JP5247396B2 - Ｍｅｍｓ用感光性樹脂組成物及びその硬化物 - Google Patents

Ｍｅｍｓ用感光性樹脂組成物及びその硬化物 Download PDF

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Publication number
JP5247396B2
JP5247396B2 JP2008310573A JP2008310573A JP5247396B2 JP 5247396 B2 JP5247396 B2 JP 5247396B2 JP 2008310573 A JP2008310573 A JP 2008310573A JP 2008310573 A JP2008310573 A JP 2008310573A JP 5247396 B2 JP5247396 B2 JP 5247396B2
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Prior art keywords
resin composition
formula
epoxy
photosensitive resin
epoxy resin
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JP2008310573A
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English (en)
Japanese (ja)
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JP2010032991A (ja
Inventor
那央 本田
亮 酒井
尚子 今泉
禎之 小野
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2008310573A priority Critical patent/JP5247396B2/ja
Priority to KR1020107029706A priority patent/KR101665147B1/ko
Priority to PCT/JP2009/062029 priority patent/WO2010001919A1/ja
Priority to TW098122426A priority patent/TWI483066B/zh
Publication of JP2010032991A publication Critical patent/JP2010032991A/ja
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Publication of JP5247396B2 publication Critical patent/JP5247396B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Silicon Polymers (AREA)
JP2008310573A 2008-07-02 2008-12-05 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物 Active JP5247396B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008310573A JP5247396B2 (ja) 2008-07-02 2008-12-05 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
KR1020107029706A KR101665147B1 (ko) 2008-07-02 2009-07-01 Ｍｅｍｓ용 감광성 수지 조성물 및 그 경화물
PCT/JP2009/062029 WO2010001919A1 (ja) 2008-07-02 2009-07-01 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
TW098122426A TWI483066B (zh) 2008-07-02 2009-07-02 Ｍｅｍｓ用感光性樹脂組成物及其硬化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008173482 2008-07-02
JP2008173482 2008-07-02
JP2008310573A JP5247396B2 (ja) 2008-07-02 2008-12-05 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JP2010032991A JP2010032991A (ja) 2010-02-12
JP5247396B2 true JP5247396B2 (ja) 2013-07-24

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JP2008310573A Active JP5247396B2 (ja) 2008-07-02 2008-12-05 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物

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Country Link
JP (1) JP5247396B2 (zh)
KR (1) KR101665147B1 (zh)
TW (1) TWI483066B (zh)
WO (1) WO2010001919A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7058646B2 (ja) 2016-11-03 2022-04-22 メビオン・メディカル・システムズ・インコーポレーテッド 超電導コイル構成

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JP4617387B2 (ja) * 2009-06-17 2011-01-26 キヤノン株式会社 微細構造体の製造方法
KR101833078B1 (ko) * 2009-12-17 2018-02-27 디에스엠 아이피 어셋츠 비.브이. 적층식 제작을 위한 발광 다이오드 경화성 액체 수지 조성물
JP5473645B2 (ja) * 2010-02-05 2014-04-16 キヤノン株式会社 感光性樹脂組成物及び液体吐出ヘッド
US8980968B2 (en) 2010-02-05 2015-03-17 Canon Kabushiki Kaisha Photosensitive resin composition, method for producing structure, and liquid discharge head
US9061499B2 (en) 2010-02-05 2015-06-23 Canon Kabushiki Kaisha Negative photosensitive resin composition, pattern formation method, and liquid discharge head
US8865392B2 (en) 2010-07-14 2014-10-21 Nippon Kayaku Kabushiki Kaisha Photosensitive resin composition and cured product thereof
JP5691987B2 (ja) * 2010-10-13 2015-04-01 信越化学工業株式会社 光硬化性樹脂組成物、そのドライフィルム、パターン形成方法及び電気・電子部品保護用皮膜
JP5697406B2 (ja) * 2010-11-09 2015-04-08 キヤノン株式会社 親水被膜の形成方法および親水被膜、ならびにインクジェット記録ヘッドの製造方法およびインクジェット記録ヘッド
JP5653181B2 (ja) * 2010-11-09 2015-01-14 キヤノン株式会社 親水被膜の形成方法および親水被膜、ならびにインクジェット記録ヘッドの製造方法およびインクジェット記録ヘッド
CN103221451B (zh) 2010-11-17 2015-11-25 日本化药株式会社 透明片材用环氧树脂组合物及其固化物
JP5749631B2 (ja) * 2010-12-07 2015-07-15 東京応化工業株式会社 厚膜用化学増幅型ポジ型ホトレジスト組成物及び厚膜レジストパターンの製造方法
JP5787720B2 (ja) * 2010-12-16 2015-09-30 キヤノン株式会社 感光性ネガ型樹脂組成物
EP2481703B1 (en) * 2011-01-27 2020-07-01 Sensirion AG Sensor protection
JP5885269B2 (ja) * 2011-06-20 2016-03-15 日本化薬株式会社 ネガ型感光性樹脂組成物及びその硬化物
WO2013036502A1 (en) * 2011-09-07 2013-03-14 Microchem Corp. Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates
JP6120574B2 (ja) 2012-01-31 2017-04-26 キヤノン株式会社 感光性ネガ型樹脂組成物、微細構造体、微細構造体の製造方法及び液体吐出ヘッド
US11635688B2 (en) 2012-03-08 2023-04-25 Kayaku Advanced Materials, Inc. Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates
JP5901070B2 (ja) 2012-10-26 2016-04-06 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5967824B2 (ja) 2012-10-26 2016-08-10 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP5939964B2 (ja) 2012-11-22 2016-06-29 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP6066413B2 (ja) * 2012-11-22 2017-01-25 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物
JP2013178526A (ja) * 2013-04-01 2013-09-09 Hitachi Chemical Co Ltd 中空構造体及びその製造方法
JP6071718B2 (ja) 2013-04-10 2017-02-01 キヤノン株式会社 感光性ネガ型樹脂組成物
JP6357485B2 (ja) * 2013-11-28 2018-07-11 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
JP6461139B2 (ja) * 2014-06-13 2019-01-30 日本化薬株式会社 感光性樹脂組成物、レジスト積層体及びそれらの硬化物（１１）
JP7050411B2 (ja) * 2016-08-31 2022-04-08 東京応化工業株式会社 ネガ型感光性樹脂組成物、感光性レジストフィルム、パターン形成方法、硬化膜、硬化膜の製造方法
TW201913233A (zh) * 2017-09-01 2019-04-01 日商富士軟片股份有限公司 圖案形成方法、抗蝕劑組成物及電子元件的製造方法
CN111406233B (zh) * 2017-12-06 2023-12-26 日本化药株式会社 感光性树脂组合物、干膜抗蚀剂及其硬化物
TW201936688A (zh) * 2018-02-08 2019-09-16 日商日本化藥股份有限公司 感光性樹脂組成物及其硬化物
JP7134825B2 (ja) * 2018-10-05 2022-09-12 キヤノン株式会社 微細構造体の製造方法及び液体吐出ヘッドの製造方法

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JP7058646B2 (ja) 2016-11-03 2022-04-22 メビオン・メディカル・システムズ・インコーポレーテッド 超電導コイル構成

Also Published As

Publication number Publication date
TWI483066B (zh) 2015-05-01
TW201009497A (en) 2010-03-01
KR101665147B1 (ko) 2016-10-11
KR20110019391A (ko) 2011-02-25
WO2010001919A1 (ja) 2010-01-07
JP2010032991A (ja) 2010-02-12

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