JP5198733B2 - デュアルヒューズリンク薄膜ヒューズ - Google Patents

デュアルヒューズリンク薄膜ヒューズ Download PDF

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Publication number
JP5198733B2
JP5198733B2 JP2006021308A JP2006021308A JP5198733B2 JP 5198733 B2 JP5198733 B2 JP 5198733B2 JP 2006021308 A JP2006021308 A JP 2006021308A JP 2006021308 A JP2006021308 A JP 2006021308A JP 5198733 B2 JP5198733 B2 JP 5198733B2
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Japan
Prior art keywords
fuse
substrate
terminal
links
link
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2006021308A
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English (en)
Japanese (ja)
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JP2006210353A5 (enExample
JP2006210353A (ja
Inventor
泰治 福重
パブロ・ウォリー
Original Assignee
リッテルフューズ，インコーポレイティド
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Publication of JP2006210353A5 publication Critical patent/JP2006210353A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H2085/0555—Input terminal connected to a plurality of output terminals, e.g. multielectrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/24—Means for preventing insertion of incorrect fuse

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  • Fuses (AREA)
JP2006021308A 2005-01-28 2006-01-30 デュアルヒューズリンク薄膜ヒューズ Expired - Fee Related JP5198733B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/046,367 US7477130B2 (en) 2005-01-28 2005-01-28 Dual fuse link thin film fuse
US11/046,367 2005-01-28

Publications (3)

Publication Number Publication Date
JP2006210353A JP2006210353A (ja) 2006-08-10
JP2006210353A5 JP2006210353A5 (enExample) 2012-05-31
JP5198733B2 true JP5198733B2 (ja) 2013-05-15

Family

ID=36741153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006021308A Expired - Fee Related JP5198733B2 (ja) 2005-01-28 2006-01-30 デュアルヒューズリンク薄膜ヒューズ

Country Status (5)

Country Link
US (1) US7477130B2 (enExample)
JP (1) JP5198733B2 (enExample)
CN (1) CN101253594B (enExample)
DE (1) DE102006004246A1 (enExample)
WO (1) WO2006081572A2 (enExample)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8447077B2 (en) 2006-09-11 2013-05-21 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array
US8131026B2 (en) 2004-04-16 2012-03-06 Validity Sensors, Inc. Method and apparatus for fingerprint image reconstruction
US8175345B2 (en) 2004-04-16 2012-05-08 Validity Sensors, Inc. Unitized ergonomic two-dimensional fingerprint motion tracking device and method
US8358815B2 (en) 2004-04-16 2013-01-22 Validity Sensors, Inc. Method and apparatus for two-dimensional finger motion tracking and control
US8229184B2 (en) 2004-04-16 2012-07-24 Validity Sensors, Inc. Method and algorithm for accurate finger motion tracking
US8077935B2 (en) 2004-04-23 2011-12-13 Validity Sensors, Inc. Methods and apparatus for acquiring a swiped fingerprint image
US8165355B2 (en) 2006-09-11 2012-04-24 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications
WO2006041780A1 (en) 2004-10-04 2006-04-20 Validity Sensors, Inc. Fingerprint sensing assemblies comprising a substrate
US8289123B2 (en) * 2005-07-22 2012-10-16 Littelfuse, Inc. Electrical device with integrally fused conductor
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
US8107212B2 (en) 2007-04-30 2012-01-31 Validity Sensors, Inc. Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge
US7701321B2 (en) * 2007-05-10 2010-04-20 Delphi Technologies, Inc. System and method for interconnecting a plurality of printed circuits
US8290150B2 (en) 2007-05-11 2012-10-16 Validity Sensors, Inc. Method and system for electronically securing an electronic device using physically unclonable functions
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
US8276816B2 (en) 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
US8204281B2 (en) 2007-12-14 2012-06-19 Validity Sensors, Inc. System and method to remove artifacts from fingerprint sensor scans
TW200929310A (en) * 2007-12-21 2009-07-01 Chun-Chang Yen Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
KR20090090161A (ko) * 2008-02-20 2009-08-25 삼성전자주식회사 전기적 퓨즈 소자
US8116540B2 (en) 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
KR20090112390A (ko) * 2008-04-24 2009-10-28 삼성전자주식회사 전기적 퓨즈 소자
WO2010036445A1 (en) 2008-07-22 2010-04-01 Validity Sensors, Inc. System, device and method for securing a device component
US8391568B2 (en) 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
US8600122B2 (en) 2009-01-15 2013-12-03 Validity Sensors, Inc. Apparatus and method for culling substantially redundant data in fingerprint sensing circuits
US8278946B2 (en) 2009-01-15 2012-10-02 Validity Sensors, Inc. Apparatus and method for detecting finger activity on a fingerprint sensor
US8374407B2 (en) 2009-01-28 2013-02-12 Validity Sensors, Inc. Live finger detection
US8289122B2 (en) * 2009-03-24 2012-10-16 Tyco Electronics Corporation Reflowable thermal fuse
US8581686B2 (en) * 2009-03-24 2013-11-12 Tyco Electronics Corporation Electrically activated surface mount thermal fuse
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
CN102792345A (zh) * 2009-12-30 2012-11-21 特兰奎利帝集团私人有限公司 用于准确和安全的产品分配的方法和设备
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8791792B2 (en) 2010-01-15 2014-07-29 Idex Asa Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
US8716613B2 (en) 2010-03-02 2014-05-06 Synaptics Incoporated Apparatus and method for electrostatic discharge protection
JP5260592B2 (ja) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 保護素子、バッテリ制御装置、及びバッテリパック
US9001040B2 (en) 2010-06-02 2015-04-07 Synaptics Incorporated Integrated fingerprint sensor and navigation device
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
US8331096B2 (en) 2010-08-20 2012-12-11 Validity Sensors, Inc. Fingerprint acquisition expansion card apparatus
US8854784B2 (en) 2010-10-29 2014-10-07 Tyco Electronics Corporation Integrated FET and reflowable thermal fuse switch device
US8976001B2 (en) * 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device
US8538097B2 (en) 2011-01-26 2013-09-17 Validity Sensors, Inc. User input utilizing dual line scanner apparatus and method
US8594393B2 (en) 2011-01-26 2013-11-26 Validity Sensors System for and method of image reconstruction with dual line scanner using line counts
US9406580B2 (en) 2011-03-16 2016-08-02 Synaptics Incorporated Packaging for fingerprint sensors and methods of manufacture
US10064266B2 (en) * 2011-07-19 2018-08-28 Whirlpool Corporation Circuit board having arc tracking protection
EP2573790A1 (en) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Fuse element
JP5856796B2 (ja) * 2011-10-14 2016-02-10 矢崎総業株式会社 ブレード型ヒューズ
JP5863980B2 (ja) * 2011-10-19 2016-02-17 リテルヒューズ・インク ヒューズエレメントを製造する方法
US10043052B2 (en) 2011-10-27 2018-08-07 Synaptics Incorporated Electronic device packages and methods
US9195877B2 (en) 2011-12-23 2015-11-24 Synaptics Incorporated Methods and devices for capacitive image sensing
US9785299B2 (en) 2012-01-03 2017-10-10 Synaptics Incorporated Structures and manufacturing methods for glass covered electronic devices
US9137438B2 (en) 2012-03-27 2015-09-15 Synaptics Incorporated Biometric object sensor and method
US9251329B2 (en) 2012-03-27 2016-02-02 Synaptics Incorporated Button depress wakeup and wakeup strategy
US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
US9152838B2 (en) 2012-03-29 2015-10-06 Synaptics Incorporated Fingerprint sensor packagings and methods
KR102245293B1 (ko) 2012-04-10 2021-04-28 이덱스 바이오메트릭스 아사 생체정보의 감지
US9665762B2 (en) 2013-01-11 2017-05-30 Synaptics Incorporated Tiered wakeup strategy
JP6255158B2 (ja) * 2013-02-12 2017-12-27 矢崎総業株式会社 バスバー
US9460882B2 (en) * 2013-03-14 2016-10-04 Littelfuse, Inc. Laminated electrical fuse
US20140368309A1 (en) * 2013-06-18 2014-12-18 Littelfuse, Inc. Circuit protection device
JP6491431B2 (ja) * 2014-07-15 2019-03-27 デクセリアルズ株式会社 ヒューズ素子、及びヒューズエレメント
US20170003349A1 (en) * 2015-07-02 2017-01-05 GM Global Technology Operations LLC Arc suppression and protection of integrated flex circuit fuses for high voltage applications under chemically harsh environments
JP6754941B2 (ja) * 2015-09-02 2020-09-16 パナソニックＩｐマネジメント株式会社 回路保護素子およびその製造方法
JP6797565B2 (ja) * 2015-12-18 2020-12-09 デクセリアルズ株式会社 ヒューズ素子
US20170236667A1 (en) * 2016-02-17 2017-08-17 Dexerials Corporation Protective element and protective circuit substrate using the same
JP7368144B2 (ja) * 2019-08-27 2023-10-24 Koa株式会社 チップ型電流ヒューズ
US11807770B2 (en) * 2020-06-15 2023-11-07 Littelfuse, Inc. Thin film coating packaging for device having meltable and wetting links
US11532452B2 (en) * 2021-03-25 2022-12-20 Littelfuse, Inc. Protection device with laser trimmed fusible element
JP7729689B2 (ja) * 2021-10-28 2025-08-26 エルジー エナジー ソリューション リミテッド パターンヒューズ及びその製造方法

Family Cites Families (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1086324A (en) 1963-07-19 1967-10-11 English Electric Co Ltd Improvements relating to electric fuse elements
US3585556A (en) * 1969-07-22 1971-06-15 Ashok R Hingorany Electrical fuse and heater units
US4000054A (en) 1970-11-06 1976-12-28 Microsystems International Limited Method of making thin film crossover structure
US3805208A (en) 1973-06-14 1974-04-16 Alister C Mc Protector for electric circuits
US4021705A (en) * 1975-03-24 1977-05-03 Lichtblau G J Resonant tag circuits having one or more fusible links
US4037917A (en) * 1976-01-20 1977-07-26 I-T-E Imperial Corporation Field installed fuse rejection means with spring between clip jaws
DE2630697A1 (de) * 1976-07-08 1978-01-19 Grote & Hartmann Flachsicherung
AU518330B2 (en) * 1977-07-07 1981-09-24 Amp Incorporated Fuse
US4272753A (en) 1978-08-16 1981-06-09 Harris Corporation Integrated circuit fuse
US4394639A (en) 1978-12-18 1983-07-19 Mcgalliard James D Printed circuit fuse assembly
US4296398A (en) * 1978-12-18 1981-10-20 Mcgalliard James D Printed circuit fuse assembly
US4376927A (en) * 1978-12-18 1983-03-15 Mcgalliard James D Printed circuit fuse assembly
JPS56160648A (en) 1980-05-14 1981-12-10 Fuji Electric Co Ltd Oxygen sensor
JPS57117255A (en) 1981-01-12 1982-07-21 Toshiba Corp Semiconductor ic device
JPS57122565A (en) 1981-01-22 1982-07-30 Toshiba Corp Semiconductor device
JPS58115692A (ja) 1981-12-28 1983-07-09 Fujitsu Ltd プログラマブル・リードオンリメモリのヒューズ切断方法
US4626818A (en) 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
US4630355A (en) 1985-03-08 1986-12-23 Energy Conversion Devices, Inc. Electric circuits having repairable circuit lines and method of making the same
US4635023A (en) 1985-05-22 1987-01-06 Littelfuse, Inc. Fuse assembly having a non-sagging suspended fuse link
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
JPS62161744U (enExample) * 1986-04-04 1987-10-14
US4652848A (en) * 1986-06-06 1987-03-24 Northern Telecom Limited Fusible link
JPS6320349U (enExample) * 1986-07-25 1988-02-10
US4924203A (en) 1987-03-24 1990-05-08 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4873506A (en) 1988-03-09 1989-10-10 Cooper Industries, Inc. Metallo-organic film fractional ampere fuses and method of making
JPH01272133A (ja) 1988-04-22 1989-10-31 Mitsubishi Electric Corp 半導体装置
JPH02100221A (ja) 1988-10-07 1990-04-12 Fujikura Ltd 温度ヒューズおよびその形成方法
US5025300A (en) 1989-06-30 1991-06-18 At&T Bell Laboratories Integrated circuits having improved fusible links
US5241212A (en) 1990-05-01 1993-08-31 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having a redundant circuit portion and a manufacturing method of the same
CH682959A5 (fr) 1990-05-04 1993-12-15 Battelle Memorial Institute Fusible.
JPH0465046A (ja) 1990-07-02 1992-03-02 Tateyama Kagaku Kogyo Kk チップ形ヒューズ抵抗器
US5115220A (en) 1991-01-03 1992-05-19 Gould, Inc. Fuse with thin film fusible element supported on a substrate
US5148141A (en) 1991-01-03 1992-09-15 Gould Inc. Fuse with thin film fusible element supported on a substrate
US5099219A (en) 1991-02-28 1992-03-24 Rock, Ltd. Partnership Fusible flexible printed circuit and method of making same
US5091712A (en) 1991-03-21 1992-02-25 Gould Inc. Thin film fusible element
US5095297A (en) 1991-05-14 1992-03-10 Gould Inc. Thin film fuse construction
US5097247A (en) 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
JPH04365351A (ja) 1991-06-13 1992-12-17 Nec Corp 半導体集積回路装置
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
JPH05235170A (ja) 1992-02-24 1993-09-10 Nec Corp 半導体装置
US5303402A (en) * 1992-03-09 1994-04-12 Motorola, Inc. Electrically isolated metal mask programming using a polysilicon fuse
JP2648649B2 (ja) 1992-04-06 1997-09-03 株式会社コンド電機 サージ吸収素子
DE4222278C1 (de) 1992-07-07 1994-03-31 Roederstein Kondensatoren Verfahren zur Herstellung elektrischer Dickschichtsicherungen
US5389814A (en) 1993-02-26 1995-02-14 International Business Machines Corporation Electrically blowable fuse structure for organic insulators
JP3170101B2 (ja) 1993-04-15 2001-05-28 株式会社東芝 半導体装置及びその製造方法
JP2624439B2 (ja) 1993-04-30 1997-06-25 コーア株式会社 回路保護用素子
WO1994027302A1 (en) 1993-05-14 1994-11-24 Kiyokawa Mekki Kougyo Co., Ltd Metallic film resistor having fusing function and method for its manufacture
SE505448C2 (sv) 1993-05-28 1997-09-01 Ericsson Telefon Ab L M Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring
JP3252025B2 (ja) 1993-06-19 2002-01-28 内橋エステック株式会社 基板型温度ヒュ−ズ
US5456942A (en) 1993-09-29 1995-10-10 Motorola, Inc. Method for fabricating a circuit element through a substrate
US5432378A (en) 1993-12-15 1995-07-11 Cooper Industries, Inc. Subminiature surface mounted circuit protector
JP3255524B2 (ja) 1993-12-28 2002-02-12 三菱電機株式会社 冗長回路を有する半導体装置およびその製造方法
US5453726A (en) 1993-12-29 1995-09-26 Aem (Holdings), Inc. High reliability thick film surface mount fuse assembly
JP3358677B2 (ja) 1993-12-30 2002-12-24 内橋エステック株式会社 薄型ヒュ−ズ
JP3274759B2 (ja) 1993-12-30 2002-04-15 内橋エステック株式会社 薄型ヒュ−ズ及びその製造方法
JP3304179B2 (ja) 1993-12-30 2002-07-22 内橋エステック株式会社 薄型ヒュ−ズ
US5420455A (en) 1994-03-31 1995-05-30 International Business Machines Corp. Array fuse damage protection devices and fabrication method
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5552757A (en) 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5567643A (en) 1994-05-31 1996-10-22 Taiwan Semiconductor Manufacturing Company Method of forming contamination guard ring for semiconductor integrated circuit applications
DE19521985B4 (de) 1994-06-17 2007-08-09 Denso Corp., Kariya Halbleitervorrichtung und diesbezügliches Herstellungsverfahren
US5712610C1 (en) 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
JP3594661B2 (ja) 1994-09-02 2004-12-02 内橋エステック株式会社 合金型温度ヒュ−ズ
US5879966A (en) 1994-09-06 1999-03-09 Taiwan Semiconductor Manufacturing Company Ltd. Method of making an integrated circuit having an opening for a fuse
US5726621A (en) * 1994-09-12 1998-03-10 Cooper Industries, Inc. Ceramic chip fuses with multiple current carrying elements and a method for making the same
US5578517A (en) 1994-10-24 1996-11-26 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a highly transparent silicon rich nitride protective layer for a fuse window
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
TW279229B (en) 1994-12-29 1996-06-21 Siemens Ag Double density fuse bank for the laser break-link programming of an integrated-circuit
JP2670756B2 (ja) 1995-02-02 1997-10-29 釜屋電機株式会社 チップ形ヒューズ抵抗器、及びその製造方法
US5608257A (en) 1995-06-07 1997-03-04 International Business Machines Corporation Fuse element for effective laser blow in an integrated circuit device
US5747868A (en) 1995-06-26 1998-05-05 Alliance Semiconductor Corporation Laser fusible link structure for semiconductor devices
JPH0951038A (ja) 1995-08-07 1997-02-18 Matsushita Electron Corp 半導体装置およびその製造方法
EP0762498A3 (en) 1995-08-28 1998-06-24 International Business Machines Corporation Fuse window with controlled fuse oxide thickness
US5538924A (en) 1995-09-05 1996-07-23 Vanguard International Semiconductor Co. Method of forming a moisture guard ring for integrated circuit applications
JP3774871B2 (ja) 1995-10-16 2006-05-17 松尾電機株式会社 遅延型薄膜ヒューズ
JPH09213804A (ja) 1996-01-29 1997-08-15 Mitsubishi Electric Corp ヒューズ層を有する半導体装置
US5895262A (en) 1996-01-31 1999-04-20 Micron Technology, Inc. Methods for etching fuse openings in a semiconductor device
US5712206A (en) 1996-03-20 1998-01-27 Vanguard International Semiconductor Corporation Method of forming moisture barrier layers for integrated circuit applications
US5821160A (en) 1996-06-06 1998-10-13 Motorola, Inc. Method for forming a laser alterable fuse area of a memory cell using an etch stop layer
US6307273B1 (en) 1996-06-07 2001-10-23 Vanguard International Semiconductor Corporation High contrast, low noise alignment mark for laser trimming of redundant memory arrays
US5977860A (en) 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
US5851903A (en) 1996-08-20 1998-12-22 International Business Machine Corporation Method of forming closely pitched polysilicon fuses
JP3754770B2 (ja) 1996-10-01 2006-03-15 内橋エステック株式会社 薄型ヒュ−ズ
JPH10163331A (ja) 1996-12-03 1998-06-19 Texas Instr Japan Ltd 半導体デバイス用フューズおよび半導体デバイス
US5986319A (en) 1997-03-19 1999-11-16 Clear Logic, Inc. Laser fuse and antifuse structures formed over the active circuitry of an integrated circuit
JP3907279B2 (ja) 1997-08-26 2007-04-18 宮城沖電気株式会社 半導体装置の製造方法および検査方法
DE19738575A1 (de) * 1997-09-04 1999-06-10 Wickmann Werke Gmbh Elektrisches Sicherungselement
JP3081994B2 (ja) 1997-10-22 2000-08-28 セイコーインスツルメンツ株式会社 半導体装置
US5923239A (en) 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
JP4013308B2 (ja) 1998-01-21 2007-11-28 ヤマハ株式会社 配線形成方法
US5968847A (en) 1998-03-13 1999-10-19 Applied Materials, Inc. Process for copper etch back
US5982268A (en) 1998-03-31 1999-11-09 Uchihashi Estec Co., Ltd Thin type fuses
US6002322A (en) 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
JP4396787B2 (ja) 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
US6010966A (en) 1998-08-07 2000-01-04 Applied Materials, Inc. Hydrocarbon gases for anisotropic etching of metal-containing layers
JP4322330B2 (ja) 1998-09-04 2009-08-26 エルピーダメモリ株式会社 半導体集積回路装置の製造方法
JP3566133B2 (ja) 1999-05-11 2004-09-15 セイコーインスツルメンツ株式会社 半導体装置の製造方法
US6180503B1 (en) 1999-07-29 2001-01-30 Vanguard International Semiconductor Corporation Passivation layer etching process for memory arrays with fusible links
US6300859B1 (en) * 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
US6372652B1 (en) 2000-01-31 2002-04-16 Chartered Semiconductor Manufacturing Ltd. Method for forming a thin-film, electrically blowable fuse with a reproducible blowing wattage
TW547866U (en) * 2002-07-31 2003-08-11 Polytronics Technology Corp Over-current protection device
WO2004067631A1 (ja) * 2002-12-27 2004-08-12 Tdk Corporation 樹脂組成物、樹脂硬化物、シート状樹脂硬化物、積層体、プリプレグ、電子部品及び多層基板

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DE102006004246A1 (de) 2006-09-28
CN101253594B (zh) 2013-03-20
US7477130B2 (en) 2009-01-13
WO2006081572A3 (en) 2008-01-17
JP2006210353A (ja) 2006-08-10
WO2006081572A2 (en) 2006-08-03
CN101253594A (zh) 2008-08-27

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