JP5178733B2 - 粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法 - Google Patents
粘着剤、粘着シート、多層粘着シート及び電子部品の製造方法 Download PDFInfo
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- JP5178733B2 JP5178733B2 JP2009537798A JP2009537798A JP5178733B2 JP 5178733 B2 JP5178733 B2 JP 5178733B2 JP 2009537798 A JP2009537798 A JP 2009537798A JP 2009537798 A JP2009537798 A JP 2009537798A JP 5178733 B2 JP5178733 B2 JP 5178733B2
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- pressure
- sensitive adhesive
- adhesive sheet
- die attach
- mass
- Prior art date
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- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2887—Adhesive compositions including addition polymer from unsaturated monomer including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Description
101 シリコンウエハ
102 リングフレーム
103 粘着剤層
104 ダイシングブレード
105 ダイアタッチフィルム
106 基材フィルム
107 切り込み
108 ダイチップ
110 粘着シート
111 リードフレーム
本明細書において、単量体とは、いわゆる単量体そのもの、または単量体に由来する構造を意味する。本明細書の部及び%は、特に記載がない限り質量基準とする。本明細書において(メタ)アクリロイル基とはアクリロイル基及びメタアクリロイル基の総称である。(メタ)アクリル酸等の(メタ)を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。
図1は、本実施形態の多層粘着シートの構成を説明する断面図である。
本実施形態の多層粘着シート(ダイアタッチフィルム一体型シート)100は、図1(1)に示すように、基材フィルム106と、その基材フィルム106に後述する粘着剤を塗布してなる粘着剤層103と、その粘着剤層103上に積層されてなるダイアタッチフィルム105と、を備える。
粘着剤層103としては、アクリル重合体100質量部と、多官能イソシアネート硬化剤0.5質量部以上20質量部以下と、を含有する粘着剤を用いる。このとき、上記のアクリル重合体は、炭素数6以上12以下のアルキル基を有する(メタ)アクリル酸アルキルエステル単量体90質量部以上99.9質量部以下と、官能基含有単量体0.1質量部以上10質量部以下と、を配合してなる原料組成物から重合されてなるアクリル重合体を用いる。
基材フィルム106と、その基材フィルム106上に積層されてなる粘着剤層103と、からなる粘着シート110は、基材フィルム106上に粘着剤を塗布して製造する。基材フィルム106の厚さは30μm以上300μm以下が好ましく、60μm以上200μm以下がより好ましい。
ダイアタッチフィルム105は、粘着剤や接着剤をフィルム状に成形したものである。ダイアタッチフィルム105は、PET樹脂等からなる剥離用フィルム等に接着剤や粘着剤を積層した状態で市販されており、接着剤や粘着剤を粘着シートに転写することができる。
粘着シート110の粘着剤塗布面にダイアタッチフィルム105を貼り付け、多層粘着シート100とする。多層粘着シート100をダイアタッチフィルム105一体型シートとして電子部品の製造に使用する場合には、ダイアタッチフィルム105と粘着シート110の間の粘着強度を0.05N/20mm以上0.9N/20mm以下となるようにアクリル粘着剤と多官能イソシアネート硬化剤の割合を調整することが好ましい。ダイアタッチフィルム105と粘着シート110の間の粘着強度が0.9N/20mm以下であるとピックアップ不良の発生が抑制され、粘着力が0.05N/20mm以上であるとチップ保持が向上すると同時に、粘着シート110とリングフレーム102が剥離し難くなる利点がある。
本実施形態の多層粘着シート100を使用した電子部品の製造方法は特に限定されないが、例えば図1に示す下記の手順が挙げられる。
(1)シリコンウエハ101を多層粘着シート100に貼付けて固定し、さらに多層粘着シート100をリングフレーム102に固定する。
(2)ダイシングブレード104でシリコンウエハ101をダイシングする。
(3)多層粘着シート100を放射状に拡大してダイチップ108間隔を広げた後、ダイチップ108をニードル等(不図示)で突き上げる。そして、真空コレツト又はエアピンセット等(不図示)でダイチップ108を吸着し、粘着剤層103とダイアタッチフィルム105との間で剥離し、ダイアタッチフィルム105が付着したダイチップ108をピックアップする。
(4)ダイアタッチフィルム105が付着したダイチップ108をリードフレーム111又は回路基板上に搭載(マウント)する。そして、ダイアタッチフィルム105を加熱し、ダイチップ108とリードフレーム111又は回路基板とを加熱接着する。最後に、リードフレーム111又は回路基板に搭載したダイチップ108を樹脂(不図示)でモールドする。
以下、本実施形態の多層粘着シート(ダイアタッチフィルム一体型シート)100の作用効果について図1を参照しながら説明する。
アクリル重合体A:2−エチルヘキシルアクリレート95%、2−ヒドロキシエチルアクリレート5%の配合からなる原料組成物を共重合させてなる共重合体(アクリル重合体A)を含む合成品を得た。アクリル重合体Aのガラス転移点は、−67.8℃であった。
アクリル重合体B:2−エチルヘキシルアクリレート90%、2−ヒドロキシエチルアクリレート10%の配合からなる原料組成物を共重合させてなる共重合体(アクリル重合体B)を含む合成品を得た。アクリル重合体Bのガラス転移点は、−65.6℃であった。
アクリル重合体C:2−エチルヘキシルアクリレート99.9%、2−ヒドロキシエチルアクリレート0.1%の配合からなる原料組成物を共重合させてなる共重合体(アクリル重合体C)を含む合成品を得た。アクリル重合体Cのガラス転移点は、−69.9℃であった。
アクリル重合体D:ブチルアクリレート95%、2−ヒドロキシエチルアクリレート5%の配合からなる原料組成物を共重合させてなる共重合体(アクリル重合体D)を含む合成品を得た。アクリル重合体Dのガラス転移点は、−53.3℃であった。
多官能イソシアネート硬化剤:2,4−トリレンジイソシアネートのトリメチロールプロパンアダクト体からなる市販品(日本ポリウレタン社製、製品名コロネートL−45E)を用いた。
(メタ)アクリロイル基を1個有する化合物:2−エチルヘキシルアクリレートからなる市販品(東亞合成社製、製品名アクリル酸エステルHA)を用いた。
ダイアタッチフィルム:ポリイミド接着剤を主体とし、厚さ30μmからなる市販品を用いた。
電子部品の製造には、ダミーの回路パターンを形成した直径6インチ×厚さ0.4mmのシリコンウエハを用いた。シリコンウエハをダイアタッチフィルム上に設置した。
粘着シートへの切り込み量は30μmとした。ダイシングは10mm×10mmのチップサイズで行った。ダイシング装置はDISCO社製 DAD341を用いた。ダイシングブレードはDISCO社製NBC−ZH205O−27HEEEを用いた。
ダイシングブレード形状:外径55.56mm、刃幅35μm、内径19.05mm
ダイシングブレード回転数:40,000rpm
ダイシングブレード送り速度:80mm/秒
切削水温度:25℃
切削水量:1.0L/分
多層粘着シートを用いてシリコンウエハをダイシングした後、エキスパンド装置を用いてエキスパンドを行った。
エキスパンド装置:HUGLE社製ELECTRONICS HS−1800型
引き落とし量:20mm
引き落とし速度:20mm/秒
加温条件:40℃×1分
1.多層粘着シートの粘着力:多層粘着シートを予め80℃に加温したシリコンウエハ上に貼り合せ、2kgロ−ラの1往復で圧着し、圧着1日後に粘着シートとダイアタッチフィルムの界面を剥離した。
剥離方法:180°ピ−ル
引張り速度:300mm/分
◎(優):チップ飛びが5%未満。
○(良):チップ飛びが5%以上10%未満。
×(不可):チップ飛びが10%以上。
◎(優):95%以上のチップがピックアップできた。
○(良):80%以上95%未満のチップがピックアップできた。
×(不可):80%未満のチップがピックアップできた。
表1〜表3に示した実験結果からわかるように、この多層粘着シート(ダイアタッチフィルム一体型シート)によれば、特定の組成の粘着剤を用いるため、ダイシング時のチップ保持性に優れ、ダイシング時にリングフレームから多層粘着シートが外れにくく、ピックアップ作業時にダイアタッチフィルムと粘着剤層との剥離が容易である。
Claims (4)
- アクリル重合体100質量部と、多官能イソシアネート硬化剤0.5質量部以上20質量部以下と、を含有する粘着剤であって、
該アクリル重合体が、炭素数6以上12以下のアルキル基を有する(メタ)アクリル酸アルキルエステル単量体90質量部以上99.9質量部以下と、官能基としてヒドロキシル基を有する単量体0.1質量部以上10質量部以下と、を配合してなる原料組成物から重合されてなり、2−エチルヘキシルアクリレートをさらに含有し、粘着力が0.05N/20mm以上0.5N/20mm以下である、粘着剤。 - 基材フィルムと、該基材フィルムに請求項1記載の粘着剤を塗布してなる粘着剤層と、を備える、粘着シート。
- 請求項2記載の粘着シートと、該粘着シートの前記粘着剤層側に積層されてなるダイアタッチフィルムと、を備える、多層粘着シート。
- ウエハをダイシングして得られる電子部品の製造方法であって、
請求項3に記載の多層粘着シートの前記ダイアタッチフィルム表面に該ウエハを貼り合わせる工程と、
該多層粘着シートに貼り合わされた状態で、該ウエハのダイシングを行う工程と、
該ダイシング後に、該ダイアタッチフィルムおよび前記粘着剤層とを剥離することによって、該ウエハおよび該ウエハの裏面に付着しているダイアタッチフィルムを併せてピックアップする工程と、を含む、電子部品の製造方法。
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CN102640277A (zh) * | 2009-11-30 | 2012-08-15 | 电气化学工业株式会社 | 粘合片及电子部件 |
US8507322B2 (en) * | 2010-06-24 | 2013-08-13 | Akihiro Chida | Semiconductor substrate and method for manufacturing semiconductor device |
JP2012248916A (ja) * | 2011-05-25 | 2012-12-13 | Taiyo Yuden Co Ltd | 弾性波デバイスの製造方法 |
US9484260B2 (en) * | 2012-11-07 | 2016-11-01 | Semiconductor Components Industries, Llc | Heated carrier substrate semiconductor die singulation method |
US9136173B2 (en) * | 2012-11-07 | 2015-09-15 | Semiconductor Components Industries, Llc | Singulation method for semiconductor die having a layer of material along one major surface |
KR102116987B1 (ko) * | 2013-10-15 | 2020-05-29 | 삼성전자 주식회사 | 반도체 패키지 |
US10373869B2 (en) | 2017-05-24 | 2019-08-06 | Semiconductor Components Industries, Llc | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus |
JP7417369B2 (ja) * | 2019-05-28 | 2024-01-18 | 日東電工株式会社 | ダイシングダイボンドフィルム |
CN110218528A (zh) * | 2019-07-05 | 2019-09-10 | 北京理工大学 | 一种半导体封装用uv固化胶及其制备方法 |
TWI724765B (zh) * | 2020-01-21 | 2021-04-11 | 達興材料股份有限公司 | 可雷射離型的組成物、其積層體和雷射離型方法 |
TWI753825B (zh) * | 2021-05-11 | 2022-01-21 | 財團法人工業技術研究院 | 微型元件結構及顯示裝置 |
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TW200918628A (en) | 2009-05-01 |
CN101861369A (zh) | 2010-10-13 |
KR101358480B1 (ko) | 2014-02-05 |
KR20100100786A (ko) | 2010-09-15 |
US20100240196A1 (en) | 2010-09-23 |
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WO2009050786A1 (ja) | 2009-04-23 |
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