TWI576978B - Apparatus and method for dicing flexible substrate and tearing protection tape - Google Patents
Apparatus and method for dicing flexible substrate and tearing protection tape Download PDFInfo
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- TWI576978B TWI576978B TW105111284A TW105111284A TWI576978B TW I576978 B TWI576978 B TW I576978B TW 105111284 A TW105111284 A TW 105111284A TW 105111284 A TW105111284 A TW 105111284A TW I576978 B TWI576978 B TW I576978B
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本發明是關於一種用以切割可撓性基板及撕除保護膠帶的機台及其方法,特別是在一機台中同步對一可撓性基板進行一切割步驟及一撕除保護膠帶步驟,以縮短該可撓性基板的製造時間。The invention relates to a machine for cutting a flexible substrate and tearing off a protective tape, and a method thereof, in particular, a step of simultaneously cutting a flexible substrate and a step of tearing off the protective tape in a machine, The manufacturing time of the flexible substrate is shortened.
在習知技術中,可撓性基板可被運用於薄膜覆晶(Chip On Film,COF)封裝、捲帶承載封裝(Tape Carrier Package,TCP)等封裝構造的載板,為增加產能,會形成多個相互連接成一體的可撓性基板,且在該些可撓性基板上會貼附一保護膠帶,以保護該些可撓性基板上的電子元件,然由於該些可撓性基板相互連接成一體,因此如何讓相互連接成一體的該些可撓性基板分離並撕除該保護膠帶是增加產能必須解決的問題。In the prior art, the flexible substrate can be applied to a carrier plate of a package structure such as a chip on film (COF) package or a tape carrier package (TCP), and is formed to increase productivity. a plurality of flexible substrates connected to each other, and a protective tape is attached to the flexible substrates to protect the electronic components on the flexible substrates, because the flexible substrates are mutually The connection is integrated, so how to separate and tear off the protective substrates which are integrally connected to each other is a problem that must be solved to increase the productivity.
本發明之一目的在於提供一種用以切割可撓性基板及撕除保護膠帶的方法,其包含提供一可撓性基板、提供一機台、同步進行一切割步驟及一撕除保護膠帶步驟,該可撓性基板包含一本體及一保護膠帶,該本體至少具有相互連接成一體的一第一可撓性基板、一第二可撓性基板及一第一切割道,該第一切割道位於該第一可撓性基板與該第二可撓性基板之間,該保護膠帶貼附於該第一可撓性基板及該第二可撓性基板,該機台包含一切割機構、一撕除保護膠帶機構、一第一輸送路徑、一第二輸送路徑及一第三輸送路徑,該第一輸送路徑分別銜接該第二輸送路徑及該第三輸送路徑,該撕除保護膠帶機構位於該切割機構之後,該切割機構位在該第一輸送路徑,該第二輸送路徑及該第三輸送路徑位在該切割機構之後,該撕除保護膠帶機構位在該第三輸送路徑,該切割機構具有一切割刀具,在該切割步驟中,是延著該第一輸送路徑將該可撓性基板輸送至該切割機構,該切割刀具延著該第一切割道切割該可撓性基板,使該第一可撓性基板及該第二可撓性基板分離成個體,延著該第二輸送路徑輸送該第一可撓性基板及該第二可撓性基板,延著該第三輸送路徑輸送該保護膠帶,以該撕除保護膠帶機構帶動該保護膠帶,以使該第一可撓性基板與該保護膠帶分離,以及使該第二可撓性基板與該保護膠帶分離,其中該切割步驟及該撕除保護膠帶步驟是在該機台進行,且進行該切割步驟及該撕除保護膠帶步驟時,該保護膠帶同時通過該切割機構及該撕除保護膠帶機構。An object of the present invention is to provide a method for cutting a flexible substrate and tearing off a protective tape, comprising the steps of providing a flexible substrate, providing a machine, simultaneously performing a cutting step, and a tear-off protective tape. The flexible substrate comprises a body and a protective tape, the body having at least a first flexible substrate, a second flexible substrate and a first cutting path integrally connected to each other, the first cutting channel is located Between the first flexible substrate and the second flexible substrate, the protective tape is attached to the first flexible substrate and the second flexible substrate, and the machine includes a cutting mechanism and a tearing In addition to the protective tape mechanism, a first conveying path, a second conveying path and a third conveying path, the first conveying path respectively engages the second conveying path and the third conveying path, and the tear-protecting tape mechanism is located at the After the cutting mechanism, the cutting mechanism is located in the first conveying path, the second conveying path and the third conveying path are located after the cutting mechanism, and the tear-off protective tape mechanism is located in the third conveying path. The cutting mechanism has a cutting tool. In the cutting step, the flexible substrate is transported to the cutting mechanism along the first conveying path, and the cutting tool cuts the flexible substrate along the first cutting path. Separating the first flexible substrate and the second flexible substrate into individual, and transporting the first flexible substrate and the second flexible substrate along the second transport path, and extending the third transport Transporting the protective tape with the tear-off protective tape mechanism to separate the first flexible substrate from the protective tape and separating the second flexible substrate from the protective tape, wherein the protective tape is separated from the protective tape The cutting step and the step of tearing off the protective tape are performed on the machine, and when the cutting step and the step of tearing off the protective tape are performed, the protective tape passes through the cutting mechanism and the tear-off protective tape mechanism at the same time.
本發明之另一目的在於提供一種用以切割可撓性基板及撕除保護膠帶的機台,其用以切割包含有一本體及一保護膠帶的一可撓性基板,並撕除該保護膠帶,其特徵在於該機台包含一切割機構、一撕除保護膠帶機構、一第一輸送路徑、一第二輸送路徑及一第三輸送路徑,該第一輸送路徑分別銜接該第二輸送路徑及該第三輸送路徑,該撕除保護膠帶機構位於該切割機構之後,該切割機構位在該第一輸送路徑,該第二輸送路徑及該第三輸送路徑位在該切割機構之後,該撕除保護膠帶機構位在該第三輸送路徑,該切割機構用以切割通過該切割機構的該可撓性基板,以使該本體分離成一第一可撓性基板及一第二可撓性基板,該撕除保護膠帶機構用以撕除通過該切割機構的該保護膠帶,以使該第一可撓性基板與該保護膠帶分離,以及使該第二可撓性基板與該保護膠帶分離。 Another object of the present invention is to provide a machine for cutting a flexible substrate and tearing off a protective tape, which is used for cutting a flexible substrate including a body and a protective tape, and tearing off the protective tape. The machine platform includes a cutting mechanism, a tear-off protective tape mechanism, a first conveying path, a second conveying path and a third conveying path, wherein the first conveying path respectively connects the second conveying path and the a third conveying path, the tear-off protective tape mechanism is located behind the cutting mechanism, the cutting mechanism is located in the first conveying path, and the second conveying path and the third conveying path are located behind the cutting mechanism, the tearing protection The tape mechanism is located in the third conveying path, and the cutting mechanism is configured to cut the flexible substrate passing through the cutting mechanism to separate the body into a first flexible substrate and a second flexible substrate. a protective tape mechanism for tearing off the protective tape passing through the cutting mechanism to separate the first flexible substrate from the protective tape, and the second flexible substrate and the protective tape Tape separation.
本發明是在同一機台中同步進行該切割步驟及該撕除保護膠帶步驟,藉由該切割機構進行該切割步驟以及藉由該撕除保護膠帶機構進行該撕除保護膠帶步驟,以節省分離該第一可撓性基板及該第二可撓性基板後必須分別儲存、搬運及撕除該保護膠帶的製程時間,以達到增加產能的目地,且可節省購置機台的成本。The invention is the step of simultaneously performing the cutting step and the tear-protecting tape in the same machine, the cutting step is performed by the cutting mechanism, and the tear-protecting tape step is performed by the tear-off protective tape mechanism to save separation After the first flexible substrate and the second flexible substrate, the processing time of the protective tape must be separately stored, transported, and torn off, so as to achieve the purpose of increasing productivity, and the cost of purchasing the machine can be saved.
請參閱第1至10圖,本發明之一種用以切割可撓性基板及撕除保護膠帶的機台及其方法,是於同一機台中進行切割步驟及撕除保護膠帶步驟,該用以切割可撓性基板及撕除保護膠帶的方法包含提供一可撓性基板、提供一機台、同步進行一切割步驟以及一撕除保護膠帶步驟,其中第3至6圖為本發明的一第一實施例,第7至10圖為本發明的一第二實施例。 Referring to Figures 1 to 10, a machine for cutting a flexible substrate and tearing off a protective tape and a method thereof are the steps of performing a cutting step and tearing off a protective tape in the same machine, which is used for cutting The flexible substrate and the method for tearing off the protective tape comprise the steps of providing a flexible substrate, providing a machine, performing a cutting step simultaneously, and tearing off the protective tape, wherein the third to sixth figures are the first of the present invention. Embodiments, Figures 7 to 10 are a second embodiment of the present invention.
首先,請參閱第1圖,在提供一可撓性基板的步驟中,一可撓性基板100包含一本體110及一保護膠帶120,該可撓性基板100可被運用於薄膜覆晶(Chip On Film,COF)封裝、捲帶承載封裝(Tape Carrier Package,TCP)等封裝製程,該本體110至少具有相互連接成一體的一第一可撓性基板111、一第二可撓性基板112及一第一切割道113,該第一切割道113位於該第一可撓性基板111與該第二可撓性基板112之間,該保護膠帶120貼附於該第一可撓性基板111及該第二可撓性基板112,在本實施例中,該可撓性基板100可另包含一側板體130,該側板體130位在該本體110的側邊,該側板體130與該本體110之間具有一第二切割道114,或者,請參閱第2圖,在不同的實施例中,該本體110具有相互連接成一體的該第一可撓性基板111、該第二可撓性基板112及至少一第三可撓性基板115,該用以切割可撓性基板及撕除保護膠帶的方法並未限制僅對第1或2圖所揭露的該可撓性基板100進行切割及撕除保護膠帶步驟,在本實施例中,請參閱第1圖,該可撓性基板100被捲收於一捲輪300,以利進行後續的切割及撕除保護膠帶步驟。First, referring to FIG. 1 , in the step of providing a flexible substrate, a flexible substrate 100 includes a body 110 and a protective tape 120, which can be applied to film flip chip (Chip). a package process of a package, a tape carrier package (TCP), etc., the body 110 has at least a first flexible substrate 111 and a second flexible substrate 112 connected to each other. a first scribe line 113 is disposed between the first flexible substrate 111 and the second flexible substrate 112. The protective tape 120 is attached to the first flexible substrate 111 and The second flexible substrate 112, in the embodiment, the flexible substrate 100 can further include a side plate 130, the side plate 130 is located at a side of the body 110, the side plate 130 and the body 110 There is a second dicing street 114 between them, or, referring to FIG. 2, in different embodiments, the body 110 has the first flexible substrate 111 and the second flexible substrate integrally connected to each other. 112 and at least a third flexible substrate 115 for cutting the flexible substrate and tearing off The method of protecting the tape does not limit the step of cutting and tearing off the protective tape only for the flexible substrate 100 disclosed in FIG. 1 or FIG. 2 . In the present embodiment, referring to FIG. 1 , the flexible substrate 100 is provided. It is taken up in a reel 300 to facilitate the subsequent cutting and tearing of the protective tape step.
接著,請參閱第3圖,在提供一機台的步驟中,一機台200包含一切割機構210、一撕除保護膠帶機構220、一第一輸送路徑S1、一第二輸送路徑S2及一第三輸送路徑S3,該第一輸送路徑S1分別銜接該第二輸送路徑S2及該第三輸送路徑S3,該撕除保護膠帶機構220位於該切割機構210之後,該切割機構位210在該第一輸送路徑S1,該第二輸送路徑S2及該第三輸送路徑S3位在該切割機構210之後,該撕除保護膠帶機構220位在該第三輸送路徑S3,該切割機構210具有一切割刀具211,較佳地,該切割機構210另具有一支撐輪212,該支撐輪212用以支撐通過該切割機構210的該可撓性基板100,以利該切割刀具211切割該可撓性基板100。Next, referring to FIG. 3, in the step of providing a machine table, a machine table 200 includes a cutting mechanism 210, a tear-off protective tape mechanism 220, a first conveying path S1, a second conveying path S2, and a a third transport path S3, the first transport path S1 is respectively connected to the second transport path S2 and the third transport path S3, the tear-off protective tape mechanism 220 is located behind the cutting mechanism 210, and the cutting mechanism bit 210 is at the a conveying path S1, the second conveying path S2 and the third conveying path S3 are located behind the cutting mechanism 210, the tear-off protective tape mechanism 220 is located in the third conveying path S3, and the cutting mechanism 210 has a cutting tool 211. Preferably, the cutting mechanism 210 further has a support wheel 212 for supporting the flexible substrate 100 passing through the cutting mechanism 210, so that the cutting tool 211 cuts the flexible substrate 100. .
接著,請參閱第1、3及4圖,同步進行該切割步驟及該撕除保護膠帶步驟,將該捲輪300設置於該機台200,延著該第一輸送路徑S1將該可撓性基板100輸送至該切割機構210,該可撓性基板100通過該切割機構210,且該切割刀具211延著該第一切割道113切割該可撓性基板100,使該第一可撓性基板111及該第二可撓性基板112分離成個體,在本實施例中,在該第一輸送路徑S1中,設有多個滾輪A,該些滾輪A用以支撐該可撓性基板100,以避免輸送該可撓性基板100時,該可撓性基板100翻轉或捲曲,而造成該切割刀具211無法對準該第一切割道113,當該可撓性基板100被該切割刀具211切割而使該第一可撓性基板111及該第二可撓性基板112分離成個體後,延著該第二輸送路徑S2輸送已分離成個體的該第一可撓性基板111及該第二可撓性基板112,以及延著該第三輸送路徑S3輸送該保護膠帶120,並以該撕除保護膠帶機構220帶動該保護膠帶120,以使該第一可撓性基板111與該保護膠帶120分離,以及使該第二可撓性基板112與該保護膠帶120分離,請參閱第3、4及5圖,在本實施例中,該第一輸送路徑S1與該第三輸送路徑S3之間具有一夾角C,該夾角C不大於180度,較佳地,該夾角C為一銳角,當該第一可撓性基板111及該第二可撓性基板112延著該第二輸送路徑S2被輸送且該保護膠帶120延著該第三輸送路徑S3被輸送時,該保護膠帶120會在該第三輸送路徑S3中形成一彎折B,該彎折B會使得該保護膠帶120與該第一可撓性基板111及該第二可撓性基板112分離,該撕除保護膠帶機構220可被一馬達(圖未繪出)帶動,該馬達帶動該撕除保護膠帶機構220作動。Next, referring to Figures 1, 3 and 4, the cutting step and the step of tearing off the protective tape are performed simultaneously, and the reel 300 is disposed on the machine table 200, and the flexible portion is extended along the first conveying path S1. The substrate 100 is transported to the cutting mechanism 210, the flexible substrate 100 passes through the cutting mechanism 210, and the cutting tool 211 cuts the flexible substrate 100 along the first cutting path 113 to make the first flexible substrate 111 and the second flexible substrate 112 are separated into individual parts. In the embodiment, a plurality of rollers A are disposed in the first conveying path S1, and the rollers A are used to support the flexible substrate 100. When the flexible substrate 100 is transported, the flexible substrate 100 is turned over or curled, so that the cutting tool 211 cannot be aligned with the first cutting path 113, and when the flexible substrate 100 is cut by the cutting tool 211 After the first flexible substrate 111 and the second flexible substrate 112 are separated into individual bodies, the first flexible substrate 111 and the second separated into individual are transported along the second transport path S2. The flexible substrate 112 and the protective tape 120 are transported along the third transport path S3 And the protective tape 120 is driven by the tear-off protective tape mechanism 220 to separate the first flexible substrate 111 from the protective tape 120 and to separate the second flexible substrate 112 from the protective tape 120. Referring to Figures 3, 4 and 5, in the embodiment, the first conveying path S1 and the third conveying path S3 have an angle C, and the angle C is not more than 180 degrees. Preferably, the angle is C is an acute angle. When the first flexible substrate 111 and the second flexible substrate 112 are transported along the second transport path S2 and the protective tape 120 is transported along the third transport path S3, The protective tape 120 forms a bend B in the third transport path S3, and the bend B separates the protective tape 120 from the first flexible substrate 111 and the second flexible substrate 112. The tear-off protective tape mechanism 220 can be driven by a motor (not shown) that drives the tear-off protective tape mechanism 220 to actuate.
請參閱第4、5及6圖,較佳地,該機台200包含一感測器230,該感測器230位在該第二輸送路徑S2,該感測器230可選自於超音波感測器(如 PEPPERL+FUCHS 公司的UDC-18GM50-400-3E0型感測器),該感測器230用以感測該保護膠帶120是否脫離該第一可撓性基板111及該第二可撓性基板112,並且該感測器230用以驅動該撕除保護膠帶機構220,以撕除通過該切割機構220後而未脫離該第一可撓性基板111或該第二可撓性基板112的該保護膠帶120。Referring to Figures 4, 5 and 6, preferably, the machine 200 includes a sensor 230, the sensor 230 is located in the second transport path S2, and the sensor 230 can be selected from the ultrasonic wave. a sensor (such as a UDC-18GM50-400-3E0 sensor of the PEPPERL+FUCHS company), the sensor 230 is configured to sense whether the protective tape 120 is separated from the first flexible substrate 111 and the second a flexible substrate 112, and the sensor 230 is configured to drive the tear-off protective tape mechanism 220 to tear through the cutting mechanism 220 without leaving the first flexible substrate 111 or the second flexible The protective tape 120 of the substrate 112.
請參閱第6圖,在本實施例中,當分離成個體的該第一可撓性基板111或該第二可撓性基板112的其中之一同時與該保護膠帶120經過該感測器230的一感測區231時,該感測器230驅動該撕除保護膠帶機構220作動,以使該撕除保護膠帶機構220帶動該保護膠帶120,並使該保護膠帶120離開該感測區131。Referring to FIG. 6 , in the embodiment, one of the first flexible substrate 111 or the second flexible substrate 112 separated into an individual passes through the sensor 230 simultaneously with the protective tape 120 . The sensor 230 drives the tear-off protective tape mechanism 220 to actuate the tear-off protective tape mechanism 220 to drive the protective tape 120 and leave the protective tape 120 away from the sensing area 131. .
請參閱第3、4、5及6圖,在本實施例中,該撕除保護膠帶機構220具有一張力輪221,該張力輪221位在該第三輸送路徑S3,該張力輪221用以帶動該保護膠帶120,該感測器230驅動該撕除保護膠帶機構220的該張力輪221,以使該張力輪221帶動該保護膠帶120,以撕除通過該切割機構210後而未脫離第一可撓性基板111或該第二可撓性基板112的該保護膠帶120,以使該保護膠帶120與該第一可撓性基板111及該第二可撓性基板112分離。 Referring to the figures 3, 4, 5 and 6, in the embodiment, the tear-off protective tape mechanism 220 has a force wheel 221, the tension wheel 221 is located in the third conveying path S3, and the tension wheel 221 is used for The protective tape 120 is driven, the sensor 230 drives the tension wheel 221 of the tear-off protective tape mechanism 220, so that the tension wheel 221 drives the protective tape 120 to tear off the cutting mechanism 210 without leaving the first The protective tape 120 of the flexible substrate 111 or the second flexible substrate 112 separates the protective tape 120 from the first flexible substrate 111 and the second flexible substrate 112.
請參閱第3、4、5及6圖,該撕除保護膠帶機構220另具有一保護膠帶捲收輪222,該保護膠帶捲收輪222位在該第三輸送路徑S3的末端,該保護膠帶捲收輪222用以捲收該保護膠帶120,在本實施例中,轉動該保護膠帶捲收輪222以捲收該保護膠帶120。 Referring to Figures 3, 4, 5 and 6, the tear-off protective tape mechanism 220 further has a protective tape take-up reel 222, which is located at the end of the third transport path S3, the protective tape The take-up reel 222 is used to reel the protective tape 120. In the embodiment, the protective tape take-up reel 222 is rotated to wind the protective tape 120.
請參閱第5及6圖,該撕除保護膠帶機構220具有至少一導輪223,該導輪223具有二個區隔空間223a,該導輪223用以區隔被該切割刀具211切割成二條狀體的該保護膠帶120,以避免被切割成二條狀體的該保護膠帶120相互交疊,而造成該張力輪221無法帶動該保護膠帶120。 Referring to FIGS. 5 and 6, the tear-off protective tape mechanism 220 has at least one guide wheel 223 having two compartments 223a for dividing the cutting tool 211 into two pieces. The protective tape 120 of the shape prevents the protective tape 120 cut into two strips from overlapping each other, so that the tension wheel 221 cannot drive the protective tape 120.
請參閱第1、3及4圖,由於該切割步驟及該撕除保護膠帶步驟是在該機台200同步進行,且進行該切割步驟及該撕除保護膠帶步驟時,該保護膠帶120同時通過該切割機構210及該撕除保護膠帶機構220,該切割步驟及該撕除保護膠帶步驟是在該機台同步進行,因此可節省分割該第一可撓性基板111及該第二可撓性基板112後必須分別儲存、搬運及撕除貼附於該第一可撓性基板111及該第二可撓性基板112的該保護膠帶120的製程時間,以達到增加產能的目地,且可節省購置機台的成本。 Referring to Figures 1, 3 and 4, since the cutting step and the tear-off protective tape step are performed simultaneously on the machine table 200, and the cutting step and the tear-off protective tape step are performed, the protective tape 120 is simultaneously passed. The cutting mechanism 210 and the tear-off protective tape mechanism 220, the cutting step and the tear-off protective tape step are performed synchronously on the machine, thereby saving division of the first flexible substrate 111 and the second flexibility After the substrate 112, the processing time of the protective tape 120 attached to the first flexible substrate 111 and the second flexible substrate 112 must be separately stored, transported, and removed, so as to achieve the purpose of increasing productivity, and saving The cost of purchasing a machine.
請參閱第3及4圖,請參閱該機台200包含一第一捲輪240及一第二捲輪250,該第一捲輪240及該第二捲輪250位在該第二輸送路徑S2的末端,該第一捲輪240用以捲收已分離成個體的該第一可撓性基板111,該第二捲輪250用以捲收已分離成個體的該第二可撓性基板112,在該第一可撓性基板111與該第二可撓性基板112脫離該保護膠帶120後,以該第一捲輪240捲收該第一可撓性基板111,以及以該第二捲輪250捲收該第二可撓性基板112,在本實施例中,該感測 器230位在該切割刀具211與該第一捲輪240之間。 Please refer to the figures 3 and 4, and the machine 200 includes a first reel 240 and a second reel 250. The first reel 240 and the second reel 250 are located in the second conveying path S2. The first reel 240 is configured to reel the first flexible substrate 111 that has been separated into an individual, and the second reel 250 is used to retract the second flexible substrate 112 that has been separated into individual bodies. After the first flexible substrate 111 and the second flexible substrate 112 are separated from the protective tape 120, the first flexible substrate 111 is wound by the first reel 240, and the second roll is wound. The wheel 250 retracts the second flexible substrate 112. In this embodiment, the sensing The device 230 is located between the cutting tool 211 and the first reel 240.
請參閱第3及4圖,該機台200包含一第四輸送路徑S4,該第四輸送路徑S4銜接該第一輸送路徑S1,且該第三輸送路徑S3位在該第二輸送路徑S2與該第四輸送路徑S4之間,在進行該切割步驟中該切割刀具211延著該第二切割道114切割該可撓性基板100,使該側板體130與該本體110分離成個體,且延著該第四輸送路徑S4輸送該側板體130,在本實施例中,該機台200包含一廢料捲收輪260,該廢料捲收輪260位在該第四輸送路徑S4的末端,在該切割步驟後,該廢料捲收輪260捲收該側板體130。 Referring to FIGS. 3 and 4, the machine 200 includes a fourth transport path S4 that engages the first transport path S1, and the third transport path S3 is located in the second transport path S2. Between the fourth conveying path S4, the cutting tool 211 cuts the flexible substrate 100 along the second cutting path 114 during the cutting step, so that the side plate body 130 and the body 110 are separated into individual bodies, and The fourth conveying path S4 conveys the side plate body 130. In the embodiment, the machine table 200 includes a waste rewinding wheel 260, and the waste rewinding wheel 260 is located at the end of the fourth conveying path S4. After the cutting step, the waste rewinding wheel 260 retracts the side plate body 130.
請參閱第7至10圖,其為本發明的一第二實施例,第二實施例與第一實施例的差異在於,該機台200未設置第一實施例中的該張力輪221,在第二實施例中,該保護膠帶捲收輪222位在該第三輸送路徑S3的末端,該保護膠帶捲收輪222用以捲收該保護膠帶120,該撕除保護膠帶機構220以該保護膠帶捲收輪222帶動該保護膠帶120,以撕除通過該切割機構210後而未脫離該第一可撓性基板111或該第二可撓性基板112的該保護膠帶120。 Please refer to FIGS. 7-10, which is a second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that the tensioning wheel 221 in the first embodiment is not provided in the machine 200. In the second embodiment, the protective tape retracting wheel 222 is located at the end of the third conveying path S3, and the protective tape winding reel 222 is used for winding the protective tape 120, and the tearing protective tape mechanism 220 is protected by the protection. The tape retracting wheel 222 drives the protective tape 120 to tear off the protective tape 120 that has passed through the cutting mechanism 210 without being separated from the first flexible substrate 111 or the second flexible substrate 112.
請參閱第9及10圖,在本實施例中,當分離成個體的該第一可撓性基板111或該第二可撓性基板112的其中之一同時與該保護膠帶120經過該感測器230的一感測區231時,該感測器230驅動該保護膠帶捲收輪222轉動,以使該保護膠帶捲收輪222帶動該保護膠帶120,並使該保護膠帶120離開該感測區131。 Referring to FIGS. 9 and 10, in the embodiment, one of the first flexible substrate 111 or the second flexible substrate 112 that is separated into an individual is simultaneously subjected to the sensing with the protective tape 120. The sensor 230 drives the protective tape take-up reel 222 to rotate, so that the protective tape take-up reel 222 drives the protective tape 120 and causes the protective tape 120 to leave the sensing. Area 131.
本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .
100‧‧‧可撓性基板100‧‧‧Flexible substrate
110‧‧‧本體110‧‧‧ body
111‧‧‧第一可撓性基板111‧‧‧First flexible substrate
112‧‧‧第二可撓性基板112‧‧‧Second flexible substrate
113‧‧‧第一切割道113‧‧‧First cutting lane
114‧‧‧第二切割道114‧‧‧Second cutting lane
115‧‧‧第三可撓性基板115‧‧‧ Third flexible substrate
120‧‧‧保護膠帶120‧‧‧Protection tape
130‧‧‧側板體130‧‧‧Side plate
200‧‧‧機台200‧‧‧ machine
210‧‧‧切割機構210‧‧‧ cutting mechanism
211‧‧‧切割刀具211‧‧‧Cutting tools
212‧‧‧支撐輪212‧‧‧Support wheel
220‧‧‧撕除保護膠帶機構220‧‧‧Removal of protective tape mechanism
221‧‧‧張力輪221‧‧‧Tension wheel
222‧‧‧保護膠帶捲收輪222‧‧‧Protection tape reel
223‧‧‧導輪223‧‧‧guide wheel
223a‧‧‧區隔空間223a‧‧‧Separated space
230‧‧‧感測器230‧‧‧ sensor
231‧‧‧感測區231‧‧‧Sensing area
240‧‧‧第一捲輪240‧‧‧First reel
250‧‧‧第二捲輪250‧‧‧second reel
260‧‧‧廢料捲收輪260‧‧‧ scrap reel
300‧‧‧捲輪300‧‧‧Reel
A‧‧‧滾輪A‧‧‧Roller
B‧‧‧彎折B‧‧‧Bend
C‧‧‧夾角C‧‧‧ angle
S1‧‧‧第一輸送路徑S1‧‧‧First transport path
S2‧‧‧第二輸送路徑S2‧‧‧Second transport path
S3‧‧‧第三輸送路徑S3‧‧‧ third transport path
S4‧‧‧第四輸送路徑S4‧‧‧ fourth transport path
第1圖:可撓性基板捲收於捲收輪的立體圖。 Fig. 1 is a perspective view of a flexible substrate taken up in a winding reel.
第2圖:可撓性基板捲收於捲收輪的立體圖。 Fig. 2 is a perspective view of the flexible substrate taken up in the winding reel.
第3圖:本發明的第一實施例「用以切割可撓性基板及撕除保護膠帶的機台」的示意圖。 Fig. 3 is a schematic view showing a first embodiment of the present invention "a machine for cutting a flexible substrate and tearing off a protective tape".
第4圖:本發明的第一實施例,以該機台輸送可撓性基板並進行切割及撕除保護膠帶的示意圖。 Fig. 4 is a view showing a first embodiment of the present invention, in which a flexible substrate is conveyed by the machine, and a protective tape is cut and peeled off.
第5及6圖:本發明的第一實施例「撕除保護膠帶機構」局部立體圖。 5 and 6 are partial perspective views of the first embodiment of the present invention, "peeling the protective tape mechanism".
第7圖:本發明的第二實施例「用以切割可撓性基板及撕除保護膠帶的機台」的示意圖。 Fig. 7 is a schematic view showing a second embodiment of the present invention "a machine for cutting a flexible substrate and tearing off a protective tape".
第8圖:本發明的第二實施例,以該機台輸送可撓性基板並進行切割及撕除保護 膠帶的示意圖。 Figure 8 is a second embodiment of the present invention, in which the flexible substrate is transported by the machine and cut and torn protected Schematic diagram of the tape.
第9及10圖:本發明的第二實施例「撕除保護膠帶機構」局部立體圖。9 and 10 are partial perspective views of a second embodiment of the present invention, "peeling the protective tape mechanism".
100‧‧‧可撓性基板 100‧‧‧Flexible substrate
111‧‧‧第一可撓性基板 111‧‧‧First flexible substrate
112‧‧‧第二可撓性基板 112‧‧‧Second flexible substrate
120‧‧‧保護膠帶 120‧‧‧Protection tape
130‧‧‧側板體 130‧‧‧Side plate
200‧‧‧機台 200‧‧‧ machine
210‧‧‧切割機構 210‧‧‧ cutting mechanism
211‧‧‧切割刀具 211‧‧‧Cutting tools
212‧‧‧支撐輪 212‧‧‧Support wheel
220‧‧‧撕除保護膠帶機構 220‧‧‧Removal of protective tape mechanism
221‧‧‧張力輪 221‧‧‧Tension wheel
222‧‧‧保護膠帶捲收輪 222‧‧‧Protection tape reel
223‧‧‧導輪 223‧‧‧guide wheel
230‧‧‧感測器 230‧‧‧ sensor
231‧‧‧感測區 231‧‧‧Sensing area
240‧‧‧第一捲輪 240‧‧‧First reel
250‧‧‧第二捲輪 250‧‧‧second reel
260‧‧‧廢料捲收輪 260‧‧‧ scrap reel
300‧‧‧捲輪 300‧‧‧Reel
A‧‧‧滾輪 A‧‧‧Roller
B‧‧‧彎折 B‧‧‧Bend
Claims (27)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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TW105111284A TWI576978B (en) | 2016-04-12 | 2016-04-12 | Apparatus and method for dicing flexible substrate and tearing protection tape |
CN201610317668.8A CN107293506B (en) | 2016-04-12 | 2016-05-13 | Machine and method for cutting flexible substrate and tearing protective tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW105111284A TWI576978B (en) | 2016-04-12 | 2016-04-12 | Apparatus and method for dicing flexible substrate and tearing protection tape |
Publications (2)
Publication Number | Publication Date |
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TWI576978B true TWI576978B (en) | 2017-04-01 |
TW201737448A TW201737448A (en) | 2017-10-16 |
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TW105111284A TWI576978B (en) | 2016-04-12 | 2016-04-12 | Apparatus and method for dicing flexible substrate and tearing protection tape |
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TW (1) | TWI576978B (en) |
Citations (1)
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TW201125018A (en) * | 2009-09-29 | 2011-07-16 | Nitto Denko Corp | Method and apparatus for separating protective tape |
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US20060162852A1 (en) * | 2002-08-05 | 2006-07-27 | Peter Gertsch | Method, system and device for preparing a winding reel for changing reels in a flying manner, detecting a web of material, and applying a double-sided adhesive tape to a surface |
JP5317280B2 (en) * | 2009-07-16 | 2013-10-16 | 株式会社タカトリ | Protective tape peeling device |
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2016
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TW201125018A (en) * | 2009-09-29 | 2011-07-16 | Nitto Denko Corp | Method and apparatus for separating protective tape |
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TW201737448A (en) | 2017-10-16 |
CN107293506A (en) | 2017-10-24 |
CN107293506B (en) | 2019-05-17 |
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