JP5164239B2 - 銀粒子粉末、その分散液および銀焼成膜の製造法 - Google Patents

銀粒子粉末、その分散液および銀焼成膜の製造法 Download PDF

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Publication number
JP5164239B2
JP5164239B2 JP2006261526A JP2006261526A JP5164239B2 JP 5164239 B2 JP5164239 B2 JP 5164239B2 JP 2006261526 A JP2006261526 A JP 2006261526A JP 2006261526 A JP2006261526 A JP 2006261526A JP 5164239 B2 JP5164239 B2 JP 5164239B2
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JP
Japan
Prior art keywords
silver
particle powder
silver particle
film
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006261526A
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English (en)
Japanese (ja)
Other versions
JP2008084620A (ja
Inventor
孝造 尾木
卓 岡野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority to JP2006261526A priority Critical patent/JP5164239B2/ja
Priority to TW096133008A priority patent/TW200815123A/zh
Priority to CN2007800359239A priority patent/CN101516551B/zh
Priority to KR1020097006148A priority patent/KR101387374B1/ko
Priority to PCT/JP2007/068026 priority patent/WO2008038534A1/ja
Priority to US12/311,289 priority patent/US20090236567A1/en
Priority to EP07807430.9A priority patent/EP2067550B1/en
Publication of JP2008084620A publication Critical patent/JP2008084620A/ja
Application granted granted Critical
Publication of JP5164239B2 publication Critical patent/JP5164239B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2006261526A 2006-09-26 2006-09-26 銀粒子粉末、その分散液および銀焼成膜の製造法 Expired - Fee Related JP5164239B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006261526A JP5164239B2 (ja) 2006-09-26 2006-09-26 銀粒子粉末、その分散液および銀焼成膜の製造法
TW096133008A TW200815123A (en) 2006-09-26 2007-09-05 Silver particle powder and process therefor
KR1020097006148A KR101387374B1 (ko) 2006-09-26 2007-09-11 은 입자 분말 및 이의 제조법
PCT/JP2007/068026 WO2008038534A1 (fr) 2006-09-26 2007-09-11 Poudre de microparticules d'argent et son procédé de production
CN2007800359239A CN101516551B (zh) 2006-09-26 2007-09-11 银粒子粉末的分散液及其制造方法和银烧成膜及其制造方法
US12/311,289 US20090236567A1 (en) 2006-09-26 2007-09-11 Silver particle powder and process for production thereof
EP07807430.9A EP2067550B1 (en) 2006-09-26 2007-09-11 Silver microparticle powder and method for production thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006261526A JP5164239B2 (ja) 2006-09-26 2006-09-26 銀粒子粉末、その分散液および銀焼成膜の製造法

Publications (2)

Publication Number Publication Date
JP2008084620A JP2008084620A (ja) 2008-04-10
JP5164239B2 true JP5164239B2 (ja) 2013-03-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006261526A Expired - Fee Related JP5164239B2 (ja) 2006-09-26 2006-09-26 銀粒子粉末、その分散液および銀焼成膜の製造法

Country Status (7)

Country Link
US (1) US20090236567A1 (enExample)
EP (1) EP2067550B1 (enExample)
JP (1) JP5164239B2 (enExample)
KR (1) KR101387374B1 (enExample)
CN (1) CN101516551B (enExample)
TW (1) TW200815123A (enExample)
WO (1) WO2008038534A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

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JP5232016B2 (ja) * 2007-01-09 2013-07-10 Ｄｏｗａエレクトロニクス株式会社 配線形成用材料
JP5252843B2 (ja) * 2007-01-09 2013-07-31 Ｄｏｗａエレクトロニクス株式会社 銀インクおよびその製法
JP5191844B2 (ja) * 2008-09-10 2013-05-08 国立大学法人東北大学 水溶媒分散性銀微粉の製造方法
US20100233361A1 (en) 2009-03-12 2010-09-16 Xerox Corporation Metal nanoparticle composition with improved adhesion
JP5215914B2 (ja) * 2009-03-19 2013-06-19 三ツ星ベルト株式会社 抵抗体膜の製造方法、抵抗体膜、及び抵抗器
JP5574761B2 (ja) 2009-04-17 2014-08-20 国立大学法人山形大学 被覆銀超微粒子とその製造方法
JP2010287434A (ja) * 2009-06-11 2010-12-24 Dowa Electronics Materials Co Ltd 銀導電膜付き基板およびその製造方法
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JP5811314B2 (ja) * 2010-06-16 2015-11-11 国立研究開発法人物質・材料研究機構 金属ナノ粒子ペースト、並びに金属ナノ粒子ペーストを用いた電子部品接合体、ｌｅｄモジュール及びプリント配線板の回路形成方法
CN101920340B (zh) * 2010-08-20 2012-01-11 山东省科学院新材料研究所 一种大批量制备超细球形银粉的方法
US20120070570A1 (en) * 2010-09-16 2012-03-22 Xerox Corporation Conductive thick metal electrode forming method
DE102010042702A1 (de) * 2010-10-20 2012-04-26 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
WO2012098643A1 (ja) * 2011-01-18 2012-07-26 Ｄｏｗａエレクトロニクス株式会社 金属粒子粉末およびそれを用いたペースト組成物
JP6241908B2 (ja) 2011-02-04 2017-12-06 国立大学法人山形大学 被覆金属微粒子とその製造方法
JP5741809B2 (ja) * 2011-02-22 2015-07-01 三菱マテリアル株式会社 接合用ペースト、および半導体素子と基板の接合方法
JP5778494B2 (ja) * 2011-06-16 2015-09-16 株式会社アルバック 金属微粒子分散液及びその製造方法
CN104884193B (zh) 2012-08-30 2017-03-08 康宁股份有限公司 不含溶剂的银合成及由此制备的银产物
EP2890822A1 (en) 2012-08-31 2015-07-08 Corning Incorporated Low-temperature dispersion-based syntheses of silver and silver products produced thereby
CN104755639B (zh) 2012-08-31 2017-12-15 康宁股份有限公司 银回收方法和由此制备的银产物
JP5960568B2 (ja) * 2012-10-01 2016-08-02 Ｄｏｗａエレクトロニクス株式会社 銀微粒子の製造方法
JP6099472B2 (ja) * 2013-04-26 2017-03-22 Ｄｏｗａエレクトロニクス株式会社 金属ナノ粒子分散体、金属ナノ粒子分散体の製造方法および接合方法
KR101515137B1 (ko) * 2013-11-08 2015-04-24 한국기초과학지원연구원 은 나노입자의 제조방법 및 이를 이용하여 제조된 소수성 구형 은 나노입자
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP6263146B2 (ja) * 2015-04-06 2018-01-17 株式会社ノリタケカンパニーリミテド 導電膜付基板、その製造方法、およびポリイミド基板用導電性ペースト
JP6220966B2 (ja) * 2015-04-17 2017-10-25 バンドー化学株式会社 銀微粒子組成物
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10941304B2 (en) 2016-04-04 2021-03-09 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material
US11634596B2 (en) 2016-04-04 2023-04-25 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material
US12125607B2 (en) 2016-04-04 2024-10-22 Nichia Corporation Metal powder sintering paste and method of producing the same, and method of producing conductive material

Also Published As

Publication number Publication date
TWI342245B (enExample) 2011-05-21
US20090236567A1 (en) 2009-09-24
CN101516551A (zh) 2009-08-26
TW200815123A (en) 2008-04-01
KR20090061016A (ko) 2009-06-15
WO2008038534A1 (fr) 2008-04-03
EP2067550A4 (en) 2012-07-25
KR101387374B1 (ko) 2014-04-22
EP2067550B1 (en) 2016-12-21
CN101516551B (zh) 2011-12-14
JP2008084620A (ja) 2008-04-10
EP2067550A1 (en) 2009-06-10

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