JP5276455B2 - 光半導体装置モジュール - Google Patents
光半導体装置モジュール Download PDFInfo
- Publication number
- JP5276455B2 JP5276455B2 JP2009012819A JP2009012819A JP5276455B2 JP 5276455 B2 JP5276455 B2 JP 5276455B2 JP 2009012819 A JP2009012819 A JP 2009012819A JP 2009012819 A JP2009012819 A JP 2009012819A JP 5276455 B2 JP5276455 B2 JP 5276455B2
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- JP
- Japan
- Prior art keywords
- electrode pattern
- semiconductor device
- optical semiconductor
- substrate
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
12a、12b:リードフレーム
13a、13b:板ばね
14a、14b:ねじ
21:LED搭載基板
22:絶縁層
23:レジスト層
24a、24b:電極パターン層
241:楕円形穴
241’:四角形穴
242:突起
25a、25b:螺穴
26a、26b:貫通孔
27:熱伝導性接着剤
6a、6b:通電基板
61:電極パターン層
611:突起
612:楕円形孔
7:押え部材
Claims (4)
- 上面に発光部を有する光半導体装置と、
該光半導体装置を搭載し、該光半導体装置に接続される第1の電極パターン層を有する光半導体装置搭載基板と、
第2の電極パターン層を有する通電基板と、
該通電基板を前記光半導体装置搭載基板に固定するための押え部材と
を具備し、
前記第1、第2の電極パターン層の一方に突起を設けると共に該第1、第2の電極パターン層の他方に穴を設け、
前記突起を前記穴に圧入することにより前記第1の電極パターン層と前記第2の電極パターン層とを接合させるようにした光半導体装置モジュール。 - 前記押え部材が前記光半導体装置搭載基板の貫通孔を通り該光半導体装置搭載基板の裏面で引っかかるようにした請求項1に記載の光半導体装置モジュール。
- 前記突起の表面上及び前記穴の表面上に同一の金属皮膜を設けてある請求項1に記載の光半導体装置モジュール。
- 前記金属皮膜が金(Au)よりなる請求項3に記載の光半導体装置モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009012819A JP5276455B2 (ja) | 2009-01-23 | 2009-01-23 | 光半導体装置モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009012819A JP5276455B2 (ja) | 2009-01-23 | 2009-01-23 | 光半導体装置モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010171234A JP2010171234A (ja) | 2010-08-05 |
JP5276455B2 true JP5276455B2 (ja) | 2013-08-28 |
Family
ID=42703070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009012819A Expired - Fee Related JP5276455B2 (ja) | 2009-01-23 | 2009-01-23 | 光半導体装置モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5276455B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8568819B2 (en) | 2008-09-26 | 2013-10-29 | Nippon Suisan Kaisha, Ltd. | Solid composition containing lipids from crustaceans |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6274975B2 (ja) * | 2014-06-06 | 2018-02-07 | 株式会社フジクラ | 酸化物超電導線材の接続構造体の製造方法、及び酸化物超電導線材の接続構造体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5996857A (ja) * | 1982-11-24 | 1984-06-04 | Nippon Radiator Co Ltd | 扁平モ−タにおけるアマチユアのアンバランス修正方法 |
US4631431A (en) * | 1984-07-30 | 1986-12-23 | Priam Corporation | Linear motor having improved magnetic characteristics |
US6333522B1 (en) * | 1997-01-31 | 2001-12-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor |
DE19715093C2 (de) * | 1997-04-11 | 1999-05-27 | Hermann Stahl Gmbh | Träger zum mechanischen Halten und elektrischen Verbinden elektronischer Bauelemente, insbesondere von Leuchtdioden, sowie Verfahren zum elektrisch leitenden Verbinden der Bauelemente auf einem Träger |
JP4662361B2 (ja) * | 2006-01-23 | 2011-03-30 | 株式会社小糸製作所 | 光源モジュール |
JP4793169B2 (ja) * | 2006-08-24 | 2011-10-12 | 日立電線株式会社 | 接続体および光送受信モジュール |
TWI363432B (en) * | 2007-02-26 | 2012-05-01 | Everlight Electronics Co Ltd | A structure of a light emitting diode and a method to assemble thereof |
-
2009
- 2009-01-23 JP JP2009012819A patent/JP5276455B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8568819B2 (en) | 2008-09-26 | 2013-10-29 | Nippon Suisan Kaisha, Ltd. | Solid composition containing lipids from crustaceans |
Also Published As
Publication number | Publication date |
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JP2010171234A (ja) | 2010-08-05 |
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