NL1035610A1 - Clamping device, method for loading an object on a support, lithographic apparatus and machine readable medium. - Google Patents

Clamping device, method for loading an object on a support, lithographic apparatus and machine readable medium. Download PDF

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Publication number
NL1035610A1
NL1035610A1 NL1035610A NL1035610A NL1035610A1 NL 1035610 A1 NL1035610 A1 NL 1035610A1 NL 1035610 A NL1035610 A NL 1035610A NL 1035610 A NL1035610 A NL 1035610A NL 1035610 A1 NL1035610 A1 NL 1035610A1
Authority
NL
Netherlands
Prior art keywords
substrate
force
support
vacuum
clamping
Prior art date
Application number
NL1035610A
Other languages
English (en)
Dutch (nl)
Inventor
Joost Jeroen Ottens
Martinus Hendrikus Antonius Leenders
Johannes Henricus Wilhelmus Jacobs
Martin Frans Pierre Smeets
Rene Theodorus Petrus Compen
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/812,818 external-priority patent/US20080316461A1/en
Priority claimed from US11/896,600 external-priority patent/US8446566B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of NL1035610A1 publication Critical patent/NL1035610A1/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
NL1035610A 2007-06-21 2008-06-23 Clamping device, method for loading an object on a support, lithographic apparatus and machine readable medium. NL1035610A1 (nl)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US11/812,818 US20080316461A1 (en) 2007-06-21 2007-06-21 Lithographic apparatus and device manufacturing method
US81281807 2007-06-21
US93538107P 2007-08-09 2007-08-09
US93538107 2007-08-09
US11/896,600 US8446566B2 (en) 2007-09-04 2007-09-04 Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method
US89660007 2007-09-04
US96057807P 2007-10-04 2007-10-04
US96057807 2007-10-04

Publications (1)

Publication Number Publication Date
NL1035610A1 true NL1035610A1 (nl) 2008-12-23

Family

ID=39677717

Family Applications (2)

Application Number Title Priority Date Filing Date
NL1035609A NL1035609A1 (nl) 2007-06-21 2008-06-23 Method of loading, apparatus, device manufacturing method, computer program and data carrier.
NL1035610A NL1035610A1 (nl) 2007-06-21 2008-06-23 Clamping device, method for loading an object on a support, lithographic apparatus and machine readable medium.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL1035609A NL1035609A1 (nl) 2007-06-21 2008-06-23 Method of loading, apparatus, device manufacturing method, computer program and data carrier.

Country Status (6)

Country Link
JP (3) JP5058337B2 (ko)
KR (3) KR20120059630A (ko)
CN (2) CN101681869B (ko)
NL (2) NL1035609A1 (ko)
TW (2) TWI449122B (ko)
WO (2) WO2008156366A1 (ko)

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JP5682106B2 (ja) * 2009-09-11 2015-03-11 株式会社ニコン 基板処理方法、及び基板処理装置
KR20130070604A (ko) * 2010-04-23 2013-06-27 에이에스엠엘 네델란즈 비.브이. 기판을 로딩하기 위한 방법 및 장치
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JP6358564B2 (ja) 2012-11-30 2018-07-18 株式会社ニコン 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置
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JP6108803B2 (ja) * 2012-12-07 2017-04-05 日本特殊陶業株式会社 基板保持部材
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JP6219747B2 (ja) * 2014-02-25 2017-10-25 日本電子株式会社 荷電粒子線描画装置
JP6246685B2 (ja) * 2014-09-12 2017-12-13 株式会社東芝 静電チャック機構、基板処理方法及び半導体基板処理装置
CN107077078B (zh) 2014-10-23 2019-04-09 Asml荷兰有限公司 用于光刻设备的支撑台、加载衬底的方法、光刻设备和器件制造方法
WO2016198255A1 (en) 2015-06-11 2016-12-15 Asml Netherlands B.V. Lithographic apparatus and method for loading a substrate
US10453734B2 (en) 2015-07-02 2019-10-22 Asml Netherlands B.V. Substrate holder, a lithographic apparatus and method of manufacturing devices
CN111913368A (zh) 2015-09-28 2020-11-10 Asml荷兰有限公司 衬底保持器、光刻设备和制造器件的方法
CN113376974A (zh) 2016-02-08 2021-09-10 Asml荷兰有限公司 光刻设备、用于卸载衬底的方法和用于装载衬底的方法
CN109073990B (zh) * 2016-04-20 2022-09-27 Asml荷兰有限公司 衬底支撑件、光刻设备和装载方法
EP3479173A1 (en) 2016-07-01 2019-05-08 ASML Netherlands B.V. Stage system, lithographic apparatus, method for positioning and device manufacturing method
CN106872148B (zh) * 2017-03-07 2018-11-20 温州市质量技术监督检测院 一种带有激光管辅助夹取装置的激光器连续化作业检测装置
KR102540125B1 (ko) * 2017-08-30 2023-06-05 주성엔지니어링(주) 기판안치수단 및 기판처리장치
CN109732629A (zh) * 2019-01-04 2019-05-10 湖州师范学院 一种汇流排的抓取装置及其抓取方法
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
EP3990985B1 (en) * 2019-06-28 2024-01-17 ASML Netherlands B.V. Substrate handling system of a lithography apparatus and method thereof
CN114270270A (zh) * 2019-08-20 2022-04-01 Asml荷兰有限公司 衬底保持器、光刻设备和方法
CN112049041B (zh) * 2020-08-24 2022-09-06 广东泓璐科技发展有限公司 一种智慧城市用路口信号灯支撑装置
US20230400783A1 (en) * 2020-10-16 2023-12-14 Asml Netherlands B.V. Object table, stage apparatus, holding method and lithographic apparatus
CN112947003A (zh) * 2021-03-25 2021-06-11 青岛天仁微纳科技有限责任公司 一种用于基片的烘烤设备
EP4105720A1 (en) * 2021-06-16 2022-12-21 ASML Netherlands B.V. Substrate holder and method

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Also Published As

Publication number Publication date
KR20100031130A (ko) 2010-03-19
CN101681869A (zh) 2010-03-24
CN101681869B (zh) 2013-05-08
TWI448826B (zh) 2014-08-11
KR20100033515A (ko) 2010-03-30
JP2010530636A (ja) 2010-09-09
TW200919102A (en) 2009-05-01
JP5241829B2 (ja) 2013-07-17
WO2008156367A1 (en) 2008-12-24
WO2008156366A1 (en) 2008-12-24
NL1035609A1 (nl) 2008-11-13
JP5600710B2 (ja) 2014-10-01
JP5058337B2 (ja) 2012-10-24
KR101232234B1 (ko) 2013-02-12
CN101681124B (zh) 2012-01-11
JP2010531541A (ja) 2010-09-24
CN101681124A (zh) 2010-03-24
TW200919623A (en) 2009-05-01
KR20120059630A (ko) 2012-06-08
JP2012227554A (ja) 2012-11-15
TWI449122B (zh) 2014-08-11

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