JP5248860B2 - 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板 - Google Patents
両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板 Download PDFInfo
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- JP5248860B2 JP5248860B2 JP2007541252A JP2007541252A JP5248860B2 JP 5248860 B2 JP5248860 B2 JP 5248860B2 JP 2007541252 A JP2007541252 A JP 2007541252A JP 2007541252 A JP2007541252 A JP 2007541252A JP 5248860 B2 JP5248860 B2 JP 5248860B2
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- epoxy resin
- block
- oxide
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- block copolymer
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- VXNZUUAINFGPBY-UHFFFAOYSA-N ethyl ethylene Natural products CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
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- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62661104P | 2004-11-10 | 2004-11-10 | |
| US60/626,611 | 2004-11-10 | ||
| PCT/US2005/039963 WO2006052727A1 (en) | 2004-11-10 | 2005-11-02 | Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008519886A JP2008519886A (ja) | 2008-06-12 |
| JP2008519886A5 JP2008519886A5 (https=) | 2008-12-18 |
| JP5248860B2 true JP5248860B2 (ja) | 2013-07-31 |
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| JP2007541252A Expired - Fee Related JP5248860B2 (ja) | 2004-11-10 | 2005-11-02 | 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板 |
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| US (1) | US7923073B2 (https=) |
| EP (1) | EP1814948B1 (https=) |
| JP (1) | JP5248860B2 (https=) |
| KR (1) | KR101227201B1 (https=) |
| CN (1) | CN101056933B (https=) |
| AT (1) | ATE453688T1 (https=) |
| BR (1) | BRPI0516702A (https=) |
| CA (1) | CA2582360A1 (https=) |
| DE (1) | DE602005018680D1 (https=) |
| ES (1) | ES2337598T3 (https=) |
| MX (1) | MX2007005597A (https=) |
| NO (1) | NO20071727L (https=) |
| RU (1) | RU2395545C2 (https=) |
| TW (1) | TWI400296B (https=) |
| WO (1) | WO2006052727A1 (https=) |
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| KR101129115B1 (ko) * | 2004-04-02 | 2012-03-23 | 리전츠 오브 더 유니버시티 오브 미네소타 | 양친매성 블럭 공중합체 강인화 열경화성 수지 |
| KR101226377B1 (ko) * | 2004-11-10 | 2013-01-24 | 다우 글로벌 테크놀로지스 엘엘씨 | 양친매성 블록 공중합체-강인화된 에폭시 수지 및 그로부터제조된 분말 코팅 |
| JP4634856B2 (ja) * | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
| US9096790B2 (en) | 2007-03-22 | 2015-08-04 | Hexion Inc. | Low temperature coated particles comprising a curable liquid and a reactive powder for use as proppants or in gravel packs, methods for making and using the same |
| JP5336485B2 (ja) | 2007-08-02 | 2013-11-06 | ダウ グローバル テクノロジーズ エルエルシー | 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー |
| US8492482B2 (en) * | 2007-12-10 | 2013-07-23 | Arkema Inc. | Acrylic-based rubber modified thermoset composition |
| JP2011509339A (ja) | 2008-01-08 | 2011-03-24 | ダウ グローバル テクノロジーズ エルエルシー | 複合材料用の高Ｔｇエポキシ系 |
| KR20160007668A (ko) | 2008-04-14 | 2016-01-20 | 블루 큐브 아이피 엘엘씨 | 분말 피복 분야에 유용한 에폭시-이미다졸 촉매 |
| EP2110397A1 (de) | 2008-04-16 | 2009-10-21 | Sika Technology AG | Auf amphiphilen Block-Copolymer basierendes Polyurethan-Polymer und dessen Verwendung als Schlagzähigkeitsmodifikator |
| JP2011521151A (ja) * | 2008-05-16 | 2011-07-21 | ダウ グローバル テクノロジーズ エル エルエルシー | 風車プロペラ羽根及びその製造方法 |
| EP2128182A1 (de) | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
| ATE461953T1 (de) | 2008-07-17 | 2010-04-15 | Sika Technology Ag | Haftvermittlerverbindungen für beölten stahl |
| CN102099402B (zh) * | 2008-07-17 | 2014-06-25 | 陶氏环球技术公司 | 具有改善的韧性的结构复合材料 |
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| EP2182025B1 (de) | 2008-10-31 | 2010-10-06 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzungen einsetzbar als Rohbauklebstoff oder Strukturschaum |
| TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
| JP2012518707A (ja) | 2009-02-24 | 2012-08-16 | ダウ グローバル テクノロジーズ エルエルシー | 硬化性エポキシ樹脂組成物及びその硬化体生成物 |
| BRPI0924000B1 (pt) * | 2009-03-09 | 2019-08-06 | Dow Global Technologies Llc | Composição termofixável, produto termofixo e processo para preparar uma composição termofixável |
| WO2010138346A1 (en) | 2009-05-27 | 2010-12-02 | Dow Global Technologies Inc. | Polymeric glycidyl ethers reactive diluents |
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| BR112012013526A2 (pt) | 2009-12-09 | 2015-09-15 | Dow Global Technologies Llc | composição de resina de dióxido de divinilareno hidrolisada, composição de resina de dióxido de divinilareno hidrolisada curável, processo para hidrolisar uma resina epóxi de divinilareno e processo para preparar uma composição de resina de dióxido de divinilareno hidrolisada curável |
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| EP2365011A1 (de) | 2010-03-02 | 2011-09-14 | Sika Technology AG | Aminogruppen - terminierter Schlagzähigkeitsmodifikator und dessen Verwendungen in Epoxidharzzusammensetzungen |
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-
2005
- 2005-11-02 RU RU2007121650/04A patent/RU2395545C2/ru not_active IP Right Cessation
- 2005-11-02 EP EP05818062A patent/EP1814948B1/en not_active Expired - Lifetime
- 2005-11-02 KR KR1020077010527A patent/KR101227201B1/ko not_active Expired - Fee Related
- 2005-11-02 MX MX2007005597A patent/MX2007005597A/es active IP Right Grant
- 2005-11-02 WO PCT/US2005/039963 patent/WO2006052727A1/en not_active Ceased
- 2005-11-02 JP JP2007541252A patent/JP5248860B2/ja not_active Expired - Fee Related
- 2005-11-02 DE DE602005018680T patent/DE602005018680D1/de not_active Expired - Lifetime
- 2005-11-02 CA CA002582360A patent/CA2582360A1/en not_active Abandoned
- 2005-11-02 CN CN2005800382698A patent/CN101056933B/zh not_active Expired - Fee Related
- 2005-11-02 US US11/663,802 patent/US7923073B2/en not_active Expired - Fee Related
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- 2005-11-02 BR BRPI0516702-7A patent/BRPI0516702A/pt not_active IP Right Cessation
- 2005-11-02 AT AT05818062T patent/ATE453688T1/de active
- 2005-11-09 TW TW094139243A patent/TWI400296B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| NO20071727L (no) | 2007-08-08 |
| KR101227201B1 (ko) | 2013-01-28 |
| EP1814948A1 (en) | 2007-08-08 |
| HK1112930A1 (en) | 2008-09-19 |
| CN101056933A (zh) | 2007-10-17 |
| BRPI0516702A (pt) | 2008-09-16 |
| RU2007121650A (ru) | 2008-12-20 |
| MX2007005597A (es) | 2007-05-23 |
| US20080213489A1 (en) | 2008-09-04 |
| RU2395545C2 (ru) | 2010-07-27 |
| CA2582360A1 (en) | 2006-05-18 |
| EP1814948B1 (en) | 2009-12-30 |
| JP2008519886A (ja) | 2008-06-12 |
| ES2337598T3 (es) | 2010-04-27 |
| WO2006052727A1 (en) | 2006-05-18 |
| CN101056933B (zh) | 2012-11-21 |
| DE602005018680D1 (de) | 2010-02-11 |
| KR20070084111A (ko) | 2007-08-24 |
| US7923073B2 (en) | 2011-04-12 |
| ATE453688T1 (de) | 2010-01-15 |
| TWI400296B (zh) | 2013-07-01 |
| TW200624500A (en) | 2006-07-16 |
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