KR101188487B1 - 반송 장치 및 처리 장치 - Google Patents

반송 장치 및 처리 장치 Download PDF

Info

Publication number
KR101188487B1
KR101188487B1 KR1020090049046A KR20090049046A KR101188487B1 KR 101188487 B1 KR101188487 B1 KR 101188487B1 KR 1020090049046 A KR1020090049046 A KR 1020090049046A KR 20090049046 A KR20090049046 A KR 20090049046A KR 101188487 B1 KR101188487 B1 KR 101188487B1
Authority
KR
South Korea
Prior art keywords
pick
slide
slide base
base
conveying device
Prior art date
Application number
KR1020090049046A
Other languages
English (en)
Korean (ko)
Other versions
KR20090127082A (ko
Inventor
고마다 히데키
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090127082A publication Critical patent/KR20090127082A/ko
Application granted granted Critical
Publication of KR101188487B1 publication Critical patent/KR101188487B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090049046A 2008-06-04 2009-06-03 반송 장치 및 처리 장치 KR101188487B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-146588 2008-06-04
JP2008146588A JP5190303B2 (ja) 2008-06-04 2008-06-04 搬送装置及び処理装置

Publications (2)

Publication Number Publication Date
KR20090127082A KR20090127082A (ko) 2009-12-09
KR101188487B1 true KR101188487B1 (ko) 2012-10-05

Family

ID=41420826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090049046A KR101188487B1 (ko) 2008-06-04 2009-06-03 반송 장치 및 처리 장치

Country Status (4)

Country Link
JP (1) JP5190303B2 (zh)
KR (1) KR101188487B1 (zh)
CN (1) CN101599449B (zh)
TW (1) TWI469904B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6523838B2 (ja) * 2015-07-15 2019-06-05 東京エレクトロン株式会社 プローブカード搬送装置、プローブカード搬送方法及びプローブ装置
CN105110006B (zh) * 2015-09-10 2017-06-09 京东方科技集团股份有限公司 一种机械手臂及基板的转运方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116665A (ja) 2003-10-06 2005-04-28 Tokyo Electron Ltd 基板搬送装置および基板処理システム
JP2007186321A (ja) 2006-01-16 2007-07-26 Murata Mach Ltd 板材の搬送システム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
JP4302575B2 (ja) * 2003-05-30 2009-07-29 東京エレクトロン株式会社 基板搬送装置および真空処理装置
JP4495509B2 (ja) * 2004-04-30 2010-07-07 株式会社ダイヘン トランスファロボット
JP2007054939A (ja) * 2005-08-26 2007-03-08 Mitsubishi Electric Corp 産業用ロボット及びその輸送方法
JP4754304B2 (ja) * 2005-09-02 2011-08-24 東京エレクトロン株式会社 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
KR101218112B1 (ko) * 2007-12-05 2013-01-21 히라따기꼬오 가부시키가이샤 기판 반송 장치 및 기판 반송 장치의 제어 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116665A (ja) 2003-10-06 2005-04-28 Tokyo Electron Ltd 基板搬送装置および基板処理システム
JP2007186321A (ja) 2006-01-16 2007-07-26 Murata Mach Ltd 板材の搬送システム

Also Published As

Publication number Publication date
KR20090127082A (ko) 2009-12-09
JP2009292570A (ja) 2009-12-17
TWI469904B (zh) 2015-01-21
CN101599449A (zh) 2009-12-09
JP5190303B2 (ja) 2013-04-24
CN101599449B (zh) 2011-09-07
TW201012726A (en) 2010-04-01

Similar Documents

Publication Publication Date Title
JP5013987B2 (ja) 基板処理装置および基板搬送装置
KR100853573B1 (ko) 기판 처리 장치 및 기판 처리 시스템
JP4754304B2 (ja) 基板処理装置、ロードロック室ユニット、および搬送装置の搬出方法
US6565662B2 (en) Vacuum processing apparatus for semiconductor process
JP5482500B2 (ja) 基板処理装置
KR100951149B1 (ko) 기판 처리 장치, 기판 반송 방법 및 컴퓨터 프로그램을기록한 기록 매체
KR101299843B1 (ko) 처리 장치 및 그 메인테넌스 방법
WO2012086164A1 (ja) 搬送ロボット、その基板搬送方法、及び基板搬送中継装置
JP4023543B2 (ja) 基板搬送装置および基板搬送方法ならびに真空処理装置
TWI397495B (zh) A substrate transfer device and a substrate support
TWI391724B (zh) Processing chamber and processing device
JP4928562B2 (ja) ロボット装置およびこれを備えた処理装置、処理システム、処理方法
JP2006128714A (ja) 真空処理室の蓋体開閉機構および蓋体開閉方法
JP4841035B2 (ja) 真空処理装置
KR101188487B1 (ko) 반송 장치 및 처리 장치
WO2012108439A1 (ja) 基板中継装置，基板中継方法，基板処理装置
JP2010010259A (ja) 真空処理装置
CN113169107A (zh) 装载锁定腔室
JP2004221610A (ja) 半導体処理装置
JP2005333076A (ja) ロードロック装置、処理システム及びその使用方法
WO2020122133A1 (ja) 基板搬送装置
KR20050045821A (ko) 로드락 장치 및 이를 설치한 로드락 챔버
JP2007217756A (ja) 真空装置
JPH0556953U (ja) 基板処理装置
JP2695402C (zh)

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20120125

Effective date: 20120523

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150827

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20160831

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20170830

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20180920

Year of fee payment: 7