JP5295593B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5295593B2 JP5295593B2 JP2008064806A JP2008064806A JP5295593B2 JP 5295593 B2 JP5295593 B2 JP 5295593B2 JP 2008064806 A JP2008064806 A JP 2008064806A JP 2008064806 A JP2008064806 A JP 2008064806A JP 5295593 B2 JP5295593 B2 JP 5295593B2
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- 239000004065 semiconductor Substances 0.000 title claims description 35
- 238000005530 etching Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 13
- 230000005669 field effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 88
- 238000004519 manufacturing process Methods 0.000 description 17
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 16
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/802—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with heterojunction gate, e.g. transistors with semiconductor layer acting as gate insulating layer, MIS-like transistors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
Description
この半導体装置は、HBTが形成された領域(HBT領域)とHFETが形成された領域(HFET領域)とを有する。HFET領域及びHFET領域は、注入素子分離領域720で電気的に分離されている。
102、402 GaAs/AlGaAs超格子層
103、403 AlGaAs障壁層
104、404 InGaAsチャネル層
105、405 GaAsキャップ層
106 InGaPエッチングストッパ領域
107 サブコレクタ層
107a GaAs外部サブコレクタ領域
107b GaAs内部サブコレクタ領域
108、408 GaAsコレクタ層
109、409 GaAsベース層
110、410 InGaPエミッタ層
111、411 GaAsエミッタキャップ層
112、412 InGaAsエミッタコンタクト層
201 エミッタ電極
202 ベース電極
203 コレクタ電極
304 ソース電極
305 ドレイン電極
306 ゲート電極
406、506 電子供給層
407 GaAsサブコレクタ層
720、820 注入素子分離領域
800 HBT領域
810 HFET領域
830 コレクタ部
840 コレクタ外部
Claims (4)
- 同一の半導体基板上に形成されたヘテロ接合バイポーラトランジスタとヘテロ接合電界効果トランジスタとを備える半導体装置であって、
前記ヘテロ接合バイポーラトランジスタは、順次積層されたサブコレクタ層、コレクタ層、ベース層及びエミッタ層を有し、
前記サブコレクタ層は、外部サブコレクタ領域と、前記外部サブコレクタ領域上に位置する内部サブコレクタ領域とを有し、
前記外部サブコレクタ領域上には、前記ベース層、前記エミッタ層、前記コレクタ層及び前記内部サブコレクタ領域から構成されるメサ状のコレクタ部と、コレクタ電極とが離間して形成され、
前記ヘテロ接合電界効果トランジスタは、前記外部サブコレクタ領域の一部により構成されたキャップ層と、前記キャップ層上に形成されたソース電極及びドレイン電極とを有し、
前記内部サブコレクタ領域の厚さは、300nm以上であることを特徴とする半導体装置。 - 同一の半導体基板上に形成されたヘテロ接合バイポーラトランジスタとヘテロ接合電界効果トランジスタとを備える半導体装置であって、
前記ヘテロ接合バイポーラトランジスタは、順次積層されたサブコレクタ層、コレクタ層、ベース層及びエミッタ層を有し、
前記サブコレクタ層は、外部サブコレクタ領域と、前記外部サブコレクタ領域上に位置する内部サブコレクタ領域とを有し、
前記外部サブコレクタ領域上には、前記ベース層、前記エミッタ層、前記コレクタ層及び前記内部サブコレクタ領域から構成されるメサ状のコレクタ部と、コレクタ電極とが離間して形成され、
前記ヘテロ接合電界効果トランジスタは、前記外部サブコレクタ領域の一部により構成されたキャップ層と、前記キャップ層上に形成されたソース電極及びドレイン電極とを有し、
前記外部サブコレクタ領域の厚さは、50nm以上300nm以下であることを特徴とする半導体装置。 - 前記コレクタ電極は、前記コレクタ部から1.5μm以下の距離をおいて離間している
ことを特徴とする請求項1または2に記載の半導体装置。 - 前記サブコレクタ層は、さらに、前記内部サブコレクタ領域と前記外部サブコレクタ領域との間に挿入され、前記内部サブコレクタ領域及び前記外部サブコレクタ領域と異なる材料から構成されるエッチングストッパ領域を有する
ことを特徴とする請求項1〜3のいずれか1項に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008064806A JP5295593B2 (ja) | 2008-03-13 | 2008-03-13 | 半導体装置 |
US12/400,376 US8017975B2 (en) | 2008-03-13 | 2009-03-09 | Semiconductor device |
CN200910126300A CN101533841A (zh) | 2008-03-13 | 2009-03-11 | 半导体器件及其制造方法 |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008064806A JP5295593B2 (ja) | 2008-03-13 | 2008-03-13 | 半導体装置 |
Publications (2)
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JP2009224407A JP2009224407A (ja) | 2009-10-01 |
JP5295593B2 true JP5295593B2 (ja) | 2013-09-18 |
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JP2008064806A Active JP5295593B2 (ja) | 2008-03-13 | 2008-03-13 | 半導体装置 |
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US (1) | US8017975B2 (ja) |
JP (1) | JP5295593B2 (ja) |
CN (1) | CN101533841A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010199558A (ja) * | 2009-01-27 | 2010-09-09 | Panasonic Corp | 半導体装置およびその製造方法 |
JP2010192833A (ja) * | 2009-02-20 | 2010-09-02 | Panasonic Corp | 半導体装置 |
JP2010206020A (ja) * | 2009-03-04 | 2010-09-16 | Panasonic Corp | 半導体装置 |
JP2010251522A (ja) * | 2009-04-15 | 2010-11-04 | Panasonic Corp | 半導体装置及びその製造方法 |
JP5613474B2 (ja) * | 2010-06-24 | 2014-10-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN102842578A (zh) * | 2011-06-23 | 2012-12-26 | 寇平公司 | 双极高电子迁移率晶体管及其形成方法 |
CN103489859B (zh) * | 2012-06-13 | 2016-03-30 | 稳懋半导体股份有限公司 | 化合物半导体组件晶圆整合结构 |
TWI512905B (zh) * | 2012-06-13 | 2015-12-11 | Win Semiconductors Corp | 化合物半導體元件晶圓整合結構 |
TWI536508B (zh) * | 2012-08-24 | 2016-06-01 | Ngk Spark Plug Co | Wiring board |
WO2018121369A1 (zh) * | 2016-12-26 | 2018-07-05 | 厦门市三安集成电路有限公司 | 一种化合物半导体晶体管及具有该晶体管的功率放大器 |
CN110610991A (zh) * | 2019-09-27 | 2019-12-24 | 厦门市三安集成电路有限公司 | 外延结构和低导通电压晶体管 |
CN113130478A (zh) * | 2021-04-13 | 2021-07-16 | 厦门市三安集成电路有限公司 | 一种射频芯片及制备方法 |
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JPH0812910B2 (ja) * | 1988-09-05 | 1996-02-07 | 日本電気株式会社 | 化合物半導体装置およびその製造方法 |
JP3323544B2 (ja) * | 1992-08-21 | 2002-09-09 | 株式会社日立製作所 | 半導体装置 |
US5250826A (en) * | 1992-09-23 | 1993-10-05 | Rockwell International Corporation | Planar HBT-FET Device |
JP2000058663A (ja) * | 1998-08-11 | 2000-02-25 | Mitsubishi Electric Corp | 集積型バイアス回路素子 |
JP2001177060A (ja) * | 1999-12-14 | 2001-06-29 | Nec Corp | モノリシック集積回路装置及びその製造方法 |
JP2002261271A (ja) * | 2001-03-01 | 2002-09-13 | Nec Corp | 半導体装置及びその製造方法 |
JP2005032897A (ja) * | 2003-07-10 | 2005-02-03 | Hitachi Cable Ltd | ヘテロ接合バイポーラトランジスタ |
US6919590B2 (en) * | 2003-08-29 | 2005-07-19 | Motorola, Inc. | Heterojunction bipolar transistor with monolithically integrated junction field effect transistor and method of manufacturing same |
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JP2006237388A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 半導体集積回路及び半導体集積回路の制御方法及び信号伝送回路 |
JP4769535B2 (ja) * | 2005-10-06 | 2011-09-07 | 富士フイルム株式会社 | 固体撮像素子 |
JP2007173624A (ja) * | 2005-12-22 | 2007-07-05 | Matsushita Electric Ind Co Ltd | ヘテロ接合バイポーラトランジスタ及びその製造方法 |
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JP5313457B2 (ja) * | 2007-03-09 | 2013-10-09 | パナソニック株式会社 | 窒化物半導体装置及びその製造方法 |
JP2008263146A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP4524298B2 (ja) * | 2007-06-04 | 2010-08-11 | パナソニック株式会社 | 半導体装置の製造方法 |
JP2009076694A (ja) * | 2007-09-20 | 2009-04-09 | Panasonic Corp | 窒化物半導体装置およびその製造方法 |
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- 2009-03-09 US US12/400,376 patent/US8017975B2/en active Active
- 2009-03-11 CN CN200910126300A patent/CN101533841A/zh active Pending
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Publication number | Publication date |
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CN101533841A (zh) | 2009-09-16 |
US20090230431A1 (en) | 2009-09-17 |
JP2009224407A (ja) | 2009-10-01 |
US8017975B2 (en) | 2011-09-13 |
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