JP5216576B2 - Led用の構造化基板 - Google Patents

Led用の構造化基板 Download PDF

Info

Publication number
JP5216576B2
JP5216576B2 JP2008506014A JP2008506014A JP5216576B2 JP 5216576 B2 JP5216576 B2 JP 5216576B2 JP 2008506014 A JP2008506014 A JP 2008506014A JP 2008506014 A JP2008506014 A JP 2008506014A JP 5216576 B2 JP5216576 B2 JP 5216576B2
Authority
JP
Japan
Prior art keywords
substrate
light
region
coupled
structural element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008506014A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008537291A5 (enExample
JP2008537291A (ja
Inventor
ハンス ヘルムート ベヒテル
ヴォルフガンク ブーセルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008537291A publication Critical patent/JP2008537291A/ja
Publication of JP2008537291A5 publication Critical patent/JP2008537291A5/ja
Application granted granted Critical
Publication of JP5216576B2 publication Critical patent/JP5216576B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/854Arrangements for extracting light from the devices comprising scattering means

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
JP2008506014A 2005-04-13 2006-04-06 Led用の構造化基板 Expired - Fee Related JP5216576B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05102912.2 2005-04-13
EP05102912 2005-04-13
PCT/IB2006/051050 WO2006109222A1 (en) 2005-04-13 2006-04-06 Structured substrate for a led

Publications (3)

Publication Number Publication Date
JP2008537291A JP2008537291A (ja) 2008-09-11
JP2008537291A5 JP2008537291A5 (enExample) 2009-05-21
JP5216576B2 true JP5216576B2 (ja) 2013-06-19

Family

ID=36589236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008506014A Expired - Fee Related JP5216576B2 (ja) 2005-04-13 2006-04-06 Led用の構造化基板

Country Status (7)

Country Link
US (1) US7943950B2 (enExample)
EP (1) EP1875520A1 (enExample)
JP (1) JP5216576B2 (enExample)
KR (1) KR101249233B1 (enExample)
CN (1) CN100576587C (enExample)
TW (1) TW200642126A (enExample)
WO (1) WO2006109222A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010002221A2 (ko) * 2008-07-03 2010-01-07 삼성엘이디 주식회사 파장변환형 발광다이오드 칩 및 이를 구비한 발광장치
CN101651173B (zh) * 2008-08-12 2011-04-27 昆山中辰硅晶有限公司 半导体发光元件
KR101363022B1 (ko) * 2008-12-23 2014-02-14 삼성디스플레이 주식회사 유기 발광 표시 장치
TW201214802A (en) * 2010-09-27 2012-04-01 Nat Univ Chung Hsing Patterned substrate and LED formed using the same
US10308545B2 (en) 2010-10-26 2019-06-04 Schott Ag Highly refractive thin glasses
DE102010042945A1 (de) * 2010-10-26 2012-04-26 Schott Ag Transparente Schichtverbunde
US10343946B2 (en) 2010-10-26 2019-07-09 Schott Ag Highly refractive thin glasses
TWI464910B (zh) * 2011-05-23 2014-12-11 Lextar Electronics Corp 半導體發光結構
JP2013084466A (ja) * 2011-10-11 2013-05-09 Konica Minolta Holdings Inc 面状発光体
WO2013084442A1 (ja) 2011-12-07 2013-06-13 パナソニック株式会社 シート及び発光装置
CN103199165A (zh) * 2012-01-05 2013-07-10 昆山中辰矽晶有限公司 发光二极管基板及其加工方法与发光二级管
BE1020735A3 (fr) * 2012-05-29 2014-04-01 Agc Glass Europe Substrat verrier texture a proprietes optiques ameliorees pour dispositif optoelectronique.
KR101421026B1 (ko) * 2012-06-12 2014-07-22 코닝정밀소재 주식회사 유기발광소자용 광추출층 기판 및 그 제조방법
US9257676B2 (en) * 2012-12-18 2016-02-09 Pioneer Corporation Light-emitting device
US9548419B2 (en) 2014-05-20 2017-01-17 Southern Taiwan University Of Science And Technology Light emitting diode chip having multi microstructure substrate surface
CN117460347A (zh) * 2023-09-08 2024-01-26 武汉华星光电技术有限公司 显示面板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09311206A (ja) * 1996-05-23 1997-12-02 Kimoto & Co Ltd 光線制御シート及びその製造方法
JPH1093136A (ja) 1996-09-11 1998-04-10 Sanken Electric Co Ltd 半導体発光素子
JPH10246805A (ja) * 1997-03-06 1998-09-14 Dainippon Printing Co Ltd 拡散光制御用光学シート、バックライト装置及び液晶表示装置
JPH118063A (ja) 1997-06-12 1999-01-12 Minnesota Mining & Mfg Co <3M> エレクトロルミネッセンス素子およびその製造方法
ITTO980580A1 (it) 1998-07-02 2000-01-02 C R F Societa Consotile Per Az Dispositivo emettitore di luce, a base di materiale organico elettro- luminescente, con interfaccia esterna conformata
JP2001051198A (ja) * 1999-08-06 2001-02-23 Olympus Optical Co Ltd 回転非対称光学面を有する光学素子およびその金型装置
DE19947030A1 (de) * 1999-09-30 2001-04-19 Osram Opto Semiconductors Gmbh Oberflächenstrukturierte Lichtemissionsdiode mit verbesserter Stromeinkopplung
WO2001061765A1 (de) * 2000-02-15 2001-08-23 Osram Opto Semiconductors Gmbh Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung
JP4597390B2 (ja) * 2001-01-19 2010-12-15 シャープ株式会社 光学シート、照明装置及び液晶表示装置
US6703780B2 (en) 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
JP2002352956A (ja) * 2001-03-23 2002-12-06 Mitsubishi Chemicals Corp 薄膜型発光体及びその製造方法
EP1263058B1 (en) 2001-05-29 2012-04-18 Toyoda Gosei Co., Ltd. Light-emitting element
JP3942879B2 (ja) * 2001-11-30 2007-07-11 シャープ株式会社 光学シートの製造方法
TW522751B (en) 2001-12-31 2003-03-01 Ritdisplay Corp Organic flat light emitting device
JP2004296215A (ja) 2003-03-26 2004-10-21 Toyota Industries Corp 面状光源用の透明基板、透明基板の製造方法、面状光源及び液晶表示装置
JP4136799B2 (ja) * 2002-07-24 2008-08-20 富士フイルム株式会社 El表示素子の形成方法
DE10234977A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Dünnschicht-Halbleiterbauelement auf GaN-Basis
CN100462739C (zh) 2002-08-13 2009-02-18 日本瑞翁株式会社 透镜阵列板
JP2004233957A (ja) * 2002-12-05 2004-08-19 Toyota Industries Corp 光学素子、面状照明装置及び液晶表示装置
JP2004241214A (ja) * 2003-02-05 2004-08-26 Stanley Electric Co Ltd El素子
JP2004342513A (ja) * 2003-05-16 2004-12-02 Toyota Industries Corp 自発光デバイス
JP2004342523A (ja) * 2003-05-16 2004-12-02 Toyota Industries Corp 自発光デバイス
JP2004363049A (ja) * 2003-06-06 2004-12-24 Seiko Epson Corp 有機エレクトロルミネッセンス表示装置の製造方法及び、有機エレクトロルミネッセンス表示装置並びに、有機エレクトロルミネッセンス表示装置を備える表示装置
WO2005018008A1 (ja) * 2003-08-19 2005-02-24 Nichia Corporation 半導体素子

Also Published As

Publication number Publication date
KR20080012871A (ko) 2008-02-12
WO2006109222A1 (en) 2006-10-19
JP2008537291A (ja) 2008-09-11
TW200642126A (en) 2006-12-01
KR101249233B1 (ko) 2013-04-01
CN101160671A (zh) 2008-04-09
US20080203421A1 (en) 2008-08-28
US7943950B2 (en) 2011-05-17
CN100576587C (zh) 2009-12-30
EP1875520A1 (en) 2008-01-09

Similar Documents

Publication Publication Date Title
JP5216576B2 (ja) Led用の構造化基板
CN101375418B (zh) 半导体发光装置
KR101715843B1 (ko) 광추출 효율이 향상된 발광 소자
CN102246325A (zh) 具有改善的光提取率的发光二极管
US9502608B2 (en) Method of manufacturing a light emitting device in which light emitting element and light transmissive member are directly bonded
JP2005158665A (ja) 照明装置
US20080197764A1 (en) Electroluminescence Light Source
EP0969699B1 (en) Light-emitting device based on an electroluminescent organic material, having a shaped outer interface
WO2013035299A1 (ja) 発光装置および光シート
JP2008537291A5 (enExample)
JP2004253811A5 (enExample)
CN114326204A (zh) 发光模块以及面状光源
US7741134B2 (en) Inverted LED structure with improved light extraction
JP5401452B2 (ja) オプトエレクトロニクス半導体チップ
JP6626570B2 (ja) 有機発光素子
JP2008181910A (ja) GaN系発光ダイオード素子の製造方法
KR20120028741A (ko) 발광 소자
JP2008010245A (ja) 発光装置
KR20110004419A (ko) 매크로 추출기를 갖는 oled 디바이스
JP2011187239A (ja) 面光源素子およびそれを備えた照明装置
KR101715844B1 (ko) 기공을 포함한 광추출층
WO2010058755A1 (ja) 面光源素子およびそれを用いた画像表示装置ならびに照明装置
WO2013175868A1 (ja) 面発光素子
CN100573943C (zh) 具改良式反射片的发光二极管元件
JP2016076301A (ja) 発光素子基材および製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090401

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090401

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111024

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120124

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120131

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121009

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130108

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130304

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160308

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees