JP5186785B2 - 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム - Google Patents

光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム Download PDF

Info

Publication number
JP5186785B2
JP5186785B2 JP2007077566A JP2007077566A JP5186785B2 JP 5186785 B2 JP5186785 B2 JP 5186785B2 JP 2007077566 A JP2007077566 A JP 2007077566A JP 2007077566 A JP2007077566 A JP 2007077566A JP 5186785 B2 JP5186785 B2 JP 5186785B2
Authority
JP
Japan
Prior art keywords
marker
optical element
mounting
optical waveguide
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007077566A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008241732A5 (enExample
JP2008241732A (ja
Inventor
真也 渡邊
充 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2007077566A priority Critical patent/JP5186785B2/ja
Priority to CA002622272A priority patent/CA2622272A1/en
Priority to EP08102509A priority patent/EP1972975B1/en
Priority to TW097109767A priority patent/TW200907443A/zh
Priority to US12/051,917 priority patent/US7881580B2/en
Priority to KR1020080026199A priority patent/KR100935740B1/ko
Priority to CN2008100872508A priority patent/CN101271175B/zh
Publication of JP2008241732A publication Critical patent/JP2008241732A/ja
Publication of JP2008241732A5 publication Critical patent/JP2008241732A5/ja
Application granted granted Critical
Publication of JP5186785B2 publication Critical patent/JP5186785B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
JP2007077566A 2007-03-23 2007-03-23 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム Expired - Fee Related JP5186785B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007077566A JP5186785B2 (ja) 2007-03-23 2007-03-23 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム
CA002622272A CA2622272A1 (en) 2007-03-23 2008-02-26 Optical waveguide device and manufacturing method for optical waveguide device
EP08102509A EP1972975B1 (en) 2007-03-23 2008-03-11 Optical module and manufacturing method thereof
US12/051,917 US7881580B2 (en) 2007-03-23 2008-03-20 Optical waveguide device and manufacturing method for optical waveguide device
TW097109767A TW200907443A (en) 2007-03-23 2008-03-20 Optical waveguide device and manufacturing method for optical waveguide device
KR1020080026199A KR100935740B1 (ko) 2007-03-23 2008-03-21 광 도파관 소자 및 광 도파관 소자의 제조 방법
CN2008100872508A CN101271175B (zh) 2007-03-23 2008-03-24 光波导器件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007077566A JP5186785B2 (ja) 2007-03-23 2007-03-23 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム

Publications (3)

Publication Number Publication Date
JP2008241732A JP2008241732A (ja) 2008-10-09
JP2008241732A5 JP2008241732A5 (enExample) 2010-01-21
JP5186785B2 true JP5186785B2 (ja) 2013-04-24

Family

ID=39531388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007077566A Expired - Fee Related JP5186785B2 (ja) 2007-03-23 2007-03-23 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム

Country Status (7)

Country Link
US (1) US7881580B2 (enExample)
EP (1) EP1972975B1 (enExample)
JP (1) JP5186785B2 (enExample)
KR (1) KR100935740B1 (enExample)
CN (1) CN101271175B (enExample)
CA (1) CA2622272A1 (enExample)
TW (1) TW200907443A (enExample)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186785B2 (ja) 2007-03-23 2013-04-24 日本電気株式会社 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム
US20100183266A1 (en) * 2007-06-14 2010-07-22 Kazuya Shimoda Optical module and method for manufacturing the same
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
CH700471B1 (de) 2009-02-17 2013-07-31 Vario Optics Ag Verfahren zur Herstellung einer elektro-optischen Leiterplatte mit Lichtwellenleiterstrukturen.
US9217831B1 (en) * 2009-12-15 2015-12-22 Kotura, Inc. Optical system having dynamic waveguide alignment
JP5449041B2 (ja) * 2010-06-09 2014-03-19 シチズンホールディングス株式会社 光デバイスの製造方法
US8262297B2 (en) * 2010-07-30 2012-09-11 Tyco Electronics Corporation Body having a dedicated lens for imaging an alignment feature
US8977088B2 (en) 2010-07-30 2015-03-10 Tyco-Electronics Corporation Interposer with alignment features
CN103270443B (zh) * 2010-12-21 2015-07-08 日本电气株式会社 光学模块及其制造方法
TWI506313B (zh) * 2011-12-27 2015-11-01 Hon Hai Prec Ind Co Ltd 光纖耦合連接裝置
KR101874429B1 (ko) * 2012-02-02 2018-08-03 삼성디스플레이 주식회사 표시장치 및 그 제조방법
JP6214968B2 (ja) * 2012-08-27 2017-10-18 シチズン時計株式会社 光デバイス
EP2891174B1 (en) * 2012-08-31 2019-08-14 Semiconductor Technologies & Instruments Pte Ltd. System and method for automatically correcting for rotational misalignment of wafers on film frames
CN103837949A (zh) * 2012-11-26 2014-06-04 鸿富锦精密工业（深圳）有限公司 光纤连接器电路基板及光纤连接器
CN102980109B (zh) * 2012-12-10 2015-07-01 京东方科技集团股份有限公司 背光源及背光源的组装方法
CN103066148B (zh) * 2012-12-28 2015-05-20 武汉电信器件有限公司 一种硅上二氧化硅基的混合集成光电子芯片及其制作方法
CN103969762A (zh) * 2013-01-31 2014-08-06 鸿富锦精密工业（深圳）有限公司 光通讯模组
KR101443562B1 (ko) 2013-03-27 2014-11-03 옵티시스 주식회사 광 커넥터
JP2015038601A (ja) * 2013-07-18 2015-02-26 シチズンホールディングス株式会社 接合装置および接合方法
US9618709B2 (en) * 2013-10-22 2017-04-11 Oracle International Corporation Hybrid integration of edge-coupled chips
US9099145B1 (en) * 2013-12-24 2015-08-04 Western Digital (Fremont), Llc High contrast alignment marker
JP5738394B2 (ja) * 2013-12-24 2015-06-24 シチズンホールディングス株式会社 光デバイスの製造方法
US9417411B2 (en) * 2014-02-21 2016-08-16 Aurrion, Inc. Optical and thermal interface for photonic integrated circuits
CN113064236B (zh) 2015-03-16 2022-11-01 加利福尼亚太平洋生物科学股份有限公司 用于自由空间光耦合的集成装置及系统
AU2016276980B2 (en) 2015-06-12 2021-09-23 Pacific Biosciences Of California, Inc. Integrated target waveguide devices and systems for optical coupling
DE102015219056B4 (de) * 2015-10-01 2018-05-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Halbleiterlichtquelle und Verfahren zur Herstellung einer Halbleiterlichtquelle
KR102296074B1 (ko) * 2017-05-19 2021-08-31 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN108054182B (zh) * 2017-12-19 2024-04-12 苏州矩阵光电有限公司 一种化合物半导体硅基混合器件及其制备方法
CN107845326A (zh) * 2017-12-19 2018-03-27 中铁第四勘察设计院集团有限公司 高速铁路钢轨伸缩调节器位移识别标识牌及测量方法
WO2019238840A1 (de) 2018-06-15 2019-12-19 Continental Automotive Gmbh Head-up-display mit exakt ausgerichteten lichtwellenleitern
SG10201904770SA (en) * 2019-05-27 2020-12-30 Advanced Micro Foundry Pte Ltd Improvements in or relating to photonic integrated circuits
DE102019211002B4 (de) * 2019-07-19 2024-01-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optisches system und verfahren zum herstellen eines optischen systems
JP7645857B2 (ja) * 2020-02-14 2025-03-14 古河電気工業株式会社 半導体光デバイスおよび半導体光デバイスの製造方法
US12535420B2 (en) 2020-02-18 2026-01-27 Pacific Biosciences Of California, Inc. Highly multiplexed nucleic acid sequencing systems
CN113555449B (zh) * 2020-04-03 2024-03-15 华为技术有限公司 半导体器件及其制备方法和通信设备
WO2022063410A1 (de) * 2020-09-25 2022-03-31 ficonTec Service GmbH Verfahren und vorrichtung zur montage einer halbleiterlichtquelle auf einem integrierten optischen schaltkreis
US11888286B2 (en) * 2020-10-21 2024-01-30 Marvell Asia Pte Ltd Laser chip for flip-chip bonding on silicon photonics chips
US11393698B2 (en) * 2020-12-18 2022-07-19 STATS ChipPAC Pte. Ltd. Mask design for improved attach position
CN112693947B (zh) * 2020-12-21 2022-09-27 江苏迪盛智能科技有限公司 拉料偏差处理方法、装置、电子设备和存储介质
JP7551790B2 (ja) * 2021-01-29 2024-09-17 京セラ株式会社 光回路基板およびそれを用いた電子部品実装構造体
GB202103138D0 (en) * 2021-03-05 2021-04-21 Sivers Photonics Ltd Photonic device with fiducial marks for alignment of an optical component
CN114242636B (zh) * 2021-12-16 2025-01-28 武汉光谷信息光电子创新中心有限公司 半导体器件的对准方法及其对准系统
US12690412B2 (en) * 2024-05-07 2026-07-21 International Business Machines Corporation Verifying alignment of multiple die on a substrate
CN121642739A (zh) * 2024-09-02 2026-03-10 华为技术有限公司 芯片封装结构及其制作方法
CN119717129B (zh) * 2025-02-27 2025-11-28 泉州市三安光通讯科技有限公司 一种混合光电集成芯片及制作方法，激光器芯片
CN121763506A (zh) * 2025-11-25 2026-03-31 安徽光纤光缆传输技术研究所(中国电子科技集团公司第八研究所) 一种光电互联模块高精度组装、多通道耦合方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976642B2 (ja) * 1991-11-07 1999-11-10 日本電気株式会社 光結合回路
JP3085440B2 (ja) * 1994-09-12 2000-09-11 株式会社日立製作所 光アッセンブリの製造方法
JPH08111600A (ja) * 1994-10-07 1996-04-30 Nippon Telegr & Teleph Corp <Ntt> 高精度実装用マーカー、高精度実装装置および高精度実装方法
JP3205967B2 (ja) * 1994-10-12 2001-09-04 日立電線株式会社 単一モード光導波路型モジュールの製造方法
JP2823044B2 (ja) * 1996-05-14 1998-11-11 日本電気株式会社 光結合回路及びその製造方法
JPH09311253A (ja) * 1996-05-20 1997-12-02 Fujitsu Ltd 光結合構造とその製造方法
EP0864893A3 (en) * 1997-03-13 1999-09-22 Nippon Telegraph and Telephone Corporation Packaging platform, optical module using the platform, and methods for producing the platform and the module
JPH11109184A (ja) * 1997-09-30 1999-04-23 Kyocera Corp 光デバイス実装用基板及び光モジュール
JP2000075153A (ja) * 1998-08-31 2000-03-14 Fujitsu Ltd 光学部品付基板及び光学装置の製造方法
JP2003512645A (ja) * 1999-10-21 2003-04-02 日本発条株式会社 位置合せマーカーを備えた光部品及びその製造方法
JP3557161B2 (ja) * 2000-08-22 2004-08-25 日本電信電話株式会社 光ハイブリッド集積モジュ−ル及びその製造方法並びに光ハイブリッド集積用光半導体素子及びその実装基板
US6744953B2 (en) * 2001-09-07 2004-06-01 Agilent Technologies, Inc. Planar optical waveguide with alignment structure
JP3855259B2 (ja) * 2001-09-21 2006-12-06 日立化成工業株式会社 光導波路デバイスの製造方法及び基板
WO2004008201A2 (en) * 2002-07-11 2004-01-22 Hymite A/S Accurate positioning of components of an optical assembly
WO2005066677A2 (en) * 2004-01-07 2005-07-21 Lambdy Crossing, Ltd. Improved accuracy fiducial marks for trench implementation in optical transceiver platforms
JP2007077566A (ja) 2005-03-16 2007-03-29 Koji Kato 体形補整用下着
JP4796884B2 (ja) * 2006-04-17 2011-10-19 日本電気株式会社 光導波路デバイスの製造方法
KR100757233B1 (ko) 2006-06-08 2007-09-10 한국전자통신연구원 광도파로 플랫폼 및 그 제조 방법
JP5186785B2 (ja) 2007-03-23 2013-04-24 日本電気株式会社 光導波路デバイス、光導波路デバイス用光素子実装システム、光素子実装方法、及びそのプログラム

Also Published As

Publication number Publication date
US20080304802A1 (en) 2008-12-11
CN101271175B (zh) 2013-01-30
TW200907443A (en) 2009-02-16
EP1972975B1 (en) 2011-07-06
KR100935740B1 (ko) 2010-01-06
JP2008241732A (ja) 2008-10-09
EP1972975A1 (en) 2008-09-24
CA2622272A1 (en) 2008-09-23
CN101271175A (zh) 2008-09-24
KR20080086831A (ko) 2008-09-26
US7881580B2 (en) 2011-02-01

Similar Documents

Publication Publication Date Title
JP2008241732A5 (enExample)
JP2008241732A (ja) 光導波路デバイスおよび光導波路デバイスの製造方法
JP5864929B2 (ja) インプリント装置および物品の製造方法
US8017424B2 (en) Dual-sided substrate measurement apparatus and methods
US20060018560A1 (en) Exposure device and exposure method
JP3324403B2 (ja) マスクとワークの位置合わせ方法および装置
JP2994968B2 (ja) マスクとワークの位置合わせ方法および装置
CN104076611B (zh) 用于光刻设备的拼接物镜成像测校方法
JP2006100590A (ja) 近接露光装置
JP4487688B2 (ja) ステップ式近接露光装置
JP2003037036A (ja) マスクとウエハの位置合わせ方法及び装置
JP4882354B2 (ja) アライメント調整方法、アライメントマークの形成方法、基材、及び透過型光学素子の製造方法
JP5166681B2 (ja) ステップ式近接露光装置
KR102333943B1 (ko) 노광장치, 스테이지 교정 시스템, 및 스테이지 교정방법
JP3345178B2 (ja) 露光における位置合わせ装置
JPH08339959A (ja) 位置合わせ方法
JP2007148310A (ja) マスク及びその加工方法
JP2004114066A (ja) レーザ加工装置
JP2007086684A (ja) 露光装置
KR20250125379A (ko) 진보된 패키징을 위한 인라인 계측과 온-툴 계측의 조합
TW202422204A (zh) 用於先進封裝的工具上計量方案
JP2007316537A (ja) ステップ式近接露光方法
JPH0982606A (ja) レチクルホルダ
JPH05283312A (ja) 位置合わせ装置
JP2006071483A (ja) 位置計測方法とその装置、デバイス製造方法及び露光装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091127

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110928

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111004

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121002

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121203

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130107

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160201

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees