JP5280945B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5280945B2
JP5280945B2 JP2009146016A JP2009146016A JP5280945B2 JP 5280945 B2 JP5280945 B2 JP 5280945B2 JP 2009146016 A JP2009146016 A JP 2009146016A JP 2009146016 A JP2009146016 A JP 2009146016A JP 5280945 B2 JP5280945 B2 JP 5280945B2
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Japan
Prior art keywords
electrode
reinforcing plate
resin member
insulating
wiring pattern
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JP2009146016A
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English (en)
Japanese (ja)
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JP2011003758A5 (enExample
JP2011003758A (ja
Inventor
孝治 山野
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009146016A priority Critical patent/JP5280945B2/ja
Priority to US12/793,732 priority patent/US8564116B2/en
Publication of JP2011003758A publication Critical patent/JP2011003758A/ja
Publication of JP2011003758A5 publication Critical patent/JP2011003758A5/ja
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    • H10W74/117—
    • H10W70/09—
    • H10W70/614—
    • H10W74/014—
    • H10W70/60—
    • H10W70/611—
    • H10W70/635—
    • H10W72/0198—
    • H10W72/9413—

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009146016A 2009-06-19 2009-06-19 半導体装置及びその製造方法 Active JP5280945B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009146016A JP5280945B2 (ja) 2009-06-19 2009-06-19 半導体装置及びその製造方法
US12/793,732 US8564116B2 (en) 2009-06-19 2010-06-04 Semiconductor device with reinforcement plate and method of forming same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009146016A JP5280945B2 (ja) 2009-06-19 2009-06-19 半導体装置及びその製造方法

Publications (3)

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JP2011003758A JP2011003758A (ja) 2011-01-06
JP2011003758A5 JP2011003758A5 (enExample) 2012-07-19
JP5280945B2 true JP5280945B2 (ja) 2013-09-04

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JP2009146016A Active JP5280945B2 (ja) 2009-06-19 2009-06-19 半導体装置及びその製造方法

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JP (1) JP5280945B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5644242B2 (ja) * 2009-09-09 2014-12-24 大日本印刷株式会社 貫通電極基板及びその製造方法
JP2012134270A (ja) * 2010-12-21 2012-07-12 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2013004576A (ja) * 2011-06-13 2013-01-07 Shinko Electric Ind Co Ltd 半導体装置
JP5357241B2 (ja) * 2011-08-10 2013-12-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
US8780576B2 (en) * 2011-09-14 2014-07-15 Invensas Corporation Low CTE interposer
JP6062254B2 (ja) * 2013-01-15 2017-01-18 株式会社ディスコ ウエーハの加工方法
US9685414B2 (en) 2013-06-26 2017-06-20 Intel Corporation Package assembly for embedded die and associated techniques and configurations
KR101862004B1 (ko) * 2016-02-24 2018-05-29 주식회사 에스에프에이반도체 임베디드 몰드형 코어리스 기판 제조방법
WO2018097410A1 (ko) * 2016-11-28 2018-05-31 주식회사 네패스 신뢰성을 가지는 반도체 패키지 및 이의 제조방법
KR20190075647A (ko) * 2017-12-21 2019-07-01 삼성전자주식회사 팬-아웃 반도체 패키지
KR102840201B1 (ko) 2020-03-02 2025-07-31 삼성전자주식회사 반도체 패키지
CN114582828B (zh) * 2020-11-30 2025-02-07 华为技术有限公司 封装基板及通信设备
US12394720B2 (en) * 2022-08-16 2025-08-19 Taiwan Semiconductor Manufacturing Company Limited Semiconductor package including reinforcement structure and methods of forming the same
WO2024047872A1 (ja) * 2022-09-02 2024-03-07 株式会社レゾナック 電子部品装置を製造する方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020629A (en) * 1998-06-05 2000-02-01 Micron Technology, Inc. Stacked semiconductor package and method of fabrication
JP3792445B2 (ja) * 1999-03-30 2006-07-05 日本特殊陶業株式会社 コンデンサ付属配線基板
US6271469B1 (en) 1999-11-12 2001-08-07 Intel Corporation Direct build-up layer on an encapsulated die package
JP4361670B2 (ja) 2000-08-02 2009-11-11 富士通マイクロエレクトロニクス株式会社 半導体素子積層体、半導体素子積層体の製造方法、及び半導体装置
JP3861669B2 (ja) * 2001-11-22 2006-12-20 ソニー株式会社 マルチチップ回路モジュールの製造方法
JP4418907B2 (ja) 2003-07-30 2010-02-24 学校法人東京電機大学 限流器
JP4214969B2 (ja) * 2004-08-16 2009-01-28 沖電気工業株式会社 半導体装置の製造方法
US8101868B2 (en) * 2005-10-14 2012-01-24 Ibiden Co., Ltd. Multilayered printed circuit board and method for manufacturing the same
KR100851072B1 (ko) * 2007-03-02 2008-08-12 삼성전기주식회사 전자 패키지 및 그 제조방법
TWI328423B (en) * 2007-09-14 2010-08-01 Unimicron Technology Corp Circuit board structure having heat-dissipating structure

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US8564116B2 (en) 2013-10-22
JP2011003758A (ja) 2011-01-06
US20100320594A1 (en) 2010-12-23

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