JP5197263B2 - 端子取付け構造及び端子取付け方法 - Google Patents

端子取付け構造及び端子取付け方法 Download PDF

Info

Publication number
JP5197263B2
JP5197263B2 JP2008236868A JP2008236868A JP5197263B2 JP 5197263 B2 JP5197263 B2 JP 5197263B2 JP 2008236868 A JP2008236868 A JP 2008236868A JP 2008236868 A JP2008236868 A JP 2008236868A JP 5197263 B2 JP5197263 B2 JP 5197263B2
Authority
JP
Japan
Prior art keywords
terminal
substrate
conductor
elastic
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008236868A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009105036A5 (https=
JP2009105036A (ja
Inventor
未来 米山
恒一郎 川手
研爾 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008236868A priority Critical patent/JP5197263B2/ja
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP09814919A priority patent/EP2340587A1/en
Priority to CN2009801364286A priority patent/CN102160240A/zh
Priority to US13/063,843 priority patent/US20110163569A1/en
Priority to CA2737276A priority patent/CA2737276A1/en
Priority to PCT/US2009/031879 priority patent/WO2010033259A1/en
Publication of JP2009105036A publication Critical patent/JP2009105036A/ja
Publication of JP2009105036A5 publication Critical patent/JP2009105036A5/ja
Application granted granted Critical
Publication of JP5197263B2 publication Critical patent/JP5197263B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2008236868A 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法 Expired - Fee Related JP5197263B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008236868A JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法
CN2009801364286A CN102160240A (zh) 2008-09-16 2009-01-23 端子安装结构和方法
US13/063,843 US20110163569A1 (en) 2007-10-01 2009-01-23 Terminal mounting structure and method
CA2737276A CA2737276A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method
EP09814919A EP2340587A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method
PCT/US2009/031879 WO2010033259A1 (en) 2008-09-16 2009-01-23 Terminal mounting structure and method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007257681 2007-10-01
JP2007257681 2007-10-01
JP2008236868A JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法

Publications (3)

Publication Number Publication Date
JP2009105036A JP2009105036A (ja) 2009-05-14
JP2009105036A5 JP2009105036A5 (https=) 2011-11-04
JP5197263B2 true JP5197263B2 (ja) 2013-05-15

Family

ID=40706486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008236868A Expired - Fee Related JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法

Country Status (2)

Country Link
US (1) US20110163569A1 (https=)
JP (1) JP5197263B2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5208816B2 (ja) * 2009-03-06 2013-06-12 日本板硝子株式会社 端子付ガラス及び端子付ガラス搭載車両
JP2012248419A (ja) 2011-05-27 2012-12-13 Three M Innovative Properties Co 端子
JP2012248425A (ja) 2011-05-27 2012-12-13 Three M Innovative Properties Co 端子
JP5764447B2 (ja) * 2011-09-26 2015-08-19 ミネベア株式会社 インナーロータ型ブラシレスモータ
EP2884589B1 (en) * 2012-08-10 2017-09-27 Asahi Glass Company, Limited Electrically connected structure, glass plate having terminal including said structure attached thereto, and manufacturing method for glass plate having terminal attached thereto
JP6079088B2 (ja) * 2012-09-21 2017-02-15 Smk株式会社 コネクタの端子構造
JP2014072101A (ja) * 2012-09-28 2014-04-21 3M Innovative Properties Co 端子および端子構造体
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US9521748B1 (en) 2013-12-09 2016-12-13 Multek Technologies, Ltd. Mechanical measures to limit stress and strain in deformable electronics
US10960609B2 (en) 2014-02-25 2021-03-30 Pilkington Group Limited Method of making a window assembly having an electrically heated portion and the window assembly made thereby
JP6417764B2 (ja) * 2014-07-24 2018-11-07 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体
US10154583B1 (en) 2015-03-27 2018-12-11 Flex Ltd Mechanical strain reduction on flexible and rigid-flexible circuits
WO2017078162A1 (ja) * 2015-11-05 2017-05-11 旭硝子株式会社 電気接続構造、端子付きガラス板、及び端子付きガラス板の製造方法
US9992880B2 (en) 2015-11-12 2018-06-05 Multek Technologies Limited Rigid-bend printed circuit board fabrication
US20170194721A1 (en) * 2016-01-06 2017-07-06 Chih-Peng Fan Electrical Connector and Method of Making It
DE112018007110B4 (de) * 2018-02-19 2025-08-07 Mitsubishi Electric Corporation Leitungsstruktur
DE102018203523B4 (de) * 2018-03-08 2023-11-16 Magna Car Top Systems Gmbh Heckscheibe mit Heckscheibenheizung für ein Kraftfahrzeug, insbesondere ein Cabriolet-Fahrzeug und deren Herstellungsverfahren
GB201817357D0 (en) * 2018-10-25 2018-12-12 Strip Tinning Ltd Flexible connector
LU101059B1 (en) * 2018-12-17 2020-06-17 Iee Sa Flexible Multilayer Encapsulation of Electrical Connections
CN112970153B (zh) 2018-11-07 2023-08-08 Iee国际电子工程股份公司 电连接柔性多层封装
DE102020004282A1 (de) * 2019-07-24 2021-01-28 AGC lnc. Elektrische verbindungsstruktur
CN112703061A (zh) * 2019-08-13 2021-04-23 法国圣戈班玻璃厂 减少玻璃基底上银丝的腐蚀
KR102847235B1 (ko) 2020-06-17 2025-08-14 주식회사 엘지에너지솔루션 버스바와 전압 센싱부재의 연결구조로서 비용접 방식 구조가 적용된 배터리 모듈
CN114130610A (zh) * 2021-11-24 2022-03-04 福建省睿步智能装备有限公司 一种旅行箱饰件自动涂胶保压固化设备
US12424807B2 (en) 2022-07-08 2025-09-23 Agc Automotive Americas Co. Method of manufacturing a window assembly with a solderless electrical connector

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810970Y2 (ja) * 1990-09-18 1996-03-29 日本板硝子株式会社 シート状アンテナとフィーダ線との接続構造
JP2002111346A (ja) * 2000-10-02 2002-04-12 Fujikura Ltd フィルムセンサ
JP2004079527A (ja) * 2002-08-01 2004-03-11 Fuji Name Plate Kk 面状ヒータ用電源供給端子及び該面状ヒータ用電源供給端子を備えた面状ヒータ
JP2005347172A (ja) * 2004-06-04 2005-12-15 Asahi Glass Co Ltd ガラス板の電気接続構造
JP2007018981A (ja) * 2005-07-11 2007-01-25 Nippon Sheet Glass Co Ltd 窓ガラスへの端子取付け構造

Also Published As

Publication number Publication date
US20110163569A1 (en) 2011-07-07
JP2009105036A (ja) 2009-05-14

Similar Documents

Publication Publication Date Title
JP5197263B2 (ja) 端子取付け構造及び端子取付け方法
JP6443632B2 (ja) 回路構成体、及び電気接続箱
EP0272707B1 (en) Flexible printed circuit board terminal structure
CN105612661B (zh) 端子构造体和车辆用玻璃体
JP6443688B2 (ja) 回路構成体、及び電気接続箱
CA2737276A1 (en) Terminal mounting structure and method
JP5240982B2 (ja) 熱コンジット
CN214505803U (zh) 电路板连接系统和电路板组件
JP5292827B2 (ja) 半導体装置の製造方法及び半導体装置の製造装置
JP5276455B2 (ja) 光半導体装置モジュール
JP2006324181A (ja) 面状発熱体
JP4617698B2 (ja) 面状発熱体
JP2003142821A (ja) プリント基板の接続方法および接続構造
JP4828361B2 (ja) 電気接点への半田上がり防止方法及び該防止方法を用いた電気接点
JP2007227452A (ja) フレキシブル配線基板及びそのはんだ接合方法並びにこれを用いた光送信パッケージ
JP2002025653A (ja) フレキシブル基板の端子構造及びその製造方法
JP2015082890A (ja) 回路構成体、電気接続箱及び回路構成体の製造方法
JP2013197041A (ja) フラット配線材、及びそれを用いた実装体
JP2017191863A (ja) 半導体装置
JP4558473B2 (ja) 端子付き平面回路およびその製造方法
JP2010176967A (ja) 電線接続端子並びに電線接続端子を用いた電線接続方法、電線接続構造および電磁継電器
JP2025091450A (ja) 電気コネクタ端子
JPH065633B2 (ja) 配線基板とコネクタとの接続方法
JP2002203705A (ja) 抵抗発熱体
JP3293348B2 (ja) コネクタピン接続装置及びその組立方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110916

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110916

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130108

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130205

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5197263

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees