JP5198058B2 - 縁部が気密封止された有機電子パッケージ及びその製造方法 - Google Patents

縁部が気密封止された有機電子パッケージ及びその製造方法 Download PDF

Info

Publication number
JP5198058B2
JP5198058B2 JP2007506181A JP2007506181A JP5198058B2 JP 5198058 B2 JP5198058 B2 JP 5198058B2 JP 2007506181 A JP2007506181 A JP 2007506181A JP 2007506181 A JP2007506181 A JP 2007506181A JP 5198058 B2 JP5198058 B2 JP 5198058B2
Authority
JP
Japan
Prior art keywords
flexible substrate
package
organic
organic electronic
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007506181A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007531238A (ja
JP2007531238A5 (enExample
Inventor
シャープケンス，マーク
ドゥガル，アニル
ヘラー，クリスチャン・エム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2007531238A publication Critical patent/JP2007531238A/ja
Publication of JP2007531238A5 publication Critical patent/JP2007531238A5/ja
Application granted granted Critical
Publication of JP5198058B2 publication Critical patent/JP5198058B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)
  • Packages (AREA)
JP2007506181A 2004-04-02 2005-03-01 縁部が気密封止された有機電子パッケージ及びその製造方法 Expired - Fee Related JP5198058B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/817,531 2004-04-02
US10/817,531 US8405193B2 (en) 2004-04-02 2004-04-02 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
PCT/US2005/006602 WO2005104266A1 (en) 2004-04-02 2005-03-01 Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages

Publications (3)

Publication Number Publication Date
JP2007531238A JP2007531238A (ja) 2007-11-01
JP2007531238A5 JP2007531238A5 (enExample) 2008-04-17
JP5198058B2 true JP5198058B2 (ja) 2013-05-15

Family

ID=34961188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007506181A Expired - Fee Related JP5198058B2 (ja) 2004-04-02 2005-03-01 縁部が気密封止された有機電子パッケージ及びその製造方法

Country Status (6)

Country Link
US (2) US8405193B2 (enExample)
JP (1) JP5198058B2 (enExample)
KR (2) KR20060133018A (enExample)
CN (1) CN1957485B (enExample)
TW (1) TWI430454B (enExample)
WO (1) WO2005104266A1 (enExample)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
TWI286797B (en) * 2006-01-18 2007-09-11 Touch Micro System Tech Method of wafer level packaging and cutting
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR101298025B1 (ko) * 2006-09-25 2013-08-26 엘지디스플레이 주식회사 렌티큘러방식 입체영상표시장치의 제조방법.
JP2008103254A (ja) * 2006-10-20 2008-05-01 Tokai Rubber Ind Ltd 有機ｅｌデバイス
US20080102223A1 (en) * 2006-11-01 2008-05-01 Sigurd Wagner Hybrid layers for use in coatings on electronic devices or other articles
US20080138538A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US20080138624A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US7781031B2 (en) * 2006-12-06 2010-08-24 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
US7667285B2 (en) * 2006-12-14 2010-02-23 Motorola, Inc. Printed electronic substrate havine photochromic barrier layer
KR101443369B1 (ko) * 2007-02-12 2014-09-26 엘지디스플레이 주식회사 표시 기판 모듈 및 이를 이용한 표시장치의 제조 방법
US7929106B2 (en) * 2007-12-13 2011-04-19 3M Innovative Properties Company Liquid crystal display comprising a void region and method of manufacturing same
WO2009136305A1 (en) * 2008-05-06 2009-11-12 Koninklijke Philips Electronics N.V. Reelable oled curtain
EP2274458B1 (en) * 2008-05-07 2020-03-25 The Trustees of Princeton University Method for protecting electronic devices by means of hybrid layers
US20090284158A1 (en) * 2008-05-16 2009-11-19 General Electric Company Organic light emitting device based lighting for low cost, flexible large area signage
US7976908B2 (en) * 2008-05-16 2011-07-12 General Electric Company High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
US8362517B2 (en) 2008-06-11 2013-01-29 Plextronics, Inc. Encapsulation for organic optoelectronic devices
JP2010044937A (ja) * 2008-08-12 2010-02-25 Tohcello Co Ltd テープ状の密封材および有機ｅｌデバイス
US8022623B2 (en) * 2008-08-15 2011-09-20 General Electric Company Ultra-thin multi-substrate color tunable OLED device
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
EP2202819A1 (en) 2008-12-29 2010-06-30 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Electro-optic device and method for manufacturing the same
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
US7948178B2 (en) * 2009-03-04 2011-05-24 Global Oled Technology Llc Hermetic seal
US8405116B2 (en) * 2009-03-18 2013-03-26 Semiconductor Energy Laboratory Co., Ltd. Lighting device
TWI389271B (zh) 2009-04-10 2013-03-11 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
KR101621300B1 (ko) 2009-09-16 2016-05-17 엘지디스플레이 주식회사 유기전계발광소자의 제조방법
US8753711B2 (en) * 2009-12-18 2014-06-17 General Electric Company Edge sealing method using barrier coatings
JP5611812B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体、これを含む表示装置及び表示装置の製造方法
JP5611811B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
JP5290268B2 (ja) 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
EP2363905A1 (en) * 2010-03-05 2011-09-07 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electrical device and method for manufacturing thereof
EP2383817A1 (en) * 2010-04-29 2011-11-02 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Light-emitting device and method for manufacturing the same
US8618731B2 (en) * 2010-05-18 2013-12-31 General Electric Company Large-area flexible OLED light source
TWI443784B (zh) 2010-07-29 2014-07-01 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法
US9935289B2 (en) 2010-09-10 2018-04-03 Industrial Technology Research Institute Institute Environmental sensitive element package and encapsulation method thereof
KR101266103B1 (ko) * 2010-09-29 2013-05-27 엘지전자 주식회사 태양 전지 모듈 및 그 제조 방법
KR20120066352A (ko) * 2010-12-14 2012-06-22 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법
US8692457B2 (en) 2010-12-20 2014-04-08 General Electric Company Large area light emitting electrical package with current spreading bus
KR20140051990A (ko) * 2011-08-04 2014-05-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 에지 보호된 배리어 조립체
CN103718649A (zh) * 2011-08-04 2014-04-09 3M创新有限公司 边缘受保护的阻隔组件
EP2742537A4 (en) 2011-08-04 2015-05-20 3M Innovative Properties Co LOCKING DEVICE WITH EDGE PROTECTION
WO2013019463A1 (en) * 2011-08-04 2013-02-07 3M Innovative Properties Company Edge protected barrier assemblies
CN103733725A (zh) * 2011-08-04 2014-04-16 3M创新有限公司 阻隔组件
JP6362330B2 (ja) * 2011-11-14 2018-07-25 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子、及び、面状発光体
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2013130122A1 (en) * 2012-03-01 2013-09-06 3M Innovative Properties Company Continuous edge protected barrier assemblies
JP2013219184A (ja) * 2012-04-09 2013-10-24 Sumitomo Chemical Co Ltd 照明パネル及びこれを備えた照明装置
EP2685515A1 (en) * 2012-07-12 2014-01-15 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and system for dividing a barrier foil
KR102161078B1 (ko) * 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
CN103794733A (zh) 2012-10-31 2014-05-14 财团法人工业技术研究院 环境敏感电子元件封装体
KR101420332B1 (ko) * 2012-11-14 2014-07-16 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
CN103855105B (zh) 2012-12-06 2017-04-26 财团法人工业技术研究院 环境敏感电子元件封装体及其制作方法
US8829507B2 (en) 2012-12-06 2014-09-09 General Electric Company Sealed organic opto-electronic devices and related methods of manufacturing
TWI497655B (zh) * 2012-12-14 2015-08-21 財團法人工業技術研究院 環境敏感電子元件封裝體及其製作方法
WO2014097387A1 (ja) 2012-12-18 2014-06-26 パイオニア株式会社 発光装置
US9847512B2 (en) 2012-12-22 2017-12-19 Industrial Technology Research Institute Electronic device package structure and manufacturing method thereof
TWI552331B (zh) * 2013-01-11 2016-10-01 財團法人工業技術研究院 電子元件之封裝結構
KR102103421B1 (ko) 2013-02-07 2020-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
KR20140119583A (ko) * 2013-04-01 2014-10-10 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20180133562A (ko) 2013-04-15 2018-12-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
CN104124347A (zh) * 2013-04-28 2014-10-29 海洋王照明科技股份有限公司 柔性有机电致发光器件及其制备方法
TW201943069A (zh) 2013-09-06 2019-11-01 日商半導體能源研究所股份有限公司 發光裝置以及發光裝置的製造方法
CN103500800A (zh) * 2013-09-27 2014-01-08 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制作方法
US10008689B2 (en) 2013-09-27 2018-06-26 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel
CN103490019B (zh) * 2013-09-29 2016-02-17 京东方科技集团股份有限公司 有机电致发光器件的封装结构及封装方法、显示装置
EP3016162B1 (en) * 2013-09-30 2020-07-22 LG Chem, Ltd. Substrate for organic electronic devices and production method therefor
CN103560209A (zh) * 2013-10-12 2014-02-05 深圳市华星光电技术有限公司 有机发光二极管装置以及其制造方法
KR102212764B1 (ko) * 2013-10-15 2021-02-08 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN104637886B (zh) 2013-11-12 2017-09-22 财团法人工业技术研究院 折叠式封装结构
DE102013226280A1 (de) 2013-12-17 2015-06-18 Belectric Opv Gmbh Organisches Photovoltaikelement, sowie Verfahren zur Herstellung eines solchen
CN104157705B (zh) * 2014-08-05 2017-08-04 京东方科技集团股份有限公司 一种阻隔膜层、具其的光电器件及光电器件的制作方法
CN206695063U (zh) 2014-09-03 2017-12-01 乐金显示有限公司 Oled立灯
WO2016059514A1 (en) 2014-10-17 2016-04-21 Semiconductor Energy Laboratory Co., Ltd. Electronic device
KR102439040B1 (ko) * 2014-12-01 2022-09-01 엘지디스플레이 주식회사 유기 발광 디스플레이 장치 및 이를 포함하는 롤러블 유기 발광 디스플레이 시스템
CN104538556B (zh) * 2014-12-03 2017-01-25 深圳市华星光电技术有限公司 柔性oled衬底及柔性oled封装方法
US9847509B2 (en) 2015-01-22 2017-12-19 Industrial Technology Research Institute Package of flexible environmental sensitive electronic device and sealing member
JP6383682B2 (ja) * 2015-02-26 2018-08-29 富士フイルム株式会社 有機エレクトロルミネッセンス装置
CN107624200A (zh) * 2015-04-29 2018-01-23 沙特基础工业全球技术公司 用于oled照明应用的密封方法
CN104993063A (zh) 2015-07-17 2015-10-21 京东方科技集团股份有限公司 一种封装件及其制作方法、oled装置
KR20170035055A (ko) * 2015-09-22 2017-03-30 코오롱인더스트리 주식회사 유연소자, 이의 제조방법 및 이의 제조장치
CN110268504A (zh) * 2016-11-06 2019-09-20 奥博泰克Lt太阳能公司 用于封装有机发光二极管的方法和设备
FR3061404B1 (fr) 2016-12-27 2022-09-23 Packaging Sip Procede de fabrication collective de modules electroniques hermetiques
CN108735913A (zh) * 2017-04-25 2018-11-02 群创光电股份有限公司 显示设备
US20180319131A1 (en) * 2017-05-03 2018-11-08 Switch Materials Inc. Packaged film assembly for lamination between substrates
US11335880B2 (en) 2017-12-07 2022-05-17 Sony Group Corporation Flexible display with protector along side surface
KR102480840B1 (ko) * 2018-01-31 2022-12-26 삼성디스플레이 주식회사 플렉서블 표시 장치 및 플렉서블 표시 장치의 제조 방법
CN108428804A (zh) * 2018-04-19 2018-08-21 武汉华星光电技术有限公司 Oled显示面板及其封装方法
CN109346623B (zh) * 2018-11-14 2020-12-29 信利（惠州）智能显示有限公司 Amoled显示产品封边方法、封边结构及显示产品
CN111200879B (zh) * 2018-11-16 2022-02-01 财团法人工业技术研究院 加热器封装体
JP7390668B2 (ja) * 2019-04-11 2023-12-04 パナソニックＩｐマネジメント株式会社 太陽電池モジュール
CN112509992B (zh) * 2020-11-30 2024-07-02 武汉天马微电子有限公司 一种显示面板、电子设备以及显示面板的制作方法
CN115509054B (zh) * 2021-06-07 2025-06-10 深圳市光羿科技有限公司 一种电致变色器件及其制备方法和应用
US20240288742A1 (en) * 2022-02-25 2024-08-29 E Ink Corporation Electro-optic displays with edge seal components and methods of making the same
WO2025259973A2 (en) 2024-06-14 2025-12-18 Materion Corporation Matrix of lid assemblies for electronic packages

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4352844A (en) * 1981-05-29 1982-10-05 W. R. Grace & Co. Thermoplastic film having improved handling and sealing characteristics and receptacle formed therefrom
JPH05242966A (ja) 1992-02-26 1993-09-21 Nec Kansai Ltd 電界発光灯及びその製造方法
US6704133B2 (en) * 1998-03-18 2004-03-09 E-Ink Corporation Electro-optic display overlays and systems for addressing such displays
US6081071A (en) * 1998-05-18 2000-06-27 Motorola, Inc. Electroluminescent apparatus and methods of manufacturing and encapsulating
US6080031A (en) * 1998-09-02 2000-06-27 Motorola, Inc. Methods of encapsulating electroluminescent apparatus
US6573652B1 (en) * 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
KR100720066B1 (ko) * 1999-11-09 2007-05-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 제작방법
US6867539B1 (en) * 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6537688B2 (en) * 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6576351B2 (en) * 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6624568B2 (en) * 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
US6737753B2 (en) * 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
US6655788B1 (en) * 2002-05-17 2003-12-02 Viztec Inc. Composite structure for enhanced flexibility of electro-optic displays with sliding layers
US7649674B2 (en) * 2002-06-10 2010-01-19 E Ink Corporation Electro-optic display with edge seal
CN1176565C (zh) * 2002-11-25 2004-11-17 清华大学 一种有机电致发光器件的封装层及其制备方法和应用
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7648925B2 (en) * 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
JP4342870B2 (ja) * 2003-08-11 2009-10-14 株式会社 日立ディスプレイズ 有機ｅｌ表示装置
KR100551121B1 (ko) * 2003-10-21 2006-02-13 엘지전자 주식회사 일렉트로 루미네센스 표시장치
US7541671B2 (en) * 2005-03-31 2009-06-02 General Electric Company Organic electronic devices having external barrier layer
US20060278965A1 (en) * 2005-06-10 2006-12-14 Foust Donald F Hermetically sealed package and methods of making the same
KR100719554B1 (ko) * 2005-07-06 2007-05-17 삼성에스디아이 주식회사 평판 디스플레이 장치 및 그 제조방법
TWI389271B (zh) * 2009-04-10 2013-03-11 財團法人工業技術研究院 環境敏感電子元件之封裝體及其封裝方法

Also Published As

Publication number Publication date
CN1957485B (zh) 2010-09-01
KR20060133018A (ko) 2006-12-22
JP2007531238A (ja) 2007-11-01
TW200603416A (en) 2006-01-16
WO2005104266A1 (en) 2005-11-03
US8405193B2 (en) 2013-03-26
US8633574B2 (en) 2014-01-21
CN1957485A (zh) 2007-05-02
KR20110124327A (ko) 2011-11-16
US20130248828A1 (en) 2013-09-26
TWI430454B (zh) 2014-03-11
US20050224935A1 (en) 2005-10-13
KR101194612B1 (ko) 2012-10-25

Similar Documents

Publication Publication Date Title
JP5198058B2 (ja) 縁部が気密封止された有機電子パッケージ及びその製造方法
JP5143728B2 (ja) 気密封止パッケージ
JP5840338B2 (ja) 外部バリア層を有する有機電子デバイス
JP5313328B2 (ja) 気密シールパーケージ用のゲッタ前駆体
US6835950B2 (en) Organic electronic devices with pressure sensitive adhesive layer
EP2374173B1 (en) Method for encapsulating environmentally sensitive devices
US20100148661A1 (en) Encapsulation structure and method of organic electroluminescence device
JP5532557B2 (ja) ガスバリア性シート、ガスバリア性シートの製造方法、封止体、及び有機ｅｌディスプレイ
US20170069876A1 (en) Optoelectronic component and method for producing an optoelectronic component
JP2005235743A (ja) 拡散障壁を有する複合材物品及び該物品を組み込んだ素子
KR20110040750A (ko) 밀폐된 광전 소자 및 그 제조 방법
CN111584741B (zh) 显示基板、显示装置及其封装方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100601

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100831

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20100831

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100831

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100907

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101201

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110125

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120829

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130206

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees