JP5787720B2 - 感光性ネガ型樹脂組成物 - Google Patents
感光性ネガ型樹脂組成物 Download PDFInfo
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- JP5787720B2 JP5787720B2 JP2011234930A JP2011234930A JP5787720B2 JP 5787720 B2 JP5787720 B2 JP 5787720B2 JP 2011234930 A JP2011234930 A JP 2011234930A JP 2011234930 A JP2011234930 A JP 2011234930A JP 5787720 B2 JP5787720 B2 JP 5787720B2
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- 239000011342 resin composition Substances 0.000 title claims description 51
- 125000004432 carbon atom Chemical group C* 0.000 claims description 56
- 150000003839 salts Chemical class 0.000 claims description 41
- 150000001450 anions Chemical group 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 21
- 150000001768 cations Chemical group 0.000 claims description 19
- -1 alicyclic hydrocarbon Chemical class 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 17
- 125000003700 epoxy group Chemical group 0.000 claims description 17
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 125000004437 phosphorous atom Chemical group 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 9
- 125000001424 substituent group Chemical group 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 125000004434 sulfur atom Chemical group 0.000 claims description 9
- 229910052787 antimony Inorganic materials 0.000 claims description 8
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 8
- 125000004429 atom Chemical group 0.000 claims description 8
- 239000000470 constituent Substances 0.000 claims description 8
- 238000000206 photolithography Methods 0.000 claims description 8
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 125000001153 fluoro group Chemical group F* 0.000 claims description 7
- 150000002430 hydrocarbons Chemical group 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- 125000005842 heteroatom Chemical group 0.000 claims description 5
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 22
- 239000002253 acid Substances 0.000 description 19
- 125000000217 alkyl group Chemical group 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 11
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- 239000003822 epoxy resin Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 6
- 125000000753 cycloalkyl group Chemical group 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 125000004414 alkyl thio group Chemical group 0.000 description 4
- 125000005110 aryl thio group Chemical group 0.000 description 4
- 125000004104 aryloxy group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000005129 aryl carbonyl group Chemical group 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000010538 cationic polymerization reaction Methods 0.000 description 3
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000006606 n-butoxy group Chemical group 0.000 description 3
- 125000003506 n-propoxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 2
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 2
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 125000005161 aryl oxy carbonyl group Chemical group 0.000 description 2
- 125000005135 aryl sulfinyl group Chemical group 0.000 description 2
- 125000004391 aryl sulfonyl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 2
- 125000004708 n-butylthio group Chemical group C(CCC)S* 0.000 description 2
- 125000004706 n-propylthio group Chemical group C(CC)S* 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 125000005029 naphthylthio group Chemical group C1(=CC=CC2=CC=CC=C12)S* 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- 125000000069 2-butynyl group Chemical group [H]C([H])([H])C#CC([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- 125000003601 C2-C6 alkynyl group Chemical group 0.000 description 1
- PWEGGWYHWAEADX-UHFFFAOYSA-N CC1(C(C(c(cc2)c3cc2Oc(cc2)ccc2[S+](c2ccccc2)c2ccccc2)=O)=CC=CC1)C3=O Chemical compound CC1(C(C(c(cc2)c3cc2Oc(cc2)ccc2[S+](c2ccccc2)c2ccccc2)=O)=CC=CC1)C3=O PWEGGWYHWAEADX-UHFFFAOYSA-N 0.000 description 1
- GBESQVVPAVVWIZ-UHFFFAOYSA-N CCCOc(c(cc1)c2cc1Sc(cc1)ccc1[S+](c1ccccc1)c1ccccc1)c(cccc1)c1c2OCCC Chemical compound CCCOc(c(cc1)c2cc1Sc(cc1)ccc1[S+](c1ccccc1)c1ccccc1)c(cccc1)c1c2OCCC GBESQVVPAVVWIZ-UHFFFAOYSA-N 0.000 description 1
- FDQYKXHWVCGWKN-UHFFFAOYSA-N CCOc(c(cc1)c2cc1SC1C=CC([S+](c3ccccc3)c3ccccc3)=CC1)c(cccc1)c1c2OCC Chemical compound CCOc(c(cc1)c2cc1SC1C=CC([S+](c3ccccc3)c3ccccc3)=CC1)c(cccc1)c1c2OCC FDQYKXHWVCGWKN-UHFFFAOYSA-N 0.000 description 1
- JBUBXVPWPWTNGP-UHFFFAOYSA-N COC(C1C=C2)c3ccccc3C(OC)=C1C=C2Sc1ccc(CCc2ccccc2)cc1 Chemical compound COC(C1C=C2)c3ccccc3C(OC)=C1C=C2Sc1ccc(CCc2ccccc2)cc1 JBUBXVPWPWTNGP-UHFFFAOYSA-N 0.000 description 1
- SIRSBIWRMIETHI-UHFFFAOYSA-N Cc(cc1)ccc1[S+](c1ccc(C)cc1)c(cc1)ccc1Sc(cc1)cc(C(c2c3cccc2)=O)c1C3=O Chemical compound Cc(cc1)ccc1[S+](c1ccc(C)cc1)c(cc1)ccc1Sc(cc1)cc(C(c2c3cccc2)=O)c1C3=O SIRSBIWRMIETHI-UHFFFAOYSA-N 0.000 description 1
- FWYVKNGPRISBOR-UHFFFAOYSA-N Cc(cc1C)cc(C)c1[S+](c1ccccc1)c(cc1)ccc1Sc(cc1)cc(C(c2c3cccc2)=O)c1C3=O Chemical compound Cc(cc1C)cc(C)c1[S+](c1ccccc1)c(cc1)ccc1Sc(cc1)cc(C(c2c3cccc2)=O)c1C3=O FWYVKNGPRISBOR-UHFFFAOYSA-N 0.000 description 1
- 241001024304 Mino Species 0.000 description 1
- AHIDMUFBCXVDDW-UHFFFAOYSA-N O=C(C1C2=CC=CC1)c(cc(cc1)Sc(cc3)ccc3[S+](c3ccccc3)c(cc3)ccc3Sc3ccccc3)c1C2=O Chemical compound O=C(C1C2=CC=CC1)c(cc(cc1)Sc(cc3)ccc3[S+](c3ccccc3)c(cc3)ccc3Sc3ccccc3)c1C2=O AHIDMUFBCXVDDW-UHFFFAOYSA-N 0.000 description 1
- IBZOBAXYFRIZJQ-UHFFFAOYSA-N O=C(c1c2cccc1)c(ccc(Sc(cc1)ccc1[S+](c1ccccc1)c1ccccc1)c1)c1C2=O Chemical compound O=C(c1c2cccc1)c(ccc(Sc(cc1)ccc1[S+](c1ccccc1)c1ccccc1)c1)c1C2=O IBZOBAXYFRIZJQ-UHFFFAOYSA-N 0.000 description 1
- DFBMBMWHSUPDJL-UHFFFAOYSA-N O=C(c1ccccc1C(c1c2)=O)c1ccc2Sc(cc1)ccc1[S+](c1ccccc1)c(cc1)ccc1Sc(cc1)cc(C(c2ccccc22)=O)c1C2=O Chemical compound O=C(c1ccccc1C(c1c2)=O)c1ccc2Sc(cc1)ccc1[S+](c1ccccc1)c(cc1)ccc1Sc(cc1)cc(C(c2ccccc22)=O)c1C2=O DFBMBMWHSUPDJL-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- MBAKFIZHTUAVJN-UHFFFAOYSA-I hexafluoroantimony(1-);hydron Chemical compound F.F[Sb](F)(F)(F)F MBAKFIZHTUAVJN-UHFFFAOYSA-I 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000004043 oxo group Chemical group O=* 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
(a)エポキシ基を有する化合物と、
(b)(b1)で表わされるカチオン部構造および(b2)で表されるアニオン部構造を含有する第1のオニウム塩と、
(c)(c1)で表わされるカチオン部構造および(c2)で表されるアニオン部構造を含有する第2のオニウム塩と、
を含むことを特徴とする感光性ネガ型樹脂組成物である。
本発明の感光性ネガ型樹脂組成物に含まれる各成分について詳細に説明する。
エポキシ基を有する化合物(以下、(a)成分とも略す)としては特に限定されないが、エポキシ重合が可能な化合物であって、エポキシ基を1分子中に複数有する多官能エポキシ樹脂化合物が好ましい。このような多官能エポキシ樹脂としては、例えば、多官能脂環型エポキシ樹脂、多官能フェノール・ノボラック型エポキシ樹脂、多官能オルソクレゾールノボラック型エポキシ樹脂、多官能トリフェニル型ノボラック型エポキシ樹脂、多官能ビスフェノールAノボラック型エポキシ樹脂等が挙げられる。これらのうち、多官能ビスフェノールAノボラック型エポキシ樹脂、多官能脂環型エポキシ樹脂又は多官能フェノール・ノボラック型エポキシ樹脂が好ましく用いられる。その官能性は5官能以上が好ましく、例えば、ジャパンエポキシレジン社製「エピコート157S70」や、大日本インキ化学工業株式会社製の「エピクロンN−865」、ダイセル化学工業株式会社製「EHPE 3150」が市販品として入手でき、より好ましく用いられる。
また、エポキシ基を有する化合物の含有量は、全固形分中、40質量%以上であることが好ましく、60質量%以上であることがより好ましく、65質量%以上であることがさらに好ましい。また、99.9質量%以下であることが好ましく、99.2質量%以下であることがより好ましい。
第1のオニウム塩(以下、(b)成分とも略す)は、(b1)で表わされるカチオン部構造と、(b2)で表されるアニオン部構造との1対1の組み合わせからなる。
第2のオニウム塩(以下、(c)成分とも略す)は、それぞれ特定の構造である(c1)で表わされるカチオン部構造と、(c2)で表されるアニオン部構造との1対1の組み合わせからなる。
本発明による感光性ネガ型樹脂組成物を用いて、例えば、液体吐出ヘッドを形成することができる。液体吐出ヘッドとしては、特に限定されるものではないが、一例として、インクジェット記録ヘッドが挙げられる。
<製法1>
まず、図3(a)に示すように、エネルギー吐出素子2を有する基板1を用意する。
まず、図4(a)に示すように、基板1上に、溶解可能な樹脂組成物を塗布し、インク流路パターン3bを形成する(図4(a))。
表1に記載の配合に従って、(a)成分、(b)成分、(c)成分を混合し、さらに、溶剤としてのプロピレングリコールモノメチルエーテルを(a)成分100質量部に対して80質量部を混合し、感光性樹脂組成物を得た。表1において、単位は質量部を表す。
図5に示すテーパ角度9を、図1や図2のA−B断面図の方向で、SEM観察することから断面写真を取得し算出した。測定は同じパターン中の5つの吐出口について1点ずつ計測した。得られた5点のテーパ角度の平均値と、該平均値から最も離れている点の値との差分を算出し、算出した差分を平均値で割り、それに100を掛けることで得られた値(%)を、テーパ角度ばらつきと定義した。
(a)成分、(b)成分及び(c)成分を表1に記載の配合に従って用いた以外は、実施例1と同様にして感光性樹脂組成物を調製し、評価した。
(a)成分、(b)成分、(c)成分及び(d)成分を表1に記載の配合に従って用いた以外は、実施例1と同様にして感光性樹脂組成物を調製し、評価した。(d)成分は、カチオン部構造が下記化合物で表されるc1−21であり、アニオン部構造がb−23である。
(a)成分、(b)成分、(c)成分及び増感剤を表1に記載の配合に従って用いた以外は、実施例1と同様にして感光性樹脂組成物を調製し、評価した。増感剤e−1としては、1−ナフトールを用いた。
(a)成分及び(b)成分を表1に記載の配合に従って用いた以外は、実施例1と同様にして感光性樹脂組成物を調製し、評価した。
尚、実施例1〜9、比較例3は、いずれも「第1のオニウム塩のモル数>前記第2のオニウム塩のモル数」の関係を満たす。
(a−2):JER157S70 (ジャパンエポキシレジン社製 商品名)
(a−3):EHPE 3150 (ダイセル化学工業株式会社製 商品名)
2 エネルギー発生素子
3a 溶解可能な樹脂層
3b インク流路パターン
3c インク流路
4 インク流路形成層
5 吐出口
6 インク供給口
7 表面へこみ
8a 第一の吐出口パターン
8b 第二の吐出口パターン
9 テーパ角度
10 第一のフォトマスク
11 第二のフォトマスク
Claims (11)
- (a)エポキシ基を有する化合物と、
(b)(b1)で表わされるカチオン部構造および(b2)で表されるアニオン部構造を含有する第1のオニウム塩と、
(c)(c1)で表わされるカチオン部構造および(c2)で表されるアニオン部構造を含有する第2のオニウム塩と、
を含むことを特徴とする感光性ネガ型樹脂組成物。
- 前記第1のオニウム塩のモル数>前記第2のオニウム塩のモル数、の関係を満たす請求項1に記載の感光性ネガ型樹脂組成物。
- 前記(b)成分は、少なくともi線に対する感光性を有する請求項1または2に記載の感光性ネガ型樹脂組成物。
- R1からR3のうち少なくとも1つは、環状カルボニル構造を含む請求項1乃至3のいずれかに記載の感光性ネガ型樹脂組成物。
- R8は、芳香族炭化水素又は脂環炭化水素を含む請求項1乃至4のいずれかに記載の感光性ネガ型樹脂組成物。
- Zが硫黄原子である請求項1乃至5のいずれかに記載の感光性ネガ型樹脂組成物。
- 第1のオニウム塩のモル数×0.7>第2のオニウム塩のモル数>第1のオニウム塩のモル数×0.02の関係を満たす請求項2に記載の感光性ネガ型樹脂組成物。
- Xがリン原子である請求項1乃至7のいずれかに記載の感光性ネガ型樹脂組成物。
- 基板上に形成される微細構造体であって、請求項1乃至8のいずれかに記載の感光性ネガ型樹脂組成物の硬化物であることを特徴とする微細構造体。
- 請求項9に記載の微細構造体により流路形成層が構成されている液体吐出ヘッド。
- (1)請求項1乃至8のいずれかに記載の感光性ネガ型樹脂組成物を基板上に配置する工程と、
(2)前記感光性ネガ型樹脂組成物をi線を用いたフォトリソグラフィーによりパターニング処理する工程と、
を含むことを特徴とする微細構造体の形成方法。
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