and pressure-bonded to the outer peripheral end of the peeling front end side of the protective tape 4 by the heater 28. Further, at this time, with the movement of the peeling table 10, the peeling tape 5 is wound by an appropriate amount by the driving of the nipper 14.

Then, as shown in FIG. 5(c), first, the attaching roller 27 is retracted. Next, the peeling table 10 is moved forward and the release tape 5 is supplied, whereby the release tape 5 is pressed by the pressure roller 20 so that the release tape 5 is folded at an acute angle.

Then, as shown in FIG. 6(d), the nipper 14 is stopped from being supplied to the release tape 5, and the peeling table 10 is further advanced, whereby the protective tape is wound by the driving of the nipper 16 and the driving of the tape winding reel 12. 4 and the adhesive portion of the release tape 5, the protective tape 4 is peeled off at an acute angle by the pressure roller 20.

When the release tape 5 on the rear side of the attachment roller 27 comes into contact with the lower surface of the release tape holding mechanism 25, the suction force is applied to the adsorption hole 26, and the release tape is applied. The holding mechanism 25 sucks and holds the release tape 5 located on the rear side of the attaching roller 27. Further, whether or not the release tape 5 contacts the lower surface of the release tape holding mechanism 25 may be used to detect a change in the height of the release tape holding mechanism 25 or a change in pressure resistance caused by the release tape 5 by an appropriate sensor.

In addition, with the winding of the release tape 5, the cutter table 29 is lowered by the action of the cylinder 24, and the suction force acts on the adsorption hole 31 to adsorb and hold the release tape 5 located on the front side of the attachment roller 27, and attaches it. The attachment roller 27 drives and rotates the motor 35 with the clutch so that the heater 28 is located at a position rotated by an angle b from the lower side of the attachment roller 27 in the clockwise direction. Further, the cutter table 29 may be used in a state of being fixed at an appropriate position. However, abrasion may be caused by friction with the peeling tape 5, and therefore it is preferable that the cutter table 29 can move up and down.

Moreover, with the winding of the release tape 5, the protective tape 4 is pressed while being pressed The roller 20 is wound while being hung on one side. At this time, when the protective tape detecting sensor 40 functions, when the protective tape 4 is bonded to the peeling tape 5, the protective tape detecting portion 46 of the protective tape 4 is used. It is judged that the protective tape 4 has been bonded, and the subsequent peeling process is continued. At this time, when the protective tape 4 is not detected by the protective tape detecting sensor 40, it is considered that the protective tape 4 and the peeling tape 5 are not bonded, and peeling failure occurs, thereby performing winding or peeling of the peeling tape 5. The recovery of 10 is such that the protective tape peeling device 1 is in an initial state.

Then, as shown in FIG. 6(e), in a state in which the peeling tape 5 is sucked and held by the cutter table 29 and the peeling tape holding mechanism 25, the cutter 32 is driven by the action of the rodless cylinder 37, thereby cutting along The sipe 30 cuts the rear side of the release tape 5 bonded to the protective tape 4.

Then, as shown in FIG. 6(f), the protective tape 4 is wound while the peeling stage 10 is advanced, and the back side of the peeling tape 5 that is cut and held by the peeling tape holding mechanism 25 is sucked and held. The peeling tape 5 is wound slightly to be positioned below the attaching roller 27. Next, when the attaching roller 27 is located on the inner side of about 1 cm of the peeling rear end portion of the protective tape 4 attached to the wafer 2 on the peeling table 10, the peeling table 10 is stopped. Further, here, by slightly winding the rear side of the release tape 5, the amount of use of the release tape 5 can be reduced.

As shown in Fig. 7 (g), in a state where the release tape 5 is suction-held by the release tape holding mechanism 25, the release tape holding mechanism 25 and the application roller 27 are lowered, and the release tape holding mechanism 25 is stopped at a predetermined position and stopped. The adsorption roller 27 is further lowered, and the front end portion of the release tape 5 is pressed and attached to the peeling rear end side of the protective tape 4.

Then, as shown in FIG. 7(h), while the clutch of the motor 35 with the clutch is cut, the detachment tape 5 is supplied while the nipper 14 is supplied and rotated, and the peeling table 10 is advanced. The attachment roller 27 is pressed and rotated to attach the release tape 5 to the protective tape 4, and by placing the heater 28 on the peeling rear end portion of the protective tape 4, the release tape 5 is heated and crimped to the peeling rear end of the protective tape 4. unit.

Then, as shown in Fig. 7(i), after the attachment roller 27 is raised, the peeling table 10 is advanced while the release tape 5 is supplied by the driving of the nipper 14, and the reel is wound by the nipple 16 and the tape. Wrap around to peel off the protective tape 4. During this period, the peeling tape holding mechanism 25 and the cutter table 29 are raised to the initial position, and the heater 28 of the attaching roller 27 is returned to the initial position.

By repeating the above operation, as shown in FIG. 8 , the protective tape 4 attached to the wafer 2 is bonded by the short-shaped release tape 5 and peeled off. At this time, since the heater 28 is provided in a part of the outer circumference of the attaching roller 27, if the peeling tape 5 is attached to the protective tape 4, control is performed so that the heater 28 is located at the outer peripheral end of the protective tape 4, which can be sequentially The front end side attaching portion 43 and the heater crimping portion 44, the rear end side attaching portion 45, and the heater crimping portion 44 which are attached by the attaching roller 27 are formed, and the strip-shaped peeling tape 5 can be used. The protective tape 4 is joined while peeling off.

As described above, by performing a series of operations, it is possible to handle the release tape 5 by attaching one of the short-sheet-shaped release tapes 5 to the protective tape 4 without preparing the short-shaped release tape 5 in advance. Even if a peeling failure occurs, the device can be easily restored.

Further, the peeling tape used in the conventional 8-inch wafer is about 230 mm, and the use amount of the release tape can be reduced to, for example, 35 to 40 mm by using the peeling device of the protective tape of the present invention. The amount of the release tape used can be appropriately changed depending on the wafer diameter to be used, the protective tape, and the release tape.

In addition, although the application example of the semiconductor wafer is shown above, it can also be used when peeling off the tape, such as a protective tape attached to the board|substrate.

Further, the diameter of the attaching roller 27 or the shape and size of the heater 28 may be appropriately changed depending on the size of the substrate, and the bonding area of the release tape 5 and the protective tape 4 may be determined by the adhesion of the peeling tape 5 or the protective tape 4. You can change it by combining it.

The above is an embodiment of the present invention, but it is not limited thereto, and can be appropriately changed within the scope of the present invention.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

1‧‧‧Protective tape stripping device

2‧‧‧ wafer

3‧‧‧ circuit pattern

4‧‧‧Protection tape

5‧‧‧Release tape

6‧‧‧Base

7‧‧‧Machine frame

8‧‧‧ Track

9‧‧‧ Slider

10‧‧‧ peeling station

11‧‧‧Release tape supply reel

12‧‧‧ Tape Winding Reel

13‧‧‧guide roller

14‧‧‧clip

15‧‧‧ cylinder

16‧‧‧clip

17‧‧‧guide roller

18‧‧‧Roll support frame

19‧‧‧ cylinder

20‧‧‧pressure roller

21‧‧‧Support board

22‧‧‧ cylinder

23‧‧‧ cylinder

24‧‧‧ cylinder

25‧‧‧Release tape retention mechanism

26‧‧‧Adsorption holes

27‧‧‧ Attachment roller

28‧‧‧heater

29‧‧‧Cutter table

30‧‧‧cutting slot

31‧‧‧Adsorption holes

32‧‧‧Cutter

33‧‧‧Cutter support frame

34‧‧‧Roll support frame

35‧‧‧Motor with clutch

36‧‧‧Machine frame opening

37‧‧‧rodless cylinder

38‧‧‧ Slider

39‧‧‧rails

40‧‧‧Protection tape detection sensor

41‧‧‧Sensor support frame

42‧‧‧guides

43‧‧‧ front side attachment

44‧‧‧heater crimping

45‧‧‧Back side attachments

46‧‧‧Protective Tape Detection Department

Fig. 1 is a front elevational view showing a peeling device for a protective tape according to an embodiment of the present invention.

Fig. 2 is a plan view of an arrow as seen from the direction A-A of Fig. 1.

Fig. 3 is a side view of the arrow as seen from the direction of B-B of Fig. 1;

Fig. 4 is a perspective view for explaining an applicator roller used in the present invention.

5(a) to 5(c) are the protective tape peeling device of the present invention Action description chart.

6(d) to 6(f) are explanatory views of the operation of the protective tape peeling device of the present invention.

7(g) to 7(i) are explanatory views of the operation of the protective tape peeling device of the present invention.

Fig. 8 is an explanatory view of a protective tape peeled off by a peeling device for a protective tape of the present invention.

1‧‧‧Protective tape stripping device

2‧‧‧ wafer

4‧‧‧Protection tape

5‧‧‧Release tape

6‧‧‧Base

7‧‧‧Machine frame

8‧‧‧ Track

9‧‧‧ Slider

10‧‧‧ peeling station

11‧‧‧Release tape supply reel

12‧‧‧ Tape Winding Reel

13‧‧‧guide roller

14‧‧‧clip

15‧‧‧ cylinder

16‧‧‧clip

17‧‧‧guide roller

18‧‧‧Roll support frame

19‧‧‧ cylinder

20‧‧‧pressure roller

21‧‧‧Support board

22‧‧‧ cylinder

23‧‧‧ cylinder

24‧‧‧ cylinder

25‧‧‧Release tape retention mechanism

26‧‧‧Adsorption holes

27‧‧‧ Attachment roller

28‧‧‧heater

29‧‧‧Cutter table

30‧‧‧cutting slot

31‧‧‧Adsorption holes

32‧‧‧Cutter

33‧‧‧Cutter support frame

34‧‧‧Roll support frame

36‧‧‧Machine frame opening

37‧‧‧rodless cylinder

40‧‧‧Protection tape detection sensor

41‧‧‧Sensor support frame

Claims (3)

A peeling device for a protective tape, which is obtained by peeling a protective tape attached to a surface of a substrate by a short sheet-like release tape, and peeling the protective tape, which is characterized by peeling off a substrate on which the protective tape is attached is held with the protective tape surface as an upper surface, and relatively horizontally moved with respect to the peeling tape; a peeling tape supply mechanism that peels the tape The tape is wound onto the protective tape; the tape winding mechanism winds the protective tape attached to the release tape; and the attaching roller is pressed and rotated on the protective tape via the peeling tape, thereby The peeling tape is attached to the peeling front end side or the peeling rear end side of the protective tape; and the cutter is attached to the peeling front end side of the protective tape, and the peeling tape is attached after the peeling tape is attached a cutting blade table located in front of the attaching roller, provided with a cutter groove for the cutter to travel, and adsorbing and holding the rear of the peeling tape cut by the cutter And a peeling tape holding mechanism located behind the attaching roller, adsorbing and holding the peeling tape when the cutting blade cuts the peeling tape, and attaching the peeling tape to the Adhering the peeling front end side of the adhesive tape, and winding the peeling tape, thereby peeling off the protective tape from the peeling front end side, and using the cutter table and The peeling tape holding mechanism sucks and holds the peeling tape, and cuts the attached back side of the peeling tape by the cutter, and winds the tape by the tape winding mechanism Protecting the tape, thereby peeling off the protective tape, and then attaching the front end portion of the release tape held by the peeling tape holding mechanism to the peeling rear end side of the protective tape by the attaching roller, thereby The protective tape is peeled off while sequentially connecting the protective tape by the release tape. The peeling device of the protective tape according to the first aspect of the invention, wherein the attaching roller is provided with a heater on a part of the outer circumference thereof, and the attaching roller is used to pass the attaching roller. The attachment of the release tape by the rotation and the heat attachment of the release tape by the heater. The peeling device for a protective tape according to claim 1 or 2, wherein a detecting mechanism is disposed between the tape winding mechanism and the cutter table to detect the presence or absence of the peeling protection. tape.