TWI449122B - 夾具器件，用於裝載一物件至支撐件上之方法，微影裝置及機器可讀媒體 - Google Patents

夾具器件，用於裝載一物件至支撐件上之方法，微影裝置及機器可讀媒體 Download PDF

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Publication number
TWI449122B
TWI449122B TW097123275A TW97123275A TWI449122B TW I449122 B TWI449122 B TW I449122B TW 097123275 A TW097123275 A TW 097123275A TW 97123275 A TW97123275 A TW 97123275A TW I449122 B TWI449122 B TW I449122B
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TW
Taiwan
Prior art keywords
substrate
force
support
distance
article
Prior art date
Application number
TW097123275A
Other languages
English (en)
Chinese (zh)
Other versions
TW200919623A (en
Inventor
Rene Theodorus Petrus Compen
Johannes Henricus Wilhelmus Jacobs
Martinus Hendrikus Antonius Leenders
Joost Jeroen Ottens
Martin Frans Pierre Smeets
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/812,818 external-priority patent/US20080316461A1/en
Priority claimed from US11/896,600 external-priority patent/US8446566B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200919623A publication Critical patent/TW200919623A/zh
Application granted granted Critical
Publication of TWI449122B publication Critical patent/TWI449122B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW097123275A 2007-06-21 2008-06-20 夾具器件，用於裝載一物件至支撐件上之方法，微影裝置及機器可讀媒體 TWI449122B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/812,818 US20080316461A1 (en) 2007-06-21 2007-06-21 Lithographic apparatus and device manufacturing method
US93538107P 2007-08-09 2007-08-09
US11/896,600 US8446566B2 (en) 2007-09-04 2007-09-04 Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method
US96057807P 2007-10-04 2007-10-04

Publications (2)

Publication Number Publication Date
TW200919623A TW200919623A (en) 2009-05-01
TWI449122B true TWI449122B (zh) 2014-08-11

Family

ID=39677717

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097123275A TWI449122B (zh) 2007-06-21 2008-06-20 夾具器件，用於裝載一物件至支撐件上之方法，微影裝置及機器可讀媒體
TW097123271A TWI448826B (zh) 2007-06-21 2008-06-20 將基板載於基板台上之方法，器件製造方法，電腦程式，資料載體及裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW097123271A TWI448826B (zh) 2007-06-21 2008-06-20 將基板載於基板台上之方法，器件製造方法，電腦程式，資料載體及裝置

Country Status (6)

Country Link
JP (3) JP5241829B2 (ko)
KR (3) KR20120059630A (ko)
CN (2) CN101681124B (ko)
NL (2) NL1035610A1 (ko)
TW (2) TWI449122B (ko)
WO (2) WO2008156366A1 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100969603B1 (ko) * 2008-06-25 2010-07-12 부산대학교 산학협력단 숫자의 기하학적 관계를 이용한 차량 번호판 인식 방법
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
JP5682106B2 (ja) * 2009-09-11 2015-03-11 株式会社ニコン 基板処理方法、及び基板処理装置
CN102859443B (zh) * 2010-04-23 2015-08-12 Asml荷兰有限公司 用于装载衬底的方法和设备
JP5932305B2 (ja) * 2011-11-16 2016-06-08 キヤノン株式会社 ステージ装置、露光装置及びデバイス製造方法
JP5995567B2 (ja) * 2012-07-12 2016-09-21 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
DE102012214253A1 (de) * 2012-08-10 2014-06-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Laserbasiertes Verfahren und Bearbeitungstisch zur Metallisierung der Rückseite eines Halbleiterbauelements
EP2950328A4 (en) * 2012-11-30 2017-01-25 Nikon Corporation Suction apparatus, carry-in method, conveyance system, light exposure device, and device production method
EP2950329B1 (en) 2012-11-30 2022-01-05 Nikon Corporation Carrier system, exposure apparatus, and device manufacturing method
JP6108803B2 (ja) * 2012-12-07 2017-04-05 日本特殊陶業株式会社 基板保持部材
CN105934715B (zh) * 2014-01-20 2019-01-01 Asml荷兰有限公司 衬底保持件、用于光刻设备的支撑台、光刻设备和器件制造方法
JP6219747B2 (ja) * 2014-02-25 2017-10-25 日本電子株式会社 荷電粒子線描画装置
JP6246685B2 (ja) * 2014-09-12 2017-12-13 株式会社東芝 静電チャック機構、基板処理方法及び半導体基板処理装置
CN110068991B (zh) 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
CN107743597B (zh) * 2015-06-11 2020-10-27 Asml荷兰有限公司 光刻设备及用于加载衬底的方法
US10453734B2 (en) 2015-07-02 2019-10-22 Asml Netherlands B.V. Substrate holder, a lithographic apparatus and method of manufacturing devices
CN111913368A (zh) * 2015-09-28 2020-11-10 Asml荷兰有限公司 衬底保持器、光刻设备和制造器件的方法
WO2017137129A1 (en) 2016-02-08 2017-08-17 Asml Netherlands B.V. Lithographic apparatus, method for unloading a substrate and method for loading a substrate
JP6748737B2 (ja) * 2016-04-20 2020-09-02 エーエスエムエル ネザーランズ ビー．ブイ． 基板支持部、リソグラフィ装置、およびローディング方法
WO2018001709A1 (en) 2016-07-01 2018-01-04 Asml Netherlands B.V. Stage system, lithographic apparatus, method for positioning and device manufacturing method
CN106872148B (zh) * 2017-03-07 2018-11-20 温州市质量技术监督检测院 一种带有激光管辅助夹取装置的激光器连续化作业检测装置
KR102540125B1 (ko) * 2017-08-30 2023-06-05 주성엔지니어링(주) 기판안치수단 및 기판처리장치
CN109732629A (zh) * 2019-01-04 2019-05-10 湖州师范学院 一种汇流排的抓取装置及其抓取方法
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
JP2022538287A (ja) * 2019-06-28 2022-09-01 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置の基板ハンドリングシステムおよびその方法
EP4018262B1 (en) * 2019-08-20 2023-06-21 ASML Netherlands B.V. Substrate holder and lithographic apparatus
CN112049041B (zh) * 2020-08-24 2022-09-06 广东泓璐科技发展有限公司 一种智慧城市用路口信号灯支撑装置
CN116325113A (zh) * 2020-10-16 2023-06-23 Asml荷兰有限公司 载物台、台式设备、保持方法和光刻设备
CN112947003A (zh) * 2021-03-25 2021-06-11 青岛天仁微纳科技有限责任公司 一种用于基片的烘烤设备
EP4105720A1 (en) * 2021-06-16 2022-12-21 ASML Netherlands B.V. Substrate holder and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737824A (en) * 1984-10-16 1988-04-12 Canon Kabushiki Kaisha Surface shape controlling device
US20040036850A1 (en) * 1999-08-19 2004-02-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US20050252455A1 (en) * 2004-05-13 2005-11-17 Tokyo Electron Limited Substrate transfer mechanism and subtrate transfer apparatus including same, particle removal method for the subtrate transfer mechanism and apparatus, program for executing the method, and storage medium for storing the program

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946030A (ja) * 1982-09-08 1984-03-15 Canon Inc ウェハの吸着固定方法
EP0107739B1 (en) * 1982-10-28 1986-08-27 The Columbus Show Case Company Curtain wall
JPS6194322A (ja) * 1984-10-16 1986-05-13 Canon Inc 薄板の表面形状矯正装置
JPS62288913A (ja) * 1986-06-09 1987-12-15 Hitachi Ltd 試料台制御装置
JPH09246362A (ja) * 1996-03-05 1997-09-19 Dainippon Screen Mfg Co Ltd 回転式基板処理装置および回転式基板処理方法
JP2000021964A (ja) * 1998-07-06 2000-01-21 Ngk Insulators Ltd 静電チャックのパーティクル発生低減方法および半導体製造装置
TW513617B (en) * 1999-04-21 2002-12-11 Asml Corp Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
JP2001093808A (ja) * 1999-09-21 2001-04-06 Nikon Corp 露光方法及び露光装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP2003115442A (ja) * 2001-10-04 2003-04-18 Nikon Corp 荷電粒子線露光装置におけるレチクル又はウエハの静電チャック方法
JP2003321117A (ja) * 2002-05-07 2003-11-11 Mineya Mori フラットパネルと保持機器との間の圧力域によってフラットパネルを保持する機器及びロボットハンド
JP2004165439A (ja) * 2002-11-13 2004-06-10 Canon Inc ステージ装置
US7615131B2 (en) * 2003-05-12 2009-11-10 Sosul Co., Ltd. Plasma etching chamber and plasma etching system using same
US20050181711A1 (en) * 2004-02-12 2005-08-18 Alexander Starikov Substrate confinement apparatus and method
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
US8956459B2 (en) * 2005-02-23 2015-02-17 Kyocera Corporation Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer
JP4604885B2 (ja) * 2005-07-07 2011-01-05 凸版印刷株式会社 ガラス基板の加熱方法
WO2007049704A1 (ja) * 2005-10-28 2007-05-03 Nikon Corporation デバイス製造処理装置間の接続装置及び接続方法、プログラム、デバイス製造処理システム、露光装置及び露光方法、並びに測定検査装置及び測定検査方法
JP2007158077A (ja) * 2005-12-06 2007-06-21 Dainippon Screen Mfg Co Ltd 基板熱処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4737824A (en) * 1984-10-16 1988-04-12 Canon Kabushiki Kaisha Surface shape controlling device
US20040036850A1 (en) * 1999-08-19 2004-02-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US20050252455A1 (en) * 2004-05-13 2005-11-17 Tokyo Electron Limited Substrate transfer mechanism and subtrate transfer apparatus including same, particle removal method for the subtrate transfer mechanism and apparatus, program for executing the method, and storage medium for storing the program

Also Published As

Publication number Publication date
CN101681124B (zh) 2012-01-11
WO2008156366A1 (en) 2008-12-24
JP5600710B2 (ja) 2014-10-01
KR101232234B1 (ko) 2013-02-12
NL1035610A1 (nl) 2008-12-23
JP2010530636A (ja) 2010-09-09
JP5058337B2 (ja) 2012-10-24
CN101681869A (zh) 2010-03-24
JP2012227554A (ja) 2012-11-15
TW200919102A (en) 2009-05-01
TW200919623A (en) 2009-05-01
KR20100031130A (ko) 2010-03-19
WO2008156367A1 (en) 2008-12-24
CN101681869B (zh) 2013-05-08
JP5241829B2 (ja) 2013-07-17
KR20120059630A (ko) 2012-06-08
KR20100033515A (ko) 2010-03-30
JP2010531541A (ja) 2010-09-24
CN101681124A (zh) 2010-03-24
TWI448826B (zh) 2014-08-11
NL1035609A1 (nl) 2008-11-13

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