JP5190303B2 - 搬送装置及び処理装置 - Google Patents

搬送装置及び処理装置 Download PDF

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Publication number
JP5190303B2
JP5190303B2 JP2008146588A JP2008146588A JP5190303B2 JP 5190303 B2 JP5190303 B2 JP 5190303B2 JP 2008146588 A JP2008146588 A JP 2008146588A JP 2008146588 A JP2008146588 A JP 2008146588A JP 5190303 B2 JP5190303 B2 JP 5190303B2
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Japan
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JP2008146588A
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English (en)
Japanese (ja)
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JP2009292570A (ja
Inventor
秀樹 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008146588A priority Critical patent/JP5190303B2/ja
Priority to TW98118376A priority patent/TWI469904B/zh
Priority to KR1020090049046A priority patent/KR101188487B1/ko
Priority to CN2009101427978A priority patent/CN101599449B/zh
Publication of JP2009292570A publication Critical patent/JP2009292570A/ja
Application granted granted Critical
Publication of JP5190303B2 publication Critical patent/JP5190303B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008146588A 2008-06-04 2008-06-04 搬送装置及び処理装置 Active JP5190303B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008146588A JP5190303B2 (ja) 2008-06-04 2008-06-04 搬送装置及び処理装置
TW98118376A TWI469904B (zh) 2008-06-04 2009-06-03 Handling device and handling device
KR1020090049046A KR101188487B1 (ko) 2008-06-04 2009-06-03 반송 장치 및 처리 장치
CN2009101427978A CN101599449B (zh) 2008-06-04 2009-06-04 搬送装置以及处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008146588A JP5190303B2 (ja) 2008-06-04 2008-06-04 搬送装置及び処理装置

Publications (2)

Publication Number Publication Date
JP2009292570A JP2009292570A (ja) 2009-12-17
JP5190303B2 true JP5190303B2 (ja) 2013-04-24

Family

ID=41420826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008146588A Active JP5190303B2 (ja) 2008-06-04 2008-06-04 搬送装置及び処理装置

Country Status (4)

Country Link
JP (1) JP5190303B2 (zh)
KR (1) KR101188487B1 (zh)
CN (1) CN101599449B (zh)
TW (1) TWI469904B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6523838B2 (ja) * 2015-07-15 2019-06-05 東京エレクトロン株式会社 プローブカード搬送装置、プローブカード搬送方法及びプローブ装置
CN105110006B (zh) * 2015-09-10 2017-06-09 京东方科技集团股份有限公司 一种机械手臂及基板的转运方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
JP4319504B2 (ja) 2003-10-06 2009-08-26 東京エレクトロン株式会社 基板搬送装置および基板処理システム
JP4495509B2 (ja) * 2004-04-30 2010-07-07 株式会社ダイヘン トランスファロボット
JP2007054939A (ja) * 2005-08-26 2007-03-08 Mitsubishi Electric Corp 産業用ロボット及びその輸送方法
JP4754304B2 (ja) * 2005-09-02 2011-08-24 東京エレクトロン株式会社 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
JP2007186321A (ja) 2006-01-16 2007-07-26 Murata Mach Ltd 板材の搬送システム
CN101888959B (zh) * 2007-12-05 2013-07-03 平田机工株式会社 基板输送装置及基板输送装置的控制方法

Also Published As

Publication number Publication date
JP2009292570A (ja) 2009-12-17
TWI469904B (zh) 2015-01-21
KR20090127082A (ko) 2009-12-09
CN101599449B (zh) 2011-09-07
TW201012726A (en) 2010-04-01
CN101599449A (zh) 2009-12-09
KR101188487B1 (ko) 2012-10-05

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