JP5313626B2 - 電子部品内蔵基板及びその製造方法 - Google Patents

電子部品内蔵基板及びその製造方法 Download PDF

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Publication number
JP5313626B2
JP5313626B2 JP2008275290A JP2008275290A JP5313626B2 JP 5313626 B2 JP5313626 B2 JP 5313626B2 JP 2008275290 A JP2008275290 A JP 2008275290A JP 2008275290 A JP2008275290 A JP 2008275290A JP 5313626 B2 JP5313626 B2 JP 5313626B2
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Prior art keywords
layer
electronic component
wiring
semiconductor chip
insulating layer
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Japanese (ja)
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JP2010103398A5 (enExample
JP2010103398A (ja
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昌宏 春原
秀明 坂口
浩 清水
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008275290A priority Critical patent/JP5313626B2/ja
Priority to US12/605,736 priority patent/US8309860B2/en
Publication of JP2010103398A publication Critical patent/JP2010103398A/ja
Publication of JP2010103398A5 publication Critical patent/JP2010103398A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
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    • H—ELECTRICITY
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2203/14—Related to the order of processing steps
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    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008275290A 2008-10-27 2008-10-27 電子部品内蔵基板及びその製造方法 Active JP5313626B2 (ja)

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JP2008275290A JP5313626B2 (ja) 2008-10-27 2008-10-27 電子部品内蔵基板及びその製造方法
US12/605,736 US8309860B2 (en) 2008-10-27 2009-10-26 Electronic component built-in substrate and method of manufacturing the same

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JP2008275290A JP5313626B2 (ja) 2008-10-27 2008-10-27 電子部品内蔵基板及びその製造方法

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JP2010103398A JP2010103398A (ja) 2010-05-06
JP2010103398A5 JP2010103398A5 (enExample) 2011-09-22
JP5313626B2 true JP5313626B2 (ja) 2013-10-09

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