JP5241829B2 - 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置 - Google Patents

基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置 Download PDF

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JP5241829B2
JP5241829B2 JP2010513140A JP2010513140A JP5241829B2 JP 5241829 B2 JP5241829 B2 JP 5241829B2 JP 2010513140 A JP2010513140 A JP 2010513140A JP 2010513140 A JP2010513140 A JP 2010513140A JP 5241829 B2 JP5241829 B2 JP 5241829B2
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substrate
substrate table
action
stress
pin
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Japanese (ja)
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JP2010531541A (ja
Inventor
ジャープ クイト，ジャン
スニデルズ，ニーク
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エーエスエムエル ネザーランズ ビー．ブイ．
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Priority claimed from US11/812,818 external-priority patent/US20080316461A1/en
Priority claimed from US11/896,600 external-priority patent/US8446566B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277—Electrolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2010513140A 2007-06-21 2008-06-20 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置 Active JP5241829B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US11/812,818 2007-06-21
US11/812,818 US20080316461A1 (en) 2007-06-21 2007-06-21 Lithographic apparatus and device manufacturing method
US93538107P 2007-08-09 2007-08-09
US60/935,381 2007-08-09
US11/896,600 2007-09-04
US11/896,600 US8446566B2 (en) 2007-09-04 2007-09-04 Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method
US96057807P 2007-10-04 2007-10-04
US60/960,578 2007-10-04
PCT/NL2008/050412 WO2008156367A1 (en) 2007-06-21 2008-06-20 Method of loading a substrate on a substrate table, device manufacturing method, computer program, data carrier and apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012180067A Division JP5600710B2 (ja) 2007-06-21 2012-08-15 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置

Publications (2)

Publication Number Publication Date
JP2010531541A JP2010531541A (ja) 2010-09-24
JP5241829B2 true JP5241829B2 (ja) 2013-07-17

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JP2010513140A Active JP5241829B2 (ja) 2007-06-21 2008-06-20 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置
JP2010513139A Active JP5058337B2 (ja) 2007-06-21 2008-06-20 クランプデバイス、リソグラフィ装置およびオブジェクトロード方法
JP2012180067A Active JP5600710B2 (ja) 2007-06-21 2012-08-15 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2010513139A Active JP5058337B2 (ja) 2007-06-21 2008-06-20 クランプデバイス、リソグラフィ装置およびオブジェクトロード方法
JP2012180067A Active JP5600710B2 (ja) 2007-06-21 2012-08-15 基板を基板テーブル上にロードする方法、デバイス製造方法、コンピュータプログラム、データキャリア、および装置

Country Status (6)

Country Link
JP (3) JP5241829B2 (ko)
KR (3) KR20120059630A (ko)
CN (2) CN101681869B (ko)
NL (2) NL1035609A1 (ko)
TW (2) TWI449122B (ko)
WO (2) WO2008156367A1 (ko)

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JP6609694B2 (ja) * 2015-09-28 2019-11-20 エーエスエムエル ネザーランズ ビー．ブイ． 基板ホルダ、リソグラフィ装置、及びデバイスを製造する方法
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CN115494703A (zh) * 2016-04-20 2022-12-20 Asml荷兰有限公司 衬底支撑件、光刻设备和装载方法
CN113485074A (zh) 2016-07-01 2021-10-08 Asml荷兰有限公司 用于工作台系统的载物台
CN106872148B (zh) * 2017-03-07 2018-11-20 温州市质量技术监督检测院 一种带有激光管辅助夹取装置的激光器连续化作业检测装置
KR102540125B1 (ko) * 2017-08-30 2023-06-05 주성엔지니어링(주) 기판안치수단 및 기판처리장치
CN109732629A (zh) * 2019-01-04 2019-05-10 湖州师范学院 一种汇流排的抓取装置及其抓取方法
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
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CN112049041B (zh) * 2020-08-24 2022-09-06 广东泓璐科技发展有限公司 一种智慧城市用路口信号灯支撑装置
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Also Published As

Publication number Publication date
CN101681869A (zh) 2010-03-24
JP2012227554A (ja) 2012-11-15
WO2008156367A1 (en) 2008-12-24
KR20100031130A (ko) 2010-03-19
NL1035609A1 (nl) 2008-11-13
TW200919623A (en) 2009-05-01
KR20100033515A (ko) 2010-03-30
JP5600710B2 (ja) 2014-10-01
JP2010530636A (ja) 2010-09-09
TW200919102A (en) 2009-05-01
CN101681869B (zh) 2013-05-08
KR20120059630A (ko) 2012-06-08
JP2010531541A (ja) 2010-09-24
WO2008156366A1 (en) 2008-12-24
TWI449122B (zh) 2014-08-11
CN101681124B (zh) 2012-01-11
CN101681124A (zh) 2010-03-24
KR101232234B1 (ko) 2013-02-12
NL1035610A1 (nl) 2008-12-23
TWI448826B (zh) 2014-08-11
JP5058337B2 (ja) 2012-10-24

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