JP5197263B2 - 端子取付け構造及び端子取付け方法 - Google Patents
端子取付け構造及び端子取付け方法 Download PDFInfo
- Publication number
- JP5197263B2 JP5197263B2 JP2008236868A JP2008236868A JP5197263B2 JP 5197263 B2 JP5197263 B2 JP 5197263B2 JP 2008236868 A JP2008236868 A JP 2008236868A JP 2008236868 A JP2008236868 A JP 2008236868A JP 5197263 B2 JP5197263 B2 JP 5197263B2
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- JP
- Japan
- Prior art keywords
- terminal
- substrate
- conductor
- elastic
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/515—Terminal blocks providing connections to wires or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
2 導体
3 端子
31 固定部
32 弾性部
33 基板接触部
4 両面接着テープ
5 液状樹脂
Claims (4)
- 表面に導体が形成された基板に端子を取付けるための端子取付け構造であって、
前記端子は、前記基板上に固着される固定部と、該固定部から延在する弾性部と、該固定部から離れた該弾性部の部位に自由端として設けられ、前記基板の前記導体に電気的に接続された基板接触部とを備え、
前記端子の前記固定部が接合手段によって前記基板に固着され、
前記端子の前記基板接触部が前記弾性部の弾性変位による反発力で前記導体に接触している状態で、前記端子の前記固定部が接着剤によって前記基板に接着されている、
端子取付け構造。 - 前記基板接触部が凸状に曲げられた凸部を備え、該凸部の頂点部分が前記基材の前記導体との電気的な接点部となっている、請求項1に記載の端子取付け構造。
- 表面に導体が形成された基板に端子を取付けるための端子取付け構造であって、
前記端子は、前記基板上に固着される固定部と、該固定部から延在する弾性部と、該固定部から離れた該弾性部の部位に設けられ、前記基板の前記導体に電気的に接続された基板接触部とを備え、
前記端子の前記固定部が接合手段によって前記基板に固着され、
前記端子の前記基板接触部が前記弾性部の弾性変位による反発力で前記導体に接触している状態で、前記端子の前記基板接触部が接着剤によって前記基板に接着されている、
端子取付け構造。 - 請求項1〜3のいずれか1項に記載の端子取付け構造を備えた、自動車用ウインドウ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008236868A JP5197263B2 (ja) | 2007-10-01 | 2008-09-16 | 端子取付け構造及び端子取付け方法 |
CA2737276A CA2737276A1 (en) | 2008-09-16 | 2009-01-23 | Terminal mounting structure and method |
CN2009801364286A CN102160240A (zh) | 2008-09-16 | 2009-01-23 | 端子安装结构和方法 |
EP09814919A EP2340587A1 (en) | 2008-09-16 | 2009-01-23 | Terminal mounting structure and method |
US13/063,843 US20110163569A1 (en) | 2007-10-01 | 2009-01-23 | Terminal mounting structure and method |
PCT/US2009/031879 WO2010033259A1 (en) | 2008-09-16 | 2009-01-23 | Terminal mounting structure and method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007257681 | 2007-10-01 | ||
JP2007257681 | 2007-10-01 | ||
JP2008236868A JP5197263B2 (ja) | 2007-10-01 | 2008-09-16 | 端子取付け構造及び端子取付け方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009105036A JP2009105036A (ja) | 2009-05-14 |
JP2009105036A5 JP2009105036A5 (ja) | 2011-11-04 |
JP5197263B2 true JP5197263B2 (ja) | 2013-05-15 |
Family
ID=40706486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008236868A Expired - Fee Related JP5197263B2 (ja) | 2007-10-01 | 2008-09-16 | 端子取付け構造及び端子取付け方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110163569A1 (ja) |
JP (1) | JP5197263B2 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5208816B2 (ja) * | 2009-03-06 | 2013-06-12 | 日本板硝子株式会社 | 端子付ガラス及び端子付ガラス搭載車両 |
JP2012248419A (ja) | 2011-05-27 | 2012-12-13 | Three M Innovative Properties Co | 端子 |
JP2012248425A (ja) | 2011-05-27 | 2012-12-13 | Three M Innovative Properties Co | 端子 |
JP5764447B2 (ja) * | 2011-09-26 | 2015-08-19 | ミネベア株式会社 | インナーロータ型ブラシレスモータ |
JP6070707B2 (ja) * | 2012-08-10 | 2017-02-01 | 旭硝子株式会社 | 電気接続構造及びそれを有する端子付きガラス板、並びに端子付きガラス板の製造方法 |
JP6079088B2 (ja) * | 2012-09-21 | 2017-02-15 | Smk株式会社 | コネクタの端子構造 |
JP2014072101A (ja) * | 2012-09-28 | 2014-04-21 | 3M Innovative Properties Co | 端子および端子構造体 |
US9521748B1 (en) | 2013-12-09 | 2016-12-13 | Multek Technologies, Ltd. | Mechanical measures to limit stress and strain in deformable electronics |
US9338915B1 (en) | 2013-12-09 | 2016-05-10 | Flextronics Ap, Llc | Method of attaching electronic module on fabrics by stitching plated through holes |
WO2015128625A1 (en) * | 2014-02-25 | 2015-09-03 | Pilkington Group Limited | Method of making a window assembly having an electrically heated portion and the window assembly made thereby |
JP6417764B2 (ja) * | 2014-07-24 | 2018-11-07 | セイコーエプソン株式会社 | 電子部品、電子部品の製造方法、電子機器、および移動体 |
US10154583B1 (en) | 2015-03-27 | 2018-12-11 | Flex Ltd | Mechanical strain reduction on flexible and rigid-flexible circuits |
EP3373394B1 (en) * | 2015-11-05 | 2020-05-06 | AGC Inc. | Electric connection structure and method for manufacturing electric connection structure |
US9992880B2 (en) | 2015-11-12 | 2018-06-05 | Multek Technologies Limited | Rigid-bend printed circuit board fabrication |
US20170194721A1 (en) * | 2016-01-06 | 2017-07-06 | Chih-Peng Fan | Electrical Connector and Method of Making It |
US11228122B2 (en) | 2018-02-19 | 2022-01-18 | Mitsubishi Electric Corporation | Electrical conduction structure for shielding and an electronic device using the same |
DE102018203523B4 (de) * | 2018-03-08 | 2023-11-16 | Magna Car Top Systems Gmbh | Heckscheibe mit Heckscheibenheizung für ein Kraftfahrzeug, insbesondere ein Cabriolet-Fahrzeug und deren Herstellungsverfahren |
GB201817357D0 (en) * | 2018-10-25 | 2018-12-12 | Strip Tinning Ltd | Flexible connector |
DE112019005566T5 (de) | 2018-11-07 | 2021-07-29 | Iee International Electronics & Engineering S.A. | Flexible Mehrschichtkapselung von elektrischen Verbindungen |
LU101059B1 (en) * | 2018-12-17 | 2020-06-17 | Iee Sa | Flexible Multilayer Encapsulation of Electrical Connections |
DE102020004282A1 (de) * | 2019-07-24 | 2021-01-28 | AGC lnc. | Elektrische verbindungsstruktur |
KR20220034846A (ko) * | 2019-08-13 | 2022-03-18 | 쌩-고벵 글래스 프랑스 | 유리 기판 상의 은 와이어 부식 감소 |
KR20210156089A (ko) * | 2020-06-17 | 2021-12-24 | 주식회사 엘지에너지솔루션 | 버스바와 전압 센싱부재의 연결구조로서 비용접 방식 구조가 적용된 배터리 모듈 |
CN114130610A (zh) * | 2021-11-24 | 2022-03-04 | 福建省睿步智能装备有限公司 | 一种旅行箱饰件自动涂胶保压固化设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0810970Y2 (ja) * | 1990-09-18 | 1996-03-29 | 日本板硝子株式会社 | シート状アンテナとフィーダ線との接続構造 |
JP2002111346A (ja) * | 2000-10-02 | 2002-04-12 | Fujikura Ltd | フィルムセンサ |
JP2004079527A (ja) * | 2002-08-01 | 2004-03-11 | Fuji Name Plate Kk | 面状ヒータ用電源供給端子及び該面状ヒータ用電源供給端子を備えた面状ヒータ |
JP2005347172A (ja) * | 2004-06-04 | 2005-12-15 | Asahi Glass Co Ltd | ガラス板の電気接続構造 |
JP2007018981A (ja) * | 2005-07-11 | 2007-01-25 | Nippon Sheet Glass Co Ltd | 窓ガラスへの端子取付け構造 |
-
2008
- 2008-09-16 JP JP2008236868A patent/JP5197263B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-23 US US13/063,843 patent/US20110163569A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20110163569A1 (en) | 2011-07-07 |
JP2009105036A (ja) | 2009-05-14 |
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